STM32F101TBU6 STMicroelectronics, STM32F101TBU6 Datasheet - Page 82

• Manufacturer Part Number: STM32F101TBU6
• Description: IC ARM CORTEX MCU 128KB 36VFQFPN
• Manufacturer: STMicroelectronics
• Series: STM32r

Specifications of STM32F101TBU6

• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 36MHz
• Connectivity: I²C, IrDA, LIN, SPI, UART/USART
• Peripherals: DMA, PDR, POR, PVD, PWM, Temp Sensor, WDT
• Number Of I /o: 26
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 3.6 V
• Data Converters: A/D 10x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 36-VFQFN Exposed Pad
• Core: ARM Cortex M3
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

Revision history
82/87
Table 54.
22-Nov-2007
Date
Document revision history (continued)
Revision
4
Document status promoted from preliminary data to datasheet. Small
text changes.
STM32F101CB part number corrected in
Number of communication peripherals corrected for STM32F101Tx in
Table 2: Device features and peripheral counts (STM32F101xx medium-
density access line)
Power supply schemes on page 16
Main function and default alternate function modified for PC14 and PC15
in
Remap column added.
Figure 11: Power supply scheme
and
in
Note 2
characteristics.
48 and 72 MHz frequencies removed from
Table
consumption on page
I
added in
and Standby
on page
Figure 17: Typical current consumption in Stop mode with regulator in
Low-power mode versus temperature at VDD = 3.3 V and 3.6 V
Note removed below
CPHA =
mode and CPHA =
Figure 34: Typical connection diagram using the ADC
t
respectively. Maximum values removed from
wakeup
endurance and data
characteristics.
Impedance size specified in
page
Section 5.3.11: Absolute maximum ratings (electrical sensitivity)
updated.
Details on unused pins removed from
characteristics on page
Table 41: SPI characteristics
Table 42: ADC
Note 3
conditions. Avg_Slope and V
Θ
characteristics.
Order codes replaced by
DD_VBAT
SU(HSE)
JA
Table 4: Medium-density STM32F101xx pin
Table 6: Current
value for VFQFPN36 package added in
Note 1
Doc ID 13586 Rev 14
71. Small text changes in
14. MCU ‘s operating conditions modified in
added in
and
timings. t
and t
42.
0. Note added below
typical value at 2.4 V modified and I
Table 15: Typical and maximum current consumptions in Stop
modified in
Note 2
Table 18: Peripheral current consumption
modes. Note added in
SU(LSE)
characteristics. Note added in
I2C interface characteristics on page 60
Table 10: Embedded reset and power control block
RET
characteristics.
added below
1(1).
and Number of GPIOs corrected for LQFP package.
retention. Conditions modified in
Figure 30: SPI timing diagram - slave mode and
conditions modified in
conditions modified in
41.
Table 5: Voltage
54.
Section 7: Ordering information
A.4: Voltage glitch on ADC input 0 on
25
updated. Notes added and I
Figure 31: SPI timing diagram - slave
Changes
modified in
Table 35: Output voltage
Table 44: ADC accuracy - limited test
modified. V
modified.
Table 16 on page 41
General input/output
STM32F101x8, STM32F101xB
characteristics.
Table 1: Device
Table
Table 46: TS
Table 52: Package thermal
Table 21
Table 28: Flash memory
DD
Table 25: Low-power mode
DD_VBAT
Table 43
definitions,
− V
12,
Typical current
SS
Table 13
and
Table 29: EMS
maximum value
modified.
modified.
ratings modified
and
Note 1
modified.
characteristics.
characteristics.
lkg
and
scheme.
Table
summary.
Note 6
Table
removed in
Table 17
and
modified
22,
added.
added,
46.