BAT18,235 NXP Semiconductors, BAT18,235 Datasheet

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BAT18,235

Manufacturer Part Number
BAT18,235
Description
DIODE 35V 100MA SOT23
Manufacturer
NXP Semiconductors
Datasheet

Specifications of BAT18,235

Package / Case
TO-236-3, SC-59, SOT-23-3
Diode Type
Standard - Single
Voltage - Peak Reverse (max)
35V
Current - Max
100mA
Capacitance @ Vr, F
1pF @ 20V, 1MHz
Resistance @ If, F
700 mOhm @ 5mA, 200MHz
Configuration
Single
Reverse Voltage
35 V
Forward Continuous Current
100 mA
Termination Style
Solder Tails
Forward Voltage Drop
1.2 V
Maximum Diode Capacitance
1 pF
Mounting Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Power Dissipation (max)
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
1. Product profile
2. Pinning information
3. Ordering information
1.1 General description
1.2 Features
1.3 Applications
Planar high performance band-switching diode in a small rectangular SOT23 SMD plastic
package.
Table 1:
Table 2:
Pin
1
2
3
Type number
BAT18
BAT18
Silicon planar diode
Rev. 02 — 31 August 2004
Continuous reverse voltage: max. 35 V
Continuous forward current: max. 100 mA
Low diode capacitance: max. 1.0 pF
Low diode forward resistance: max. 0.7 .
Band switching.
Pinning
Ordering information
Description
anode
not connected
cathode
Package
Name
-
Description
plastic surface mounted package; 3 leads
Simplified outline
1
Product data sheet
3
2
Symbol
1
3
Version
SOT23
sym044
2

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BAT18,235 Summary of contents

Page 1

BAT18 Silicon planar diode Rev. 02 — 31 August 2004 1. Product profile 1.1 General description Planar high performance band-switching diode in a small rectangular SOT23 SMD plastic package. 1.2 Features Continuous reverse voltage: max Continuous forward current: ...

Page 2

Philips Semiconductors 4. Marking Table 3: Type number BAT18 [ made in Hong Kong * = t: made in Malaysia * = W: made in China. 5. Limiting values Table 4: In accordance with the Absolute Maximum ...

Page 3

Philips Semiconductors 100 I F (mA) (1) ( 0.3 0.7 ( typical values typical values maximum values. j Fig ...

Page 4

Philips Semiconductors 8. Package outline Plastic surface mounted package; 3 leads DIMENSIONS (mm are the original dimensions UNIT max. 1.1 0.48 0.15 mm 0.1 0.9 0.38 0.09 OUTLINE VERSION IEC SOT23 Fig ...

Page 5

Philips Semiconductors 9. Revision history Table 7: Revision history Document ID Release date BAT18_2 20040831 • Modifications: The format of this data sheet has been redesigned to comply with the new presentation and information standard of Philips Semiconductors. • Table ...

Page 6

Philips Semiconductors 10. Data sheet status [1] Level Data sheet status Product status I Objective data Development II Preliminary data Qualification III Product data Production [1] Please consult the most recently issued data sheet before initiating or completing a design. ...

Page 7

Philips Semiconductors 14. Contents 1 Product profi 1.1 General description ...

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