UJA1079ATW/3V3/WD, NXP Semiconductors, UJA1079ATW/3V3/WD, Datasheet - Page 3

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UJA1079ATW/3V3/WD,

Manufacturer Part Number
UJA1079ATW/3V3/WD,
Description
IC SBC LIN 3.3V 32HTSSOP
Manufacturer
NXP Semiconductors
Datasheet

Specifications of UJA1079ATW/3V3/WD,

Controller Type
System Basis Chip
Interface
SPI
Voltage - Supply
4.5 V ~ 28 V
Current - Supply
75µA
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
32-TSSOP Exposed Pad, 32-eTSSOP, 32-HTSSOP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
NXP Semiconductors
3. Ordering information
Table 1.
[1]
UJA1079A
Product data sheet
Type number
UJA1079ATW/5V0/WD
UJA1079ATW/3V3/WD
UJA1079ATW/5V0
UJA1079ATW/3V3
contain a watchdog.
UJA1079ATW/5V0xx versions contain a 5 V regulator (V1); UJA1079ATW/3V3xx versions contain a 3.3 V regulator (V1); WD versions
Ordering information
[1]
2.5 Voltage regulator V1
Package
Name
HTSSOP32
16-bit Serial Peripheral Interface (SPI) for configuration, control and diagnosis
Global enable output for controlling safety-critical hardware
Limp home output (LIMP) for activating application-specific ‘limp home’ hardware in
the event of a serious system malfunction
Overtemperature shutdown
Interrupt output pin; interrupts can be individually configured to signal V1 undervoltage,
LIN/local wake-up and cyclic and power-on interrupt events
Bidirectional reset pin with variable power-on reset length to support a variety of
microcontrollers
Software-initiated system reset
Scalable voltage regulator for the microcontroller, its peripherals and additional
external transceivers
±2 % accuracy
3.3 V and 5 V versions available
Delivers up to 250 mA and can be combined with an external PNP transistor for better
heat distribution over the PCB
Selectable current threshold at which the external PNP transistor starts to deliver
current
Undervoltage warning at 90 % of nominal output voltage and undervoltage reset at
90 % or 70 % of nominal output voltage
Can operate at V
ISO 7637 pulse 4/4b and ISO16750-2
Stable output under all conditions
Window, Timeout (with optional cyclic wake-up) and Off modes supported (with
automatic re-enable in the event of an interrupt)
All information provided in this document is subject to legal disclaimers.
Description
plastic thermal enhanced thin shrink small outline package;
32 leads; body width 6.1 mm; lead pitch 0.65 mm; exposed die
pad
BAT
Rev. 2 — 31 January 2011
voltages down to 4.5 V (e.g. during cranking), in accordance with
LIN core system basis chip
UJA1079A
© NXP B.V. 2011. All rights reserved.
Version
SOT549-1
3 of 46

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