PCA9550D NXP Semiconductors, PCA9550D Datasheet
PCA9550D
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PCA9550D Summary of contents
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PCA9550 2-bit I Rev. 05 — 13 October 2008 1. General description The PCA9550 LED blinker blinks LEDs in I necessary to limit bus traffic or free up the I timer. The uniqueness of this device is the internal oscillator ...
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... PCA9550TK HVSON8 plastic thermal enhanced very thin small outline package; no leads; 8 terminals; body 3 [1] Also known as MSOP8. 3.1 Ordering options Table 2. Type number PCA9550D PCA9550DP PCA9550TK 4. Block diagram PCA9550 SCL INPUT FILTERS SDA V DD POWER-ON ...
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... LED driver 0 3 LED driver 1 4 supply ground 5 active LOW reset input 6 serial clock line 7 serial data line 8 supply voltage Rev. 05 — 13 October 2008 PCA9550 A0 1 LED0 2 PCA9550DP LED1 002aad239 Fig 3. Pin configuration for TSSOP8 SDA PCA9550TK 6 SCL 5 RESET 002aad240 © ...
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... NXP Semiconductors 6. Functional description Refer to 6.1 Device address Following a START condition, the bus master must output the address of the slave it is accessing. The address of the PCA9550 is shown in internal pull-up resistor is incorporated on the hardware selectable address pin and it must be pulled HIGH or LOW. ...
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... NXP Semiconductors 6.2.1 Control register definition Table 6.3 Register descriptions 6.3.1 INPUT - Input register The INPUT register reflects the state of the device pins. Writes to this register will be acknowledged but will have no effect. Table 5. Bit Symbol Default Remark: The default value ‘X’ is determined by the externally applied logic level (normally logic 1) when used for directly driving LED with pull- ...
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... NXP Semiconductors 6.3.4 PSC1 - Frequency Prescaler 1 PSC1 is used to program the period of the PWM output. The period of BLINK1 = (PSC1 + 1) / 44. Table 8. Bit Symbol Default 6.3.5 PWM1 - Pulse Width Modulation 1 The PWM1 register determines the duty cycle of BLINK1. The outputs are LOW (LED off) when the count is less than the value in PWM1 and HIGH when it is greater ...
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... NXP Semiconductors 6.4 Pins used as GPIOs LED pins not used to control LEDs can be used as General Purpose Input/Outputs (GPIOs). For use as input, set LEDn to high-impedance (01) and then read the pin state via the Input register. For use as output, connect external pull-up resistor to the pin and size it according to the DC recommended operating characteristics ...
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... NXP Semiconductors 7. Characteristics of the I 2 The I C-bus is for 2-way, 2-line communication between different ICs or modules. The two lines are a serial data line (SDA) and a serial clock line (SCL). Both lines must be connected to a positive supply via a pull-up resistor when connected to the output stages of a device ...
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... NXP Semiconductors SDA SCL MASTER TRANSMITTER/ RECEIVER Fig 9. System configuration 7.3 Acknowledge The number of data bytes transferred between the START and the STOP conditions from transmitter to receiver is not limited. Each byte of eight bits is followed by one acknowledge bit. The acknowledge bit is a HIGH level put on the bus by the transmitter, whereas the master generates an extra acknowledge related clock pulse ...
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... NXP Semiconductors 7.4 Bus transactions SCL slave address SDA START condition write to register data out from port Fig 11. Write to register slave address SDA START condition acknowledge slave address (cont (repeated) START condition Fig 12. Read from register slave address SDA START condition ...
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... NXP Semiconductors 8. Application design-in information Fig 14. Typical application 8.1 Minimizing I When the I/Os are used to control LEDs, they are normally connected to V resistor as shown in I about 1.2 V less than V I lower than V Designs needing to minimize current consumption, such as battery power applications, ...
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... NXP Semiconductors 8.2 Programming example The following example will show how to set LED0 to blink duty cycle. LED1 will be set to blink and duty cycle. Table 11. Program sequence START PCA9550 address with A0 = LOW PSC0 subaddress + Auto-Increment Set prescaler PSC0 to achieve a period of 1 second: ...
