PIMN31,115 NXP Semiconductors, PIMN31,115 Datasheet

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PIMN31 500 mA NPN/NPN double resistor-equipped transistor Rev. 01 — 19 June 2007 1. Product profile 1.1 General description 500 mA NPN/NPN double Resistor-Equipped Transistor (RET) in ...

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... NXP Semiconductors 2. Pinning information Table 2. Pin Ordering information Table 3. Type number Package PIMN31 4. Marking Table 4. Type number PIMN31 5. Limiting values Table 5. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Per transistor V CBO V CEO V EBO tot PIMN31_1 Product data sheet 500 mA NPN/NPN double RET ...

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... NXP Semiconductors Table 5. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Per device P tot amb T stg [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. Fig 1. Power derating curve 6. Thermal characteristics Table 6. Symbol Per transistor ...

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... NXP Semiconductors th(j-a) 0.75 (K/W) 0.50 0. 0.20 0.10 0.05 0. FR4 PCB, standard footprint Fig 2. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT457 (SC-74); typical values 7. Characteristics Table unless otherwise specified. amb Symbol Per transistor ...

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... NXP Semiconductors ( 100 C amb ( amb ( amb Fig 3. DC current gain as a function of collector current; typical values ( 100 C amb ( amb ( amb Fig 5. Collector-emitter saturation voltage as a function of collector current; typical values PIMN31_1 Product data sheet 500 mA NPN/NPN double RET 006aaa314 10 (1) (2) V (3) ...

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... NXP Semiconductors 10 V I(on) (V) 1 (1) ( amb ( amb ( 100 C amb Fig 6. On-state input voltage as a function of collector current; typical values 8. Test information 8.1 Quality information This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q101 (Stress qualification for discrete semiconductors) and is suitable for use in automotive critical applications ...

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... NXP Semiconductors 9. Package outline Fig 8. Package outline SOT457 (SC-74) 10. Packing information Table 8. The indicated -xxx are the last three digits of the 12NC ordering code. Type number Package PIMN31 [1] For further information and the availability of packing methods, see [2] T1: normal taping [3] T2: reverse taping ...

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... NXP Semiconductors 11. Soldering Fig 9. Reflow soldering footprint SOT457 (SC-74) 5.05 Fig 10. Wave soldering footprint SOT457 (SC-74) PIMN31_1 Product data sheet 500 mA NPN/NPN double RET 3.45 1.95 0.95 3.30 2.825 1.60 1.70 3.10 3.20 Dimensions in mm 5.30 1.40 4.30 Dimensions in mm Rev. 01 — ...

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... NXP Semiconductors 12. Revision history Table 9. Revision history Document ID Release date PIMN31_1 20070619 PIMN31_1 Product data sheet 500 mA NPN/NPN double RET Data sheet status Change notice Product data sheet - Rev. 01 — 19 June 2007 PIMN31 Supersedes - © NXP B.V. 2007. All rights reserved. ...

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... For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail ...

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... NXP Semiconductors 15. Contents 1 Product profi 1.1 General description 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 8 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 6 8.1 Quality information . . . . . . . . . . . . . . . . . . . . . . 6 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7 10 Packing information Soldering ...