MPC8533EVTALFA Freescale Semiconductor, MPC8533EVTALFA Datasheet - Page 95

• Manufacturer Part Number: MPC8533EVTALFA
• Description: MPU POWERQUICC 783-PBGA
• Manufacturer: Freescale Semiconductor

Specifications of MPC8533EVTALFA

• Processor Type: MPC85xx PowerQUICC III 32-Bit
• Speed: 667MHz
• Voltage: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Package / Case: 783-BBGA, FCBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -

Ultimately, the final selection of an appropriate heat sink depends on many factors, such as thermal
performance at a given air velocity, spatial volume, mass, attachment method, assembly, and cost. Several
heat sinks offered by Aavid Thermalloy, Advanced Thermal Solutions, Alpha Novatech, IERC, Chip
Coolers, Millennium Electronics, and Wakefield Engineering offer different heat sink-to-ambient thermal
resistances, that will allow the MPC8533E to function in various environments.
20.3.1
For the packaging technology, shown in
are as follows:
Freescale Semiconductor
•
•
International Electronic Research Corporation (IERC)818-842-7277
413 North Moss St.
Burbank, CA 91502
Internet: www.ctscorp.com
Millennium Electronics (MEI)408-436-8770
Loroco Sites
671 East Brokaw Road
San Jose, CA 95112
Internet: www.mei-thermal.com
Tyco Electronics800-522-6752
Chip Coolers™
P.O. Box 3668
Harrisburg, PA 17105-3668
Internet: www.chipcoolers.com
Wakefield Engineering603-635-2800
33 Bridge St.
Pelham, NH 03076
Internet: www.wakefield.com
The die junction-to-case thermal resistance
The die junction-to-board thermal resistance
Internal Package Conduction Resistance
MPC8533E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 5
Table
65, the intrinsic internal conduction thermal resistance paths
Thermal
95