BAS16VY,115 NXP Semiconductors, BAS16VY,115 Datasheet - Page 5

• Manufacturer Part Number: BAS16VY,115
• Description: DIODE SW 100V 200MA H-S SOT363
• Manufacturer: NXP Semiconductors

Specifications of BAS16VY,115

• Package / Case: SC-70-6, SC-88, SOT-363
• Voltage - Forward (vf) (max) @ If: 1.25V @ 150mA
• Current - Reverse Leakage @ Vr: 500nA @ 80V
• Current - Average Rectified (io) (per Diode): 200mA (DC)
• Voltage - Dc Reverse (vr) (max): 100V
• Reverse Recovery Time (trr): 4ns
• Diode Type: Standard
• Speed: Small Signal =< 200mA (Io), Any Speed
• Diode Configuration: 3 Independent
• Mounting Type: Surface Mount
• Product: Switching Diodes
• Peak Reverse Voltage: 100 V
• Forward Continuous Current: 0.2 A
• Max Surge Current: 4 A
• Configuration: Triple Parallel
• Recovery Time: 4 ns
• Forward Voltage Drop: 1.25 V
• Maximum Reverse Leakage Current: 50 uA
• Operating Temperature Range: + 150 C
• Maximum Operating Temperature: + 150 C
• Minimum Operating Temperature: - 65 C
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 934057343115; BAS16VY T/R; BAS16VY T/R

NXP Semiconductors
6. Thermal characteristics
BAS16_SER_5
Product data sheet
Table 6.
In accordance with the Absolute Maximum Rating System (IEC 60134).
[1]
[2]
[3]
[4]
[5]
[6]
[7]
[8]
Table 7.
Symbol
Per device
T
T
T
Symbol
R
R
j
amb
stg
th(j-a)
th(j-t)
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
Device mounted on an FR4 PCB with 60 m copper strip line.
Single diode loaded.
T
Reflow soldering is the only recommended soldering method.
Soldering point of cathode tab.
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm
Soldering points at pins 4, 5 and 6.
j
= 25 C prior to surge.
Limiting values
Thermal characteristics
Parameter
junction temperature
ambient temperature
storage temperature
Parameter
thermal resistance from
junction to ambient
thermal resistance from
junction to tie-point
BAS16
BAS16H
BAS16J
BAS16L
BAS16VV
BAS16W
BAS16
BAS16W
Rev. 05 — 25 August 2008
…continued
Conditions
Conditions
in free air
[2][3]
[3][4]
[3][4]
[2][3]
[2][3]
[3][4]
High-speed switching diodes
[1]
[5]
[5]
[1]
BAS16 series
Min
-
-
-
-
-
-
-
-
-
-
Min
-
65
65
Typ
-
-
-
-
-
-
-
-
-
-
© NXP B.V. 2008. All rights reserved.
Max
150
+150
+150
Max
500
330
150
230
500
700
410
625
330
300
Unit
2
C
C
C
.
Unit
K/W
K/W
K/W
K/W
K/W
K/W
K/W
K/W
K/W
K/W
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