DIODE DUAL 100V 215MA H-S SOT-23

 

BAV99,235

Manufacturer Part NumberBAV99,235
DescriptionDIODE DUAL 100V 215MA H-S SOT-23
ManufacturerNXP Semiconductors
BAV99,235 datasheets

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Specifications of BAV99,235

Package / CaseSOT-23-3, TO-236-3, Micro3™, SSD3, SST3Voltage - Forward (vf) (max) @ If1.25V @ 150mA
Current - Reverse Leakage @ Vr500nA @ 80VCurrent - Average Rectified (io) (per Diode)215mA (DC)
Voltage - Dc Reverse (vr) (max)100VReverse Recovery Time (trr)4ns
Diode TypeStandardSpeedFast Recovery =< 500ns, > 200mA (Io)
Diode Configuration1 Pair Series ConnectionMounting TypeSurface Mount
ProductSwitching DiodesPeak Reverse Voltage100 V
Forward Continuous Current0.215 AMax Surge Current4 A
ConfigurationDual SeriesRecovery Time4 ns
Forward Voltage Drop1.25 VMaximum Reverse Leakage Current0.5 uA
Operating Temperature Range+ 150 CMaximum Operating Temperature+ 150 C
Minimum Operating Temperature- 65 CMounting StyleSMD/SMT
Lead Free Status / RoHS StatusLead free / RoHS CompliantOther names568-5005-2
933215370235
BAV99 /T3
BAV99 /T3
BAV99,235
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BAV99 series
High-speed switching diodes
Rev. 8 — 18 November 2010
1. Product profile
1.1 General description
High-speed switching diodes, encapsulated in small Surface-Mounted Device (SMD)
plastic packages.
Table 1.
Type number
BAV99
BAV99S
BAV99W
1.2 Features and benefits
High switching speed: t
Low leakage current
Small SMD plastic packages
1.3 Applications
High-speed switching
General-purpose switching
1.4 Quick reference data
Table 2.
Symbol
Per diode
I
R
V
R
t
rr
[1]
When switched from I
Product overview
Package
NXP
JEITA
SOT23
-
SOT363
SC-88
SOT323
SC-70
≤ 4 ns
rr
Quick reference data
Parameter
Conditions
reverse current
V
= 80 V
R
reverse voltage
reverse recovery time
= 10 mA to I
= 10 mA; R
F
R
Product data sheet
Configuration
JEDEC
TO-236AB
dual series
-
quadruple; 2 series
-
dual series
≤ 1.5 pF
Low capacitance: C
d
≤ 100 V
Reverse voltage: V
R
AEC-Q101 qualified
Reverse polarity protection
Min
Typ
-
-
-
-
[1]
-
-
= 100 Ω; measured at I
= 1 mA.
L
R
Package
configuration
small
very small
very small
Max
Unit
μA
0.5
100
V
4
ns

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BAV99,235 Summary of contents

  • Page 1

    BAV99 series High-speed switching diodes Rev. 8 — 18 November 2010 1. Product profile 1.1 General description High-speed switching diodes, encapsulated in small Surface-Mounted Device (SMD) plastic packages. Table 1. Type number BAV99 BAV99S BAV99W 1.2 Features and benefits High ...

  • Page 2

    ... NXP Semiconductors 2. Pinning information Table 3. Pin BAV99; BAV99W BAV99S Ordering information Table 4. Type number BAV99 BAV99S BAV99W 4. Marking Table 5. Type number BAV99 BAV99S BAV99W [ placeholder for manufacturing site code BAV99_SER Product data sheet Pinning Description anode (diode 1) cathode (diode 2) cathode (diode 1), ...

  • Page 3

    ... NXP Semiconductors 5. Limiting values Table 6. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Per diode V RRM FRM I FSM P tot Per device amb T stg [1] Single diode loaded. [2] Double diode loaded °C prior to surge. [ [4] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint ...

