IES5502T Hendon Semiconductors, IES5502T Datasheet
IES5502T
Specifications of IES5502T
Related parts for IES5502T
IES5502T Summary of contents
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... SCL-B 3 Backplane Side SDA SDA-B 6 © 2011 Hendon Semiconductors Pty. Ltd. , all rights reserved. 2011 Jan 14, Revision 1.5 Fast Dual Bi-Directional Bus Buffer 3 GENERAL DESCRIPTION The IES5502 is a monolithic bipolar integrated circuit for bus buffering in applications including I PMbus, and other systems based on similar principles.It ...
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PINNING INFORMATION 5.1 Pinning layout CL-C IES5502 3 S CL-B 4 GND Fig.2 Pinning diagram (SO8) 6 FUNCTIONAL DESCRIPTION 6 GND - DC supply pins CC The IES5502 can be driven from voltage ...
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Ready (RDY) - Buffer Connected Indicator The ready output (RDY) indicates that the buffer has met it’s enable conditions, and that communication will now occur. This is an open-collector transistor which is switched off when ready, allowing the voltage ...
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SYMBOL PARAMETER Buffer Ports V Bus voltage Sxx-x V Input low threshold voltage TL I Input low current IL I Output low sink current OL V Input-output offset voltage OFFSET (V = 3.3V Leakage current LEAK Enable V ...
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V Sxx(in) 120 3. (kΩ) PULLUP Fig.4 Offset Voltage, Vout - Vin 2011 Jan 14, Revision 1.5 Fast Dual Bi-Directional Bus Buffer V Sxx ...
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APPLICATION INFORMATION 9.1 Design Considerations Figure 6 shows a typical application for the IES5502. The IC can level shift between various bus voltages, without the need for additional external components. Higher bus voltages and currents outside the range of ...
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Application circuits 1. 600 600 V CC SCL SDA Bus Master 400kHz U1 R3 1.1k R5 600 2011 Jan 14, Revision 1.5 Fast Dual Bi-Directional Bus Buffer 3.3V 15V 15V C1 0.01µ 18k 3.9k 3.9k ...
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Fully-Bused Compliant Plug-in (Hot-Insert) ShMC Module (eg. AMC RRA* µP IES5502 Vin Vol=Vin+0.08 * RRA = Rise Rate Accelerator ALTERNATE IMPLEMENTATIONS µP I2C Bus NOTES: 1) The system shown here uses FET switches, however a valid alternative is ...
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... TYPE NUMBER NAME IES5502T SO8 plastic small outline package; 8 leads; body width 3.9 mm supplied in tube IES5502TR SO8 plastic small outline package; 8 leads; body width 3.9 mm supplied in tape and reel IES5502D MSOP-8L micro small outline package; 8 leads; body width 3.0 mm supplied in tube IES5502DR MSOP-8L micro small outline package ...
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... Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given advisory and does not form part of the specification. 14 COMPANY INFORMATION HENDON SEMICONDUCTORS PTY. LTD. ABN 17 080 879 616 Postal address: Hendon Semiconductors PO Box 2226 ...
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... DISCLAIMER Hendon Semiconductors Pty. Ltd. ABN 17 080 879 616 (“Hendon”) reserves the right to make changes to both its products and product data without notice. Hendon makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Hendon assume any liability arising out of the use or application of any Hendon product. Hendon specifically disclaims any and all liability, including without limitation incidental or consequential damages ...