XC7WH14DP,125 NXP Semiconductors, XC7WH14DP,125 Datasheet
XC7WH14DP,125
Specifications of XC7WH14DP,125
Related parts for XC7WH14DP,125
XC7WH14DP,125 Summary of contents
Page 1
XC7WH14 Triple inverting Schmitt trigger Rev. 3 — 18 November 2010 1. General description The XC7WH14 is a high-speed Si-gate CMOS device. This device provides three inverting buffers with Schmitt trigger action. This device is capable of transforming slowly changing ...
Page 2
... NXP Semiconductors 5. Marking Table 2. Marking codes Type number XC7WH14DP XC7WH14DC XC7WH14GT XC7WH14GD [1] The pin 1 indicator is located on the lower left corner of the device, below the marking code. 6. Functional diagram 001aah728 Fig 1. Logic symbol 7. Pinning information 7.1 Pinning XC7WH14 GND 4 001aak065 Fig 4. Pin configuration SOT505-2 and SOT765-1 ...
Page 3
... NXP Semiconductors Fig 6. Pin configuration SOT996-2 7.2 Pin description Table 3. Pin description Symbol Pin 1A, 2A GND 4 1Y, 2Y Functional description [1] Table 4. Function table Input [ HIGH voltage level LOW voltage level XC7WH14 Product data sheet XC7WH14 GND 4 001aak066 Transparent top view Description data input ...
Page 4
... NXP Semiconductors 9. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter V supply voltage CC V input voltage I I input clamping current IK I output clamping current OK I output current O I supply current CC I ground current GND ...
Page 5
... NXP Semiconductors 11. Static characteristics Table 7. Static characteristics Voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions V HIGH-level output voltage = −50 μ −50 μ −50 μ −4.0 mA −8.0 mA LOW-level output voltage = 50 μ μ μ 4.0 mA 8.0 mA input leakage GND current 5.5 V ...
Page 6
... NXP Semiconductors 11.1 Transfer characteristics Table 8. Transfer characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). See Symbol Parameter Conditions V positive-going threshold V CC voltage negative-going V T− CC threshold V CC voltage hysteresis voltage 12. Dynamic characteristics Table 9. Dynamic characteristics GND = 0 V; for test circuit see ...
Page 7
... NXP Semiconductors 13. Waveforms Measurement points are given in Fig 7. The input (nA) to output (nY) propagation delays Table 10. Measurement points Type number Input V XC7WH14 GND to V Test data is given in Table Definitions for test circuit Load capacitance including jig and probe capacitance Termination resistance should be equal to output impedance Z T Fig 8 ...
Page 8
... NXP Semiconductors 13.1 Transfer characteristic waveforms T− Fig 9. Transfer characteristic 1 (mA Fig 11. Typical transfer characteristics XC7WH14 Product data sheet mna026 Fig 10. The definitions of V mna401 (V) I Fig 12. Typical transfer characteristics All information provided in this document is subject to legal disclaimers. Rev. 3 — 18 November 2010 ...
Page 9
... NXP Semiconductors Fig 13. Typical transfer characteristics 14. Application information The slow input rise and fall times cause additional power dissipation, which can be calculated using the following formula add P = additional power dissipation (μW); add f = input frequency (MHz input rise time (ns input fall time (ns ...
Page 10
... NXP Semiconductors Linear change of V between 0.1V I Fig 14. Average additional ≈ ------------------------ f = × T 0.55 RC Fig 15. Relaxation oscillator using the XC7WH14 XC7WH14 Product data sheet 200 ΔI CC(AV) (μA) 150 100 2 mna035 All information provided in this document is subject to legal disclaimers. Rev. 3 — 18 November 2010 ...
Page 11
... NXP Semiconductors 15. Package outline TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0 pin 1 index 1 e DIMENSIONS (mm are the original dimensions UNIT max. 0.15 0.95 mm 1.1 0.25 0.00 0.75 Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. ...
Page 12
... NXP Semiconductors VSSOP8: plastic very thin shrink small outline package; 8 leads; body width 2 pin 1 index 1 e DIMENSIONS (mm are the original dimensions UNIT max. 0.15 0. 0.12 0.00 0.60 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. ...
Page 13
... NXP Semiconductors XSON8: plastic extremely thin small outline package; no leads; 8 terminals; body 1 x 1. 8× (2) terminal 1 index area DIMENSIONS (mm are the original dimensions) ( UNIT b D max max 0.25 2.0 mm 0.5 0.04 0.17 1.9 Notes 1. Including plating thickness. 2. Can be visible in some manufacturing processes. ...
Page 14
... NXP Semiconductors XSON8U: plastic extremely thin small outline package; no leads; 8 terminals; UTLP based; body 0.5 mm terminal 1 index area DIMENSIONS (mm are the original dimensions) A UNIT max 0.05 0.35 2.1 mm 0.5 0.00 0.15 1.9 OUTLINE VERSION IEC SOT996 Fig 19. Package outline SOT996-2 (XSON8U) ...
Page 15
... NXP Semiconductors 16. Abbreviations Table 12. Abbreviations Acronym Description CDM Charged Device Model CMOS Complementary Metal-Oxide Semiconductor DUT Device Under Test ESD ElectroStatic Discharge HBM Human Body Model MM Machine Model 17. Revision history Table 13. Revision history Document ID Release date XC7WH14 v.3 20101118 • Modifications: Descriptive title changed from Inverting Schmitt trigger into Triple inverting Schmitt trigger XC7WH14 v ...
Page 16
... In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or ...
Page 17
... NXP Semiconductors Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. 19. Contact information For more information, please visit: For sales office addresses, please send an email to: XC7WH14 Product data sheet 18 ...
Page 18
... NXP Semiconductors 20. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 5 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 6 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 7 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 7.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 7.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 8 Functional description . . . . . . . . . . . . . . . . . . . 3 9 Limiting values Recommended operating conditions Static characteristics 11.1 Transfer characteristics . . . . . . . . . . . . . . . . . . 6 12 Dynamic characteristics ...