DSPIC33EP256MU810-I/PF Microchip Technology, DSPIC33EP256MU810-I/PF Datasheet - Page 554

• Manufacturer Part Number: DSPIC33EP256MU810-I/PF
• Description: 100 PINS, 256KB Flash, 28KB RAM, 60 MHz, USB, 2xCAN, 15 DMA 100 TQFP 14x14x1mm T
• Manufacturer: Microchip Technology
• Series: dsPIC™ 33EPr

Specifications of DSPIC33EP256MU810-I/PF

• Processor Series: DSPIC33E
• Core: dsPIC
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 60 MIPs
• Connectivity: CAN, I²C, IrDA, LIN, QEI, SPI, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
• Number Of I /o: 83
• Program Memory Size: 256KB (85.5K x 24)
• Program Memory Type: FLASH
• Eeprom Size: -
• Ram Size: 12K x 16
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 32x10b/12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 100-TQFP
• Lead Free Status / Rohs Status: Details

dsPIC33EPXXXMU806/810/814 and PIC24EPXXXGU810/814
TABLE A-1:
DS70616E-page 554
Section 17.0 “Quadrature
Encoder Interface (QEI) Module
(dsPIC33EPXXXMU806/810/814
Devices Only)”
Section 23.0 “10-bit/12-bit
Analog-to-Digital Converter
(ADC)”
Section 25.0 “Comparator
Module”
Section 29.0 “Special Features”
Section 30.0 “Instruction Set
Summary”
Section 32.0 “Electrical
Characteristics”
Section Name
MAJOR SECTION UPDATES (CONTINUED)
Reordered the bit values for the OUTFNC<1:0> bits and updated the default
POR bit value to ‘x’ for the HOME, INDEX, QEB, and QEA bits in the QEI I/O
Control Register (see Register 17-2).
Updated V
Figure 23-1).
Added Note 1 to the Comparator I/O Operating Modes (see Figure 25-1).
Removed the CLPWR bit (CMxCON<12>) (see Register 25-2).
Added a new first paragraph to Section 29.1 “Configuration Bits”
The following instructions have been updated (see Table 30-2):
• BRA
• CALL
• CPBEQ
• CPBGT
• CPBLT
• CPBNE
• GOTO
• MOVPAG
• MUL
• RCALL
• RETFIE
• RETLW
• RETURN
• TBLRDH
• TBLRDL
Updated the Typical and Maximum values for DC Characteristics: Operating
Current (I
Updated the Typical and Maximum values for DC Characteristics: Idle Current
(I
Updated the Maximum values for DC Characteristics: Power-down Current
(I
Updated the Maximum values for DC Characteristics: Doze Current (I
(see Table 32-8).
Updated the parameter numbers for Internal FRC Accuracy (see Table 32-19).
Updated the parameter numbers and the Typical value for parameter F21b for
Internal RC Accuracy (see Table 32-20).
Updated the Minimum value for PM6 and the Typical and Maximum values for
PM7 in Parallel Master Port Read Requirements (see Table 32-52).
Added DMA Module Timing Requirements (see Table 32-54).
IDLE
PD
) (see Table 32-7).
) (see Table 32-6).
DD
REFL
) (see Table 32-5).
Preliminary
in the ADC1 and ADC2 Module Block Diagram (see
Update Description
 2009-2011 Microchip Technology Inc.
DOZE
)