PMBD7000,215 NXP Semiconductors, PMBD7000,215 Datasheet
PMBD7000,215
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933859210215
PMBD7000 T/R
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PMBD7000,215 Summary of contents
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PMBD7000 Double high-speed switching diode Rev. 4 — 16 September 2010 1. Product profile 1.1 General description The PMBD7000 consists of two high-speed switching diodes connected in series, fabricated in planar technology, and encapsulated in a small SOT23 (TO-236AB) Surface-Mounted ...
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... NXP Semiconductors 2. Pinning information Table 2. Pin Ordering information Table 3. Type number PMBD7000 4. Marking Table 4. Type number PMBD7000 [ made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China PMBD7000 Product data sheet Pinning Description anode (diode 1) cathode (diode 2) cathode (diode 1), anode (diode 2) ...
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... NXP Semiconductors 5. Limiting values Table 5. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Per diode V RRM FRM I FSM P tot Per device amb T stg [1] Single diode loaded. [2] Double diode loaded °C prior to surge. [ [4] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint ...
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... NXP Semiconductors 7. Characteristics Table 7. ° Symbol Per diode [1] When switched from I [2] When switched from I 300 I F (mA) 200 single diode loaded double diode loaded 100 0 0 100 FR4 PCB, standard footprint Fig 1. Forward current as a function of ambient temperature; derating curve PMBD7000 ...
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... NXP Semiconductors FSM ( − Based on square wave currents °C; prior to surge T j Fig 3. Non-repetitive peak forward current as a function of pulse duration; maximum values = 25 ° MHz; T amb Fig 5. Diode capacitance as a function of reverse voltage; typical values PMBD7000 Product data sheet mbg704 (nA) ...
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... NXP Semiconductors 8. Test information D.U. Ω × ( Fig 6. Reverse recovery time test circuit and waveforms I 450 Ω 1 kΩ Ω D.U.T. Fig 7. Forward recovery voltage test circuit and waveforms 8.1 Quality information This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is suitable for use in automotive applications ...
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... NXP Semiconductors 9. Package outline Fig 8. 10. Packing information Table 8. The indicated -xxx are the last three digits of the 12NC ordering code. Type number Package PMBD7000 [1] For further information and the availability of packing methods, see PMBD7000 Product data sheet 3.0 2.8 2.5 1 ...
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... NXP Semiconductors 11. Soldering 3 1.7 Fig 9. 2.6 4.6 Fig 10. Wave soldering footprint PMBD7000 (SOT23/TO-236AB) PMBD7000 Product data sheet 3.3 2.9 1.9 0.7 (3×) 0.5 (3×) 0.6 (3×) 1 Reflow soldering footprint PMBD7000 (SOT23/TO-236AB) 2.2 1.2 (2×) 1.4 (2×) 1.4 2.8 4.5 All information provided in this document is subject to legal disclaimers. ...
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... Document ID Release date PMBD7000 v.4 20100916 • Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • Table 4 “Marking • Table 7 • ...
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... In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or ...
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... NXP Semiconductors Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. 14. Contact information For more information, please visit: For sales office addresses, please send an email to: ...
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... NXP Semiconductors 15. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics . . . . . . . . . . . . . . . . . . 3 7 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 8 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 6 8.1 Quality information . . . . . . . . . . . . . . . . . . . . . . 6 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7 10 Packing information ...