BAT54H,115 NXP Semiconductors, BAT54H,115 Datasheet

DIODE SCHOTTKY 30V 200MA SOD123

BAT54H,115

Manufacturer Part Number
BAT54H,115
Description
DIODE SCHOTTKY 30V 200MA SOD123
Manufacturer
NXP Semiconductors
Datasheet

Specifications of BAT54H,115

Package / Case
SOD-123 Flat Leads
Voltage - Forward (vf) (max) @ If
800mV @ 100mA
Voltage - Dc Reverse (vr) (max)
30V
Current - Average Rectified (io)
200mA (DC)
Current - Reverse Leakage @ Vr
2µA @ 25V
Diode Type
Schottky
Speed
Small Signal =< 200mA (Io), Any Speed
Capacitance @ Vr, F
10pF @ 1V, 1MHz
Mounting Type
Surface Mount
Product
Schottky Diodes
Peak Reverse Voltage
30 V
Forward Continuous Current
0.2 A
Max Surge Current
0.6 A
Configuration
Single
Forward Voltage Drop
0.8 V @ 0.1 A
Maximum Reverse Leakage Current
2 uA @ 25 V
Operating Temperature Range
+ 125 C
Mounting Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Reverse Recovery Time (trr)
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
568-3415-2
934059278115
BAT54H T/R
1. Product profile
2. Pinning information
1.1 General description
1.2 Features
1.3 Applications
1.4 Quick reference data
Planar Schottky barrier single diode with an integrated guard ring for stress protection,
encapsulated in a SOD123F small and flat lead SMD plastic package.
Table 1.
[1]
Table 2.
[1]
Symbol
I
V
V
Pin
1
2
F
R
F
BAT54H
Schottky barrier single diode in small SOD123F package
Rev. 02 — 13 January 2010
Low forward voltage
Small and flat lead SMD plastic package
Low capacitance
Flat leads: excellent coplanarity and improved thermal behavior
Ultra high-speed switching
Voltage clamping
Line termination
Inverse-polarity protection
Pulse test: t
The marking bar indicates the cathode.
Quick reference data
Pinning
Parameter
forward current
reverse voltage
forward voltage
p
cathode
anode
Description
≤ 300 μs; δ ≤ 0.02.
Conditions
I
F
= 10 mA
[1]
Simplified outline
1
[1]
Min
-
-
-
2
Typ
-
-
-
Product data sheet
Symbol
Max
200
30
400
1
sym001
2
mA
V
Unit
mV

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BAT54H,115 Summary of contents

Page 1

BAT54H Schottky barrier single diode in small SOD123F package Rev. 02 — 13 January 2010 1. Product profile 1.1 General description Planar Schottky barrier single diode with an integrated guard ring for stress protection, encapsulated in a SOD123F small and ...

Page 2

... NXP Semiconductors 3. Ordering information Table 3. Type number BAT54H 4. Marking Table 4. Type number BAT54H 5. Limiting values Table 5. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol FRM I FSM P tot amb T stg [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint ...

Page 3

... NXP Semiconductors 7. Characteristics Table amb Symbol [1] Pulse test: t BAT54H_2 Product data sheet Schottky barrier single diode in SOD123F package Characteristics ° C unless otherwise specified. Parameter Conditions forward voltage 100 mA F reverse current diode capacitance MHz R ≤ 300 μs; δ ≤ 0.02. ...

Page 4

... NXP Semiconductors (mA (1) (2) (3) 1 − 0.4 = 125 °C (1) T amb = 85 °C (2) T amb = 25 °C (3) T amb Fig 1. Forward current as a function of forward voltage; typical values = 25 ° MHz T amb Fig 3. Diode capacitance as a function of reverse voltage; typical values BAT54H_2 Product data sheet ...

Page 5

... NXP Semiconductors 8. Package outline Fig 4. 9. Packing information Table 8. The indicated -xxx are the last three digits of the 12NC ordering code. Type number Package BAT54H [1] For further information and the availability of packing methods, see 10. Soldering Fig 5. BAT54H_2 Product data sheet Schottky barrier single diode in SOD123F package 3 ...

Page 6

... Revision history Document ID Release date BAT54H_2 20100113 • Modifications: This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content. BAT54H_1 20050407 BAT54H_2 Product data sheet Schottky barrier single diode in SOD123F package ...

Page 7

... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...

Page 8

... NXP Semiconductors 14. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics . . . . . . . . . . . . . . . . . . 2 7 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 5 9 Packing information . . . . . . . . . . . . . . . . . . . . . 5 10 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 11 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 6 12 Legal information ...

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