XC7SH08GV,125 NXP Semiconductors, XC7SH08GV,125 Datasheet
XC7SH08GV,125
Specifications of XC7SH08GV,125
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XC7SH08GV,125 Summary of contents
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XC7SH08 2-input AND gate Rev. 01 — 1 September 2009 1. General description XC7SH08 is a high-speed Si-gate CMOS device. It provides a 2-input AND function. 2. Features I Symmetrical output impedance I High noise immunity I Low power dissipation ...
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... NXP Semiconductors 4. Marking Table 2. Marking codes Type number XC7SH08GW XC7SH08GV [1] The pin 1 indicator is located on the lower left corner of the device, below the marking code. 5. Functional diagram mna113 Fig 1. Logic symbol 6. Pinning information 6.1 Pinning Fig 4. Pin configuration SOT353-1 (TSSOP5) and SOT753 (SC-74A) 6 ...
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... NXP Semiconductors 7. Functional description Table 4. Function table H = HIGH voltage level LOW voltage level Inputs Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter V supply voltage CC V input voltage I I input clamping current IK I output clamping current ...
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... NXP Semiconductors 9. Recommended operating conditions Table 6. Recommended operating conditions Voltages are referenced to GND (ground = 0 V). Symbol Parameter V supply voltage CC V input voltage I V output voltage O T ambient temperature amb t/ V input transition rise and fall rate 10. Static characteristics Table 7. Static characteristics Voltages are referenced to GND (ground = 0 V) ...
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... NXP Semiconductors 11. Dynamic characteristics Table 8. Dynamic characteristics GND = 0 V. For test circuit see Figure Symbol Parameter Conditions t propagation A and delay see Figure power per buffer; PD dissipation pF MHz; L capacitance V = GND [ the same as t and PLH PHL [2] Typical values are measured at V [3] Typical values are measured at V ...
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... NXP Semiconductors 12. Waveforms Measurement points are given in Fig 5. Input (A and B) to output (Y) propagation delays Table 9. Measurement point Type Input V I XC7SH08 GND to V Test data is given in Table C = Load capacitance including jig and probe capacitance Termination resistance should be equal to output impedance Z T Fig 6. ...
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... NXP Semiconductors 13. Package outline TSSOP5: plastic thin shrink small outline package; 5 leads; body width 1. DIMENSIONS (mm are the original dimensions UNIT max. 0.1 1.0 mm 1.1 0.15 0 0.8 Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION IEC SOT353-1 Fig 7 ...
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... NXP Semiconductors Plastic surface-mounted package; 5 leads DIMENSIONS (mm are the original dimensions UNIT 0.100 0.40 1.1 0.26 mm 0.013 0.25 0.9 0.10 OUTLINE VERSION IEC SOT753 Fig 8. Package outline SOT753 (SC-74A) XC7SH08_1 Product data sheet scale 3.1 1.7 3.0 0.6 0.95 2.7 1.3 2 ...
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... NXP Semiconductors 14. Abbreviations Table 11. Abbreviations Acronym Description CDM Charged Device Model DUT Device Under Test ESD ElectroStatic Discharge HBM Human Body Model MM Machine Model TTL Transistor-Transistor Logic 15. Revision history Table 12. Revision history Document ID Release date XC7SH08_1 20090901 XC7SH08_1 Product data sheet ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 18. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2 7 Functional description . . . . . . . . . . . . . . . . . . . 3 8 Limiting values Recommended operating conditions Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . 5 12 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7 14 Abbreviations ...