LM93CIMT National Semiconductor, LM93CIMT Datasheet - Page 90

• Manufacturer Part Number: LM93CIMT
• Description: Microprocessor Support IC
• Manufacturer: National Semiconductor

Specifications of LM93CIMT

• Peak Reflow Compatible (260 C): No
• Supply Voltage Max: 3.6V
• Leaded Process Compatible: No
• Supply Voltage Min: 3V
• Operating Temperature Min: 0��C
• Package / Case: 56-TSSOP
• Operating Temperature Max: 85°C
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

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Note 4: Human body model, 100 pF discharged through a 1.5 kΩ resistor. Machine model, 200 pF discharged directly into each pin.
Note 5: Reflow temperature profiles are different for lead-free and non lead-free packages.
Note 6: The maximum power dissipation must be de-rated at elevated temperatures and is dictated by T
allowable power dissipation at any temperature is PD = (T
flow is listed in the following table.
Note 7: See the URL "http://www.national.com/packaging/" for other recommendations and methods of soldering surface mount devices.
Note 8: When measuring an MMBT3904 transistor, 4 ˚C should be subracted from all temperature readings.
Note 9: Typical parameters are at T
Note 10: Limits are guaranteed to National’s AOQL (Average Outgoing Quality Level).
Note 11: TUE (Total Unadjusted Error) includes Offset, Gain and Linearity errors of the ADC.
Note 12: Total Monitoring Cycle Time includes all temperature and voltage conversions.
Note 13: Leakage current approximately doubles every 20 ˚C.
Note 14: A total digital I/O current of 40mA can cause 6mV of offset in Vref.
AD_IN1
AD_IN2
AD_IN3
AD_IN4
AD_IN5
AD_IN6
AD_IN7
AD_IN8
AD_IN9
AD_IN10
AD_IN11
AD_IN12
AD_IN13
AD_IN14
AD_IN15
ADDR_SEL
AD_IN16/V
(V+)
GND
PWM1
PWM2
P1_VID0
P1_VID1
P1_VID2
P1_VID3
P1_VID4
P1_VID5
P1_PROCHOT
P2_PROCHOT
P2_VID0
P2_VID1
P2_VID2
P2_VID3
P2_VID4
P2_VID5
Symbol
DD
1.14 m/s (225 LFPM)
2.54 m/s (500 LFPM)
Air Flow
0 m/s
Pin #
J
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
= T
A
= 25 ˚C and represent most likely parametric norm.
D1
JMAX
− T
A
) / θ
D2
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
JA
. The θ
90
Junction to Ambient Thermal Resistance, θ
JA
for the LM93 when mounted to 1 oz. copper foil PCB the θ
D4
Internally shorted to AGND.
D5
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
JMAX
79 ˚C/W
62 ˚C/W
52 ˚C/W
, θ
JA
and the ambient temperature, T
D6
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
SNP
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
JA
JA
A
with different air
. The maximum
50 Ω
50 Ω
50 Ω
50 Ω
R1
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U