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... NXP Semiconductors 10. Static characteristics Table 13. Static characteristics Symbol Parameter Supplies V supply voltage DD I supply current DD I standby current stb V power-on reset voltage POR Input SCL; input/output SDA V LOW-level input voltage IL V HIGH-level input voltage IH I LOW-level output current OL I leakage current ...
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... NXP Semiconductors 20 % (1) percent variation (1) maximum (2) average (3) minimum Fig 17. Typical frequency variation over process 2 3 PCA9550_5 Product data sheet 2 2-bit I C-bus LED driver with programmable blink rates 002aac191 20 % percent variation 100 amb (1) maximum (2) average (3) minimum Fig 18. Typical frequency variation over process at Rev. 05 — ...
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... NXP Semiconductors 11. Dynamic characteristics Table 14. Dynamic characteristics Symbol Parameter f SCL clock frequency SCL t bus free time between a STOP and BUF START condition t hold time (repeated) START condition HD;STA t set-up time for a repeated START SU;STA condition t set-up time for STOP condition SU;STO ...
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... NXP Semiconductors START SCL SDA RESET 50 % LEDn Fig 19. Definition of RESET timing SDA t BUF t LOW SCL t HD;STA P S Fig 20. Definition of timing PCA9550_5 Product data sheet 2 2-bit I C-bus LED driver with programmable blink rates rec(rst HD;DAT HIGH SU;DAT Rev. 05 — 13 October 2008 ...
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... NXP Semiconductors protocol SCL SDA Fig 21. I 12. Test information Fig 22. Test circuitry for switching times PCA9550_5 Product data sheet 2 2-bit I C-bus LED driver with programmable blink rates START bit 7 bit 6 condition MSB (A6) (S) (A7 SU;STA LOW HIGH 1 /f SCL t t BUF SU;DAT HD ...
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... NXP Semiconductors 13. Package outline SO8: plastic small outline package; 8 leads; body width 3 pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. 0.25 1.45 mm 1.75 0.25 0.10 1.25 0.010 0.057 inches 0.069 0.01 0.004 0.049 Notes 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. ...
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... NXP Semiconductors TSSOP8: plastic thin shrink small outline package; 8 leads; body width pin 1 index 1 e DIMENSIONS (mm are the original dimensions UNIT max. 0.15 0.95 mm 1.1 0.25 0.05 0.80 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. ...
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... NXP Semiconductors HVSON8: plastic thermal enhanced very thin small outline package; no leads; 8 terminals; body 0. terminal 1 index area terminal 1 index area DIMENSIONS (mm are the original dimensions) (1) A UNIT max. 0.05 0 0.2 0.00 0.2 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. ...
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... NXP Semiconductors 14. Handling information Inputs and outputs are protected against electrostatic discharge in normal handling. However completely safe you must take normal precautions appropriate to handling integrated circuits. 15. Soldering of SMD packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “ ...
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... NXP Semiconductors • Process issues, such as application of adhesive and flux, clinching of leads, board transport, the solder wave parameters, and the time during which components are exposed to the wave • Solder bath specifications, including temperature and impurities 15.4 Reflow soldering Key characteristics in reflow soldering are: • ...
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... NXP Semiconductors Fig 26. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description” . 16. Abbreviations Table 17. Acronym AI CDM DSP DUT ESD GPIO HBM 2 I C-bus I/O IC LED MCU ...
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... NXP Semiconductors 17. Revision history Table 18. Revision history Document ID Release date PCA9550_5 20081013 • Modifications: Section 8.1 “Minimizing increases as V • Table 13 “Static • Table 13 “Static – condition V – condition V – condition V – condition V – condition V – condition V • updated soldering information ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 20. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 3.1 Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 2 4 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 5.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 5.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 Functional description . . . . . . . . . . . . . . . . . . . 4 6.1 Device address . . . . . . . . . . . . . . . . . . . . . . . . . 4 6.2 Control register . . . . . . . . . . . . . . . . . . . . . . . . . 4 6.2.1 Control register definition . . . . . . . . . . . . . . . . . 5 6.3 Register descriptions . . . . . . . . . . . . . . . . . . . . 5 6.3.1 INPUT - Input register ...