ADP1714AUJZ-1.8-R7 Analog Devices Inc, ADP1714AUJZ-1.8-R7 Datasheet - Page 13

• Manufacturer Part Number: ADP1714AUJZ-1.8-R7
• Description: 300mA CMOS Low-Dropout Regular
• Manufacturer: Analog Devices Inc

Specifications of ADP1714AUJZ-1.8-R7

• Regulator Topology: Positive Fixed
• Voltage - Output: 1.8V
• Voltage - Input: 2.5 ~ 5.5 V
• Number Of Regulators: 1
• Current - Output: 300mA (Max)
• Current - Limit (min): 380mA
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: TSOT-23-5, TSOT-5, TSOP-5
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Voltage - Dropout (typical): -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: ADP1714AUJZ-1.8-R7TR

THERMAL CONSIDERATIONS
To guarantee reliable operation, the junction temperature of the
ADP1712/ADP1713/ADP1714 must not exceed 125°C. To
ensure the junction temperature stays below this maximum value,
the user needs to be aware of the parameters that contribute to
junction temperature changes. These parameters include ambient
temperature, power dissipation in the power device, and thermal
resistances between the junction and ambient air (θ
number is dependent on the package assembly compounds used
and the amount of copper to which the GND pin of the package
is soldered on the PCB. Table 5 shows typical θ
5­lead TSOT package for various PCB copper sizes.
Table 5.
Copper Size (mm
0
50
100
300
500
1
The junction temperature of the ADP1712/ADP1713/ADP1714
can be calculated from the following equation:
where:
T
P
where:
I
I
V
Power dissipation due to ground current is quite small and can
be ignored. Therefore, the junction temperature equation
simplifies to the following:
As shown in Equation 4, for a given ambient temperature, input-
to-output voltage differential, and continuous load current,
there exists a minimum copper size requirement for the PCB to
ensure the junction temperature does not rise above 125°C. The
following figures show junction temperature calculations for
different ambient temperatures, load currents, input-to-output
voltage differentials, and areas of PCB copper.
LOAD
GND
1
Device soldered to minimum size pin traces.
A
D
IN
is the ambient temperature.
is the power dissipation in the die, given by
and V
is the ground current.
T
P
T
is the load current.
D
J
J
= T
= T
= [(V
OUT
A
A
+ (P
+ {[(V
IN
are input voltage and output voltage, respectively.
– V
D
2
× θ
)
IN
OUT
– V
JA
) × I
)
OUT
LOAD
) × I
] + (V
LOAD
] × θ
IN
× I
JA
GND
}
θ
170
152
146
134
131
JA
)
(°C/W)
JA
values of the
JA
). The θ
JA
Rev. A | Page 13 of 16
(3)
(4)
(5)
140
120
100
140
120
100
140
120
100
80
60
40
20
80
60
40
20
80
60
40
20
0
0
0
0.5
0.5
0.5
MAX T
MAX T
MAX T
Figure 33. 500 mm
Figure 34. 100 mm
1.0
1.0
1.0
1mA
10mA
1mA
10mA
1mA
10mA
Figure 35. 0 mm
J
J
J
ADP1712/ADP1713/ADP1714
(DO NOT OPERATE ABOVE THIS POINT)
(DO NOT OPERATE ABOVE THIS POINT)
(DO NOT OPERATE ABOVE THIS POINT)
1.5
1.5
1.5
30mA
80mA
30mA
80mA
30mA
80mA
2.0
2.0
2.0
2
V
V
V
2
2
of PCB Copper, T
IN
IN
IN
2.5
2.5
2.5
of PCB Copper, T
of PCB Copper, T
– V
– V
– V
OUT
OUT
OUT
100mA
200mA
100mA
200mA
100mA
200mA
3.0
3.0
3.0
(V)
(V)
(V)
3.5
3.5
3.5
(LOAD CURRENT)
(LOAD CURRENT)
(LOAD CURRENT)
A
A
A
= 25°C
300mA
300mA
300mA
= 25°C
= 25°C
4.0
4.0
4.0
4.5
4.5
4.5
5.0
5.0
5.0