IKCS12F60AA Infineon Technologies, IKCS12F60AA Datasheet - Page 4

IGBT Modules CiPoS Single In-Line 600V 12A

IKCS12F60AA

Manufacturer Part Number
IKCS12F60AA
Description
IGBT Modules CiPoS Single In-Line 600V 12A
Manufacturer
Infineon Technologies
Datasheet

Specifications of IKCS12F60AA

Collector-emitter Saturation Voltage
2.1 V
Power Dissipation
35 W
Maximum Operating Temperature
+ 125 C
Mounting Style
Through Hole
Package / Case
MSIP-20
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
IKCS12F60AA-DS4
Quantity:
304
CIPOS™
Control integrated Power System
Single In-Line Intelligent Power Module
3Φ-bridge 600V / 12A @ 25°C
Features
• Fully isolated Single In-Line molded module
• TrenchStop
• Optimal adapted EmCon™ diode for low EMI
• Integrated bootstrap diode and capacitor
• Rugged SOI gate driver technology with
• Temperature monitor and over temperature
• Overcurrent shutdown
• Undervoltage lockout at all channels
• Matched propagation delay for all channels
• Low side emitter pins accessible for all phase
• Cross-conduction prevention
• Lead-free terminal plating; RoHS compliant
• Qualified
Target Applications
• Washing machines
• Consumer Fans and Consumer Compressors
1
Preliminary Data Sheet
J-STD-020 and JESD-022
stability against transient and negative voltage
shutdown
current monitoring (open emitter)
temperature stress tests for 500h) for target
applications
®
according
IGBTs with lowest V
to
JEDEC
CE(sat)
1
(high
4/17
Description
The CiPoS™ module family offers the chance for
integrating various power and control components
to increase reliability, optimize PCB size and
system costs.
This SIL-IPM is designed to control AC motors in
variable speed drives for applications like air
conditioning,
machines. The package concept is specially
adapted to power applications, which need
extremely good thermal conduction and electrical
isolation, but also EMI-save control and overload
protection. The features of Infineon TrenchStop
IGBTs and EmCon™ diodes are combined with a
new optimized Infineon SOI gate driver for
excellent electrical performance.
System Configuration
• 3 halfbridges with TrenchStop
• 3Φ SOI gate driver
• Bootstrap diodes for high side supply
• Integrated 100nF bootstrap capacitance
• Temperature sensor, passive components for
• Isolated heatsink
• Creepage distance 3.1mm
EmCon™ diodes
adaptions
compressors
CIPOS™ IKCS12F60AA
Rev. 1.4, Dec. 2007
and
®
IGBT & FW-
washing
®

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