LPC2132FBD64/01,11 NXP Semiconductors, LPC2132FBD64/01,11 Datasheet - Page 36

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LPC2132FBD64/01,11

Manufacturer Part Number
LPC2132FBD64/01,11
Description
IC ARM7 MCU FLASH 64K 64-LQFP
Manufacturer
NXP Semiconductors
Series
LPC2100r
Datasheet

Specifications of LPC2132FBD64/01,11

Core Processor
ARM7
Core Size
16/32-Bit
Speed
60MHz
Connectivity
I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
47
Program Memory Size
64KB (64K x 8)
Program Memory Type
FLASH
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 1x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-LQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
LPC2132FBD64/01,11
Manufacturer:
NXP Semiconductors
Quantity:
10 000
NXP Semiconductors
12. Application information
LPC2131_32_34_36_38
Product data sheet
12.1 Crystal oscillator XTAL input and component selection
The input voltage to the on-chip oscillators is limited to 1.8 V. If the oscillator is driven by a
clock in slave mode, it is recommended that the input be coupled through a capacitor with
C
capacitor to ground C
slave mode, a minimum of 200 mV (RMS) is needed.
In slave mode the input clock signal should be coupled by means of a capacitor of 100 pF
(Figure
corresponds to a square wave signal with a signal swing of between 280 mV and 1.4 V.
The XTALOUT pin in this configuration can be left unconnected.
External components and models used in oscillation mode are shown in
Table 10
and the capacitances C
fundamental mode oscillation (the fundamental frequency is represented by L, C
R
not be larger than 7 pF. Parameters F
manufacturer.
Fig 13. Slave mode operation of the on-chip oscillator
i
S
= 100 pF. To limit the input voltage to the specified range, choose an additional
). Capacitance C
13), with an amplitude between 200 mV (RMS) and 1000 mV (RMS). This
and
Table
All information provided in this document is subject to legal disclaimers.
P
11. Since the feedback resistance is integrated on chip, only a crystal
in
g
Rev. 5 — 2 February 2011
which attenuates the input voltage by a factor C
Figure 14
X1
and C
X2
represents the parallel package capacitance and should
need to be connected externally in case of
OSC
XTAL1
C i
100 pF
LPC2xxx
, C
L
, R
LPC2131/32/34/36/38
S
002aae718
Single-chip 16/32-bit microcontrollers
C g
and C
P
are supplied by the crystal
i
© NXP B.V. 2011. All rights reserved.
/ (C
Figure 14
i
+ C
g
L
). In
and
and in
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