PCA9507DP,118 NXP Semiconductors, PCA9507DP,118 Datasheet
PCA9507DP,118
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PCA9507DP,118 Summary of contents
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PCA9507 2-wire serial bus extender for HDMI DDC I Rev. 01 — 7 February 2008 1. General description The PCA9507 is a 2-wire serial bus extender providing 3 level shift that allows meters ...
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... NXP Semiconductors C-bus, SMBus and DDC-bus compatible I Active HIGH buffer enable input I Open-drain input/outputs I Lock-up free operation I Supports arbitration and clock stretching across the repeater I Accommodates Standard-mode and Fast-mode I I Powered-off high-impedance I I Port A operating supply voltage range Port B operating supply voltage range of 2 5.5 V ...
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... NXP Semiconductors 5. Pinning information 5.1 Pinning V Fig 2. 5.2 Pin description Table 2. Symbol V CC(A) SCLA SDAA GND EN SDAB SCLB V CC(B) 6. Functional description Refer to The PCA9507 consists of a pair of bidirectional open-drain I/Os specifically designed to support up-translation/down-translation between low voltages (as low as 2.7 V) and a 3 ...
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... NXP Semiconductors Fig 4. When port B falls first and goes below 0.3V pulls down port A falls below 0.3V about 0.5 V. Port B falls below 0.4 V because it is not possible to know who is driving the port A LOW, so the PCA9507 direction control assumes that port A is controlling the part unless port B falls below 0 ...
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... NXP Semiconductors 6.3 Resistor pull-up value selection 6.3.1 Port A (SDAA and SCLA) SDAA and SCLA are open-drain I/O that have rise time accelerators and strong pull-down. When the inputs transition above 0.3V the pull-up current during rising edge to meet the I device drives a long cable or heavier capacitance load. The strong pull-down enables the output to drive to nearly zero voltage for logic LOW. The selection for pull-up resistors are defi ...
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... NXP Semiconductors 6.3.2 Port B (SDAB and SCLB) SDAB and SCLB are standard I accelerator. The static level offset produces an output LOW of 0.5 V (typical mA. As with the standard I levels. The size of these pull-up resistors depends on the system requirement, and should meet the current sinking capability of the device that drives the buffer, as well as that of the buffer. The minimum and maximum pull-up resistors are determined and the pull-up resistor’ ...
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... NXP Semiconductors 7. Application design-in information A typical application is shown 3 Master devices can be placed on either bus. HDMI DDC applications for DVD/R and LCD TV are shown in transmitter or receiver is 3.3 V, while the DDC line PCA9507 behaves like a voltage level shift, a buffer and long cable bus extender to ensure signal integrity for accessing the EDID on the DDC line ...
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... NXP Semiconductors According C-bus, a comparator detects the falling edge when it goes below 0.3V the internal driver on port B to turn on, causing port B to pull down to about 0.5 V. When port B of the PCA9507 falls, first a CMOS hysteresis type input detects the falling edge and causes the internal driver on port A to turn on and pull the port A pin down to ground ...
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... NXP Semiconductors Fig SDAA SDA SCLA SCL BUS PCA9507 MASTER EN Fig 10. Typical series application PCA9507_1 Product data sheet 2-wire serial bus extender for HDMI DDC I V CC( SDA SCL BUS MASTER Typical star application SDAB SDAA SDAB SCLB SCLA SCLB PCA9507 EN Rev. 01 — 7 February 2008 ...
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... NXP Semiconductors SCLA SDAA Fig 11. Bus A (2 5.5 V bus) waveform SCLB SDAB Fig 12. Bus B (2 5.5 V) waveform 8. Limiting values Table 4. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol V CC(B) V CC(A) V I tot T stg T amb T j PCA9507_1 Product data sheet ...
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... NXP Semiconductors 9. Static characteristics Table 5. Static characteristics 5.5 V; GND = Symbol Parameter Supplies V supply voltage port B CC(B) V supply voltage port A CC(A) I supply current on pin V CC(VCC(A)) I port B HIGH-level supply current CCH(B) I port B LOW-level supply current CCL(B) I port A LOW-level supply current CCL(A) I contention port B supply current ...
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... NXP Semiconductors Table 5. Static characteristics 5.5 V; GND = Symbol Parameter Enable V LOW-level input voltage IL V HIGH-level input voltage IH I LOW-level input current on pin IL(EN input leakage current LI C input capacitance i [1] LOW-level supply voltage. [2] V specification is for the first LOW level seen by the SDAB/SCLB lines SDAB/SCLB lines ...
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... NXP Semiconductors 10.1 AC waveforms input 0.3V CC(B) t PHL 80 % 0.3V 0.3V output CC( THL Fig 13. Propagation delay and transition times; port B to port A Fig 15. Propagation delay 11. Test information Fig 16. Test circuit for open-drain outputs PCA9507_1 Product data sheet 2-wire serial bus extender for HDMI DDC I ...
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... NXP Semiconductors 12. Package outline SO8: plastic small outline package; 8 leads; body width 3 pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. 0.25 1.45 mm 1.75 0.25 0.10 1.25 0.010 0.057 inches 0.069 0.01 0.004 0.049 Notes 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. ...
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... NXP Semiconductors TSSOP8: plastic thin shrink small outline package; 8 leads; body width pin 1 index 1 e DIMENSIONS (mm are the original dimensions UNIT max. 0.15 0.95 mm 1.1 0.25 0.05 0.80 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. ...
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... NXP Semiconductors 13. Soldering of SMD packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “Surface mount reflow soldering description” . 13.1 Introduction to soldering Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits ...
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... NXP Semiconductors 13.4 Reflow soldering Key characteristics in reflow soldering are: • Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see reducing the process window • Solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board • ...
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... NXP Semiconductors Fig 19. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description” . 14. Abbreviations Table 9. Acronym CDM CMOS DDC DVD EDID ESD HBM HDMI 2 I C-bus LCD ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 18. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 5 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 5.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 5.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 Functional description . . . . . . . . . . . . . . . . . . . 3 6.1 Enable 6.2 Rise time accelerators . . . . . . . . . . . . . . . . . . . 4 6.3 Resistor pull-up value selection . . . . . . . . . . . . 5 6.3.1 Port A (SDAA and SCLA 6.3.2 Port B (SDAB and SCLB) ...