XC7SET14GV,125 NXP Semiconductors, XC7SET14GV,125 Datasheet
XC7SET14GV,125
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XC7SET14GV,125 Summary of contents
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XC7SET14 Inverting Schmitt trigger Rev. 01 — 31 August 2009 1. General description XC7SET14 is a high-speed Si-gate CMOS device. It provides an inverting buffer function with Schmitt trigger action. This device is capable of transforming slowly changing input signals ...
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... NXP Semiconductors 5. Marking Table 2. Marking codes Type number XC7SET14GW XC7SET14GV [1] The pin 1 indicator is located on the lower left corner of the device, below the marking code. 6. Functional diagram mna023 Fig 1. Logic symbol 7. Pinning information 7.1 Pinning Fig 4. Pin configuration SOT353-1 and SOT753 7 ...
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... NXP Semiconductors 8. Functional description Table 4. Function table H = HIGH voltage level LOW voltage level Input Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter V supply voltage CC V input voltage I I input clamping current IK I output clamping current ...
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... NXP Semiconductors 11. Static characteristics Table 7. Static characteristics Voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions V HIGH-level output voltage 8 LOW-level output voltage 8 input leakage GND current 5 supply current 5 additional per input pin supply current other inputs input I capacitance XC7SET14_1 Product data sheet ...
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... NXP Semiconductors 11.1 Transfer characteristics Table 8. Transfer characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). See Symbol Parameter Conditions V positive-going threshold V CC voltage V negative-going threshold V CC voltage V hysteresis voltage V CC 12. Dynamic characteristics Table 9. Dynamic characteristics GND = 0 V. For waveform see ...
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... NXP Semiconductors 13. Waveforms Measurement points are given in Fig 5. The input (A) to output (Y) propagation delays Table 10. Measurement points Type number Input V I XC7SET14 GND to 3.0 V Test data is given in Table 11. Definitions for test circuit Load capacitance including jig and probe capacitance Termination resistance should be equal to output impedance Z T Fig 6 ...
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... NXP Semiconductors 13.1 Transfer characteristic waveforms Fig 7. Transfer characteristic (mA Fig 9. Typical characteristics; V XC7SET14_1 Product data sheet V I mna026 Fig 8. mna404 (mA ( 4.5 V Fig 10. Typical transfer characteristics Rev. 01 — 31 August 2009 XC7SET14 Inverting Schmitt trigger The definitions and mna027 H mna405 © NXP B.V. 2009. All rights reserved. ...
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... NXP Semiconductors 14. Application information The slow input rise and fall times cause additional power dissipation, which can be calculated using the following formula add additional power dissipation ( W); add f = input frequency (MHz input rise time (ns input fall time (ns CC(AV) Average additional I Figure 11. ...
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... NXP Semiconductors ------------------------ - T 0.60 RC Fig 12. Relaxation oscillator using the XC7SET14 XC7SET14_1 Product data sheet R C mna035 Rev. 01 — 31 August 2009 XC7SET14 Inverting Schmitt trigger © NXP B.V. 2009. All rights reserved ...
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... NXP Semiconductors 15. Package outline TSSOP5: plastic thin shrink small outline package; 5 leads; body width 1. DIMENSIONS (mm are the original dimensions UNIT max. 0.1 1.0 mm 1.1 0.15 0 0.8 Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION IEC SOT353-1 Fig 13 ...
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... NXP Semiconductors Plastic surface-mounted package; 5 leads DIMENSIONS (mm are the original dimensions UNIT 0.100 0.40 1.1 0.26 mm 0.013 0.25 0.9 0.10 OUTLINE VERSION IEC SOT753 Fig 14. Package outline SOT753 (SC-74A) XC7SET14_1 Product data sheet scale 3.1 1.7 3.0 0.6 0.95 2.7 1.3 2 ...
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... NXP Semiconductors 16. Abbreviations Table 12. Abbreviations Acronym Description CDM Charged Device Model DUT Device Under Test ESD ElectroStatic Discharge HBM Human Body Model MM Machine Model 17. Revision history Table 13. Revision history Document ID Release date XC7SET14_1 20090831 XC7SET14_1 Product data sheet Data sheet status ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 20. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 5 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 6 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 7 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 7.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 7.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2 8 Functional description . . . . . . . . . . . . . . . . . . . 3 9 Limiting values Recommended operating conditions Static characteristics 11.1 Transfer characteristics . . . . . . . . . . . . . . . . . . . 5 12 Dynamic characteristics . . . . . . . . . . . . . . . . . . 5 13 Waveforms ...