XC7SH125GV,125 NXP Semiconductors, XC7SH125GV,125 Datasheet
XC7SH125GV,125
Specifications of XC7SH125GV,125
Related parts for XC7SH125GV,125
XC7SH125GV,125 Summary of contents
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XC7SH125 Bus buffer/line driver; 3-state Rev. 01 — 4 September 2009 1. General description XC7SH125 is a high-speed Si-gate CMOS device. It provides one non-inverting buffer/line driver with 3-state output. The 3-state output is controlled by the output enable input ...
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... NXP Semiconductors 4. Marking Table 2. Marking codes Type number XC7SH125GW XC7SH125GV XC7SH125GM XC7SH125GF [1] The pin 1 indicator is located on the lower left corner of the device, below the marking code. 5. Functional diagram mna118 Fig 1. Logic symbol 6. Pinning information 6.1 Pinning XC7SH125 GND 001aak123 Fig 4. Pin configuration ...
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... NXP Semiconductors 6.2 Pin description Table 3. Pin description Symbol Pin SOT353-1/SOT753 GND n. Functional description Table 4. Function table H = HIGH voltage level LOW voltage level don’t care high-impedance OFF-state Inputs Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). ...
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... NXP Semiconductors 9. Recommended operating conditions Table 6. Recommended operating conditions Voltages are referenced to GND (ground = 0 V). Symbol Parameter V supply voltage CC V input voltage I V output voltage O T ambient temperature amb t/ V input transition rise and fall rate 10. Static characteristics Table 7. Static characteristics Voltages are referenced to GND (ground = 0 V) ...
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... NXP Semiconductors 11. Dynamic characteristics Table 8. Dynamic characteristics GND = 0 V; For test circuit see Figure Symbol Parameter Conditions t propagation see pd delay enable time see disable time see dis power per buffer; PD dissipation pF MHz; L capacitance V = GND [ the same as t and t ...
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... NXP Semiconductors 12. Waveforms Measurement points are given in V and V are typical output voltage levels that occur with the output load Fig 7. Input (A) to output (Y) propagation delays OE input output LOW-to-OFF OFF-to-LOW output HIGH-to-OFF OFF-to-HIGH Measurement points are given in V and V are typical output voltage levels that occur with the output load. ...
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... NXP Semiconductors negative positive Test data is given in Table Definitions test circuit Termination resistance should be equal to output impedance Load capacitance including jig and probe capacitance Load resistance Test selection switch. Fig 9. Test circuit for measuring switching times Table 10. Test data Type Input ...
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... NXP Semiconductors 13. Package outline TSSOP5: plastic thin shrink small outline package; 5 leads; body width 1. DIMENSIONS (mm are the original dimensions UNIT max. 0.1 1.0 mm 1.1 0.15 0 0.8 Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION IEC SOT353-1 Fig 10 ...
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... NXP Semiconductors Plastic surface-mounted package; 5 leads DIMENSIONS (mm are the original dimensions UNIT 0.100 0.40 1.1 0.26 mm 0.013 0.25 0.9 0.10 OUTLINE VERSION IEC SOT753 Fig 11. Package outline SOT753 (SC-74A) XC7SH125_1 Product data sheet scale 3.1 1.7 3.0 0.6 0.95 2.7 1.3 2 ...
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... NXP Semiconductors XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1. (2) terminal 1 index area DIMENSIONS (mm are the original dimensions) ( UNIT b D max max 0.25 1.5 mm 0.5 0.04 0.17 1.4 Notes 1. Including plating thickness. 2. Can be visible in some manufacturing processes. ...
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... NXP Semiconductors XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 0 (1) terminal 1 index area DIMENSIONS (mm are the original dimensions UNIT b D max max 0.20 1.05 mm 0.5 0.04 0.12 0.95 Note 1. Can be visible in some manufacturing processes. OUTLINE VERSION IEC SOT891 Fig 13 ...
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... NXP Semiconductors 14. Abbreviations Table 11. Abbreviations Acronym Description CMOS Complementary Metal Oxide Semiconductor CDM Charged Device Model DUT Device Under Test ESD ElectroStatic Discharge HBM Human Body Model MM Machine Model TTL Transistor-Transistor Logic 15. Revision history Table 12. Revision history Document ID XC7SH125_1 XC7SH125_1 Product data sheet ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 18. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 Functional description . . . . . . . . . . . . . . . . . . . 3 8 Limiting values Recommended operating conditions Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . 5 12 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8 14 Abbreviations ...