  • Page 4

    ... NXP Semiconductors 6. Thermal characteristics Table 7. Symbol R th(j-a) R th(j-sp) [1] Single diode loaded. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [3] Soldering points at pins and 6. 7. Characteristics Table amb Symbol Per diode [1] When switched from I [2] When switched from I BAV99_SER ...

  • Page 5

    ... NXP Semiconductors (mA (1) (2) (3) 1 − 0.2 0.4 0.6 0.8 = 150 °C (1) T amb = 85 °C (2) T amb = 25 °C (3) T amb = −40 °C (4) T amb Fig 1. Forward current as a function of forward voltage; typical values 0 (pF ) 0.6 0.4 0 ° MHz; T amb Fig 3. Diode capacitance as a function of reverse voltage ...

  • Page 6

    ... NXP Semiconductors 8. Test information D.U. Ω × ( Input signal: reverse pulse rise time t Oscilloscope: rise time Fig 5. Reverse recovery time test circuit and waveforms I 450 Ω 1 kΩ Ω D.U.T. Input signal: forward pulse rise time t Fig 6. Forward recovery voltage test circuit and waveforms 8 ...

  • Page 7

    ... NXP Semiconductors 9. Package outline 3.0 2.8 3 2.5 1.4 2.1 1.2 1 1.9 Dimensions in mm Fig 7. Package outline BAV99 (SOT23/TO-236AB) Fig 9. Package outline BAV99W (SOT323/SC-70) 10. Packing information Table 9. The indicated -xxx are the last three digits of the 12NC ordering code. Type number Package ...

  • Page 8

    ... NXP Semiconductors 11. Soldering 3 1.7 Fig 10. Reflow soldering footprint BAV99 (SOT23/TO-236AB) 2.6 4.6 Fig 11. Wave soldering footprint BAV99 (SOT23/TO-236AB) BAV99_SER Product data sheet 3.3 2.9 1.9 0.7 (3×) 0.5 (3×) 0.6 (3×) 1 2.2 1.2 (2×) 1.4 (2×) 1.4 2.8 4.5 All information provided in this document is subject to legal disclaimers. ...

  • Page 9

    ... NXP Semiconductors Fig 12. Reflow soldering footprint BAV99S (SOT363/SC-88) 4.5 Fig 13. Wave soldering footprint BAV99S (SOT363/SC-88) BAV99_SER Product data sheet 2.65 2.35 1.5 0.6 0.5 (4×) (4×) 0.5 (4×) 0.6 (4×) 1.8 1.3 1.3 2.45 5.3 All information provided in this document is subject to legal disclaimers. ...

  • Page 10

    ... NXP Semiconductors Fig 14. Reflow soldering footprint BAV99W (SOT323/SC-70) 3.65 2.1 Fig 15. Wave soldering footprint BAV99W (SOT323/SC-70) BAV99_SER Product data sheet 2.65 1.85 1.325 2 0.6 3 2.35 (3×) 1 0.55 (3×) 4.6 2.575 1.425 (3×) All information provided in this document is subject to legal disclaimers. Rev. 8 — 18 November 2010 ...

  • Page 11

    ... NXP Semiconductors 12. Revision history Table 10. Revision history Document ID Release date BAV99_SER_8 20101118 • Modifications: Section 4 • Section 5 “Limiting • Section 13 “Legal BAV99_SER_7 20100414 BAV99_SER_6 20100310 BAV99_SER_5 20080820 BAV99_4 20011015 BAV99S_3 20010514 BAV99W_4 19990511 BAV99_SER Product data sheet Data sheet status Product data sheet “ ...

  • Page 12

    ... In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or ...

  • Page 13

    ... NXP Semiconductors Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. 14. Contact information For more information, please visit: For sales office addresses, please send an email to: ...

  • Page 14

    ... NXP Semiconductors 15. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics . . . . . . . . . . . . . . . . . . 4 7 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 8 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 6 8.1 Quality information . . . . . . . . . . . . . . . . . . . . . . 6 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7 10 Packing information ...

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