74HC21D NXP Semiconductors, 74HC21D Datasheet

74HC21D

Manufacturer Part Number

74HC21D

Description

IC, 74HC CMOS, SMD, 74HC21, SOIC14

Manufacturer

NXP Semiconductors

Datasheet

1.74HC21D.pdf (15 pages)

Specifications of 74HC21D

Output Current

5.2mA

No. Of Inputs

Supply Voltage Range

2V To 6V

Logic Case Style

SOIC

No. Of Pins

Operating Temperature Range

-40Â°C To +125Â°C

Svhc

No SVHC

Logic Type

AND Gate

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

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1. General description

2. Features

3. Quick reference data

The 74HC21 is a high-speed Si-gate CMOS device and is pin compatible with low-power

Schottky TTL (LSTTL). The 74HC21 is speciﬁed in compliance with JEDEC

standard no. 7A.

The 74HC21 provide the 4-input AND function.

Table 1:

GND = 0 V; T

[1]

Symbol

PHL

74HC21

Dual 4-input AND gate

Rev. 03 — 12 November 2004

Low-power dissipation

Complies with JEDEC standard no. 7A

ESD protection:

Multiple package options

Speciﬁed from 40 C to +80 C and from 40 C to +125 C.

, t

N = number of inputs switching;

= input frequency in MHz;

PLH

= output frequency in MHz;

= output load capacitance in pF;

HBM EIA/JESD22-A114-B exceeds 2000 V

MM EIA/JESD22-A115-A exceeds 200 V.

= C

is used to determine the dynamic power dissipation (P

= supply voltage in V;

Quick reference data

amb

Parameter

propagation delay nA,

nB, nC, nD to nY

input capacitance

power dissipation

capacitance

= 25 C; t

) = sum of outputs.

N + (C

= t

= 6 ns.

Conditions

) where:

= GND to V

= 15 pF;

= 5 V

in W).

[1]

Min

Product data sheet

Typ

3.5

Max

Unit

Related parts for 74HC21D

74HC21D Summary of contents

Page 1

Dual 4-input AND gate Rev. 03 — 12 November 2004 1. General description The 74HC21 is a high-speed Si-gate CMOS device and is pin compatible with low-power Schottky TTL (LSTTL). The 74HC21 is speciﬁed in compliance with JEDEC standard ...

Page 2

... Ordering information Table 2: Ordering information Type number Package Temperature range Name 74HC21N +125 C 74HC21D +125 C 74HC21DB +125 C 5. Functional diagram Fig 1. Functional diagram Fig 3. IEC logic symbol 9397 750 13806 Product data sheet Description DIP14 plastic dual in-line package; 14 leads (300 mil) SO14 plastic small outline package ...

Page 3

Philips Semiconductors 6. Pinning information 6.1 Pinning Fig 5. Pin conﬁguration 6.2 Pin description Table 3: Symbol GND n. 9397 750 13806 Product data sheet 1A 1 ...

Page 4

Philips Semiconductors 7. Functional description 7.1 Function table Table 4: Input [ HIGH voltage level LOW voltage level don’t care. 8. Limiting values Table 5: In accordance with ...

Page 5

Philips Semiconductors 9. Recommended operating conditions Table 6: Symbol amb 10. Static characteristics Table 7: Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = ...

Page 6

Philips Semiconductors Table 7: Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter +85 C amb V HIGH-level input voltage IH V LOW-level input voltage IL V ...

Page 7

Philips Semiconductors Table 7: Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter +125 C amb V HIGH-level input voltage IH V LOW-level input voltage IL V ...

Page 8

Philips Semiconductors 11. Dynamic characteristics Table 8: Dynamic characteristics GND = ns pF; see Symbol Parameter amb propagation delay nA, ...

Page 9

Philips Semiconductors 12. Waveforms Fig 6. Waveforms showing the input (nA, nB, nC, nD) to output (nY) propagation delays Fig 7. Load circuitry for switching times Table 9: Supply V CC 2.0 V 4.5 V 6.0 V 5.0 V 9397 ...

Page 10

Philips Semiconductors 13. Package outline DIP14: plastic dual in-line package; 14 leads (300 mil pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions UNIT max. min. max. ...

Page 11

Philips Semiconductors SO14: plastic small outline package; 14 leads; body width 3 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. ...

Page 12

Philips Semiconductors SSOP14: plastic shrink small outline package; 14 leads; body width 5 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT max. 0.21 1.80 mm ...

Page 13

Philips Semiconductors 14. Revision history Table 10: Revision history Document ID Release date 74HC21_3 20041112 • Modiﬁcations: The format of this data sheet has been redesigned to comply with the current presentation and information standard of Philips Semiconductors. • Removed ...

Page 14

Philips Semiconductors 15. Data sheet status [1] Level Data sheet status Product status I Objective data Development II Preliminary data Qualiﬁcation III Product data Production [1] Please consult the most recently issued data sheet before initiating or completing a design. ...

Page 15

Philips Semiconductors 19. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . ...

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