BAS70H,115 NXP Semiconductors, BAS70H,115 Datasheet
BAS70H,115
Specifications of BAS70H,115
934059279115
BAS70H T/R
Related parts for BAS70H,115
BAS70H,115 Summary of contents
Page 1
BAS70 series; 1PS7xSB70 series General-purpose Schottky diodes Rev. 09 — 13 January 2010 1. Product profile 1.1 General description General-purpose Schottky diodes in small Surface-Mounted Device (SMD) plastic packages. Table 1. Type number 1PS76SB70 1PS79SB70 BAS70 BAS70H BAS70L BAS70W BAS70-04 ...
Page 2
... NXP Semiconductors 1.4 Quick reference data Table 2. Symbol Per diode [1] Pulse test Pinning information Table 3. Pin BAS70H; 1PS76SB70; 1PS79SB70 1 2 BAS70L 1 2 BAS70; BAS70W BAS70-04; BAS70-04W BAS70_1PS7XSB70_SER_9 Product data sheet BAS70 series; 1PS7xSB70 series Quick reference data Parameter Conditions forward current ...
Page 3
... NXP Semiconductors Table 3. Pin BAS70-05; BAS70-05W BAS70-06; BAS70-06W BAS70- BAS70-07S; BAS70-07V BAS70VV BAS70_1PS7XSB70_SER_9 Product data sheet BAS70 series; 1PS7xSB70 series Pinning …continued Description anode (diode 1) anode (diode 2) cathode (diode 1), cathode (diode 2) cathode (diode 1) cathode (diode 2) anode (diode 1), anode (diode 2) cathode (diode 1) ...
Page 4
... NXP Semiconductors Table 3. Pin BAS70XY [1] The marking bar indicates the cathode. 3. Ordering information Table 4. Type number 1PS76SB70 1PS79SB70 BAS70 BAS70H BAS70L BAS70W BAS70-04 BAS70-04W BAS70-05 BAS70-05W BAS70-06 BAS70-06W BAS70-07 BAS70-07S BAS70-07V BAS70VV BAS70XY BAS70_1PS7XSB70_SER_9 Product data sheet BAS70 series; 1PS7xSB70 series Pinning … ...
Page 5
... NXP Semiconductors 4. Marking Table 5. Type number 1PS76SB70 1PS79SB70 BAS70 BAS70H BAS70L BAS70W BAS70-04 BAS70-04W BAS70-05 [ made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China 5. Limiting values Table 6. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Per diode ...
Page 6
... NXP Semiconductors 6. Thermal characteristics Table 7. Symbol Per device R th(j-a) R th(j-sp) [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. [2] Reflow soldering is the only recommended soldering method. [3] Soldering point at pins and 6. 7. Characteristics Table amb Symbol Per diode ...
Page 7
... NXP Semiconductors (mA −1 10 (1) (2) (3) (4) − 0.2 0.4 = 125 °C (1) T amb = 85 °C (2) T amb = 25 °C (3) T amb = −40 °C (4) T amb Fig 1. Forward current as a function of forward voltage; typical values dif (Ω − kHz Fig 3. Differential forward resistance as a function of forward current ...
Page 8
... NXP Semiconductors 8. Package outline 1.35 1.15 1 2.7 1.8 2.3 1.6 2 0.40 0.25 Dimensions in mm Fig 5. Package outline SOD323 (SC-76) 3.0 2.8 3 2.5 1.4 2.1 1.2 1 1.9 Dimensions in mm Fig 7. Package outline SOT23 (TO-236AB) 0.62 0.55 2 0.30 0.22 0.65 0.30 0.22 1 0.55 cathode marking on top side 0 ...
Page 9
... NXP Semiconductors 3.0 2.8 1.9 4 2.5 1.4 2.1 1.2 1 0.88 0.78 1.7 Dimensions in mm Fig 11. Package outline SOT143B Fig 13. Package outline SOT666 BAS70_1PS7XSB70_SER_9 Product data sheet BAS70 series; 1PS7xSB70 series 1.1 0.9 3 0.45 0.15 2.2 2.0 2 0.48 0.15 0.38 0.09 Dimensions in mm 04-11-16 Fig 12 ...
Page 10
... NXP Semiconductors 9. Packing information Table 9. The indicated -xxx are the last three digits of the 12NC ordering code. Type number Package 1PS76SB70 1PS79SB70 BAS70 BAS70H BAS70L BAS70W BAS70-04 BAS70-04W BAS70-05 BAS70-05W BAS70-06 BAS70-06W BAS70-07 BAS70-07S BAS70-07V BAS70VV BAS70XY [1] For further information and the availability of packing methods, see ...
Page 11
... NXP Semiconductors 10. Soldering Fig 14. Reflow soldering footprint SOD323 (SC-76) Fig 15. Wave soldering footprint SOD323 (SC-76) Fig 16. Reflow soldering footprint SOD523 (SC-79) BAS70_1PS7XSB70_SER_9 Product data sheet BAS70 series; 1PS7xSB70 series 3.05 2.80 2.10 1.60 1.65 0.95 0.50 (2×) Dimensions in mm 5.00 4.40 1 ...
Page 12
... NXP Semiconductors Fig 17. Reflow soldering footprint SOT23 (TO-236AB) 4.60 4.00 Fig 18. Wave soldering footprint SOT23 (TO-236AB) BAS70_1PS7XSB70_SER_9 Product data sheet BAS70 series; 1PS7xSB70 series 2.90 2.50 2 0.85 3.00 1.30 0.85 3 1.00 3.30 Dimensions in mm 3.40 1.20 (2x) 2 1.20 3 2.80 4.50 Dimensions in mm Rev. 09 — ...
Page 13
... NXP Semiconductors Fig 19. Reflow soldering footprint SOD123F Fig 20. Reflow soldering footprint SOD882 BAS70_1PS7XSB70_SER_9 Product data sheet BAS70 series; 1PS7xSB70 series 4.4 4 2.9 1.6 2.1 1.6 1.1 (2×) Reflow soldering is the only recommended soldering method. Dimensions 0.05 (8×) 0.90 0.30 solder lands (2× ...
Page 14
... NXP Semiconductors Fig 21. Reflow soldering footprint SOT323 (SC-70) Fig 22. Wave soldering footprint SOT323 (SC-70) BAS70_1PS7XSB70_SER_9 Product data sheet BAS70 series; 1PS7xSB70 series 2.65 0.75 1.30 3 0.60 2.35 0.85 (3×) 0.55 (3×) 2.40 Dimensions in mm 4.60 4.00 1. 3.65 2.10 1 preferred transport direction during soldering Dimensions in mm Rev. 09 — ...
Page 15
... NXP Semiconductors Fig 23. Reflow soldering footprint SOT143B Fig 24. Wave soldering footprint SOT143B BAS70_1PS7XSB70_SER_9 Product data sheet BAS70 series; 1PS7xSB70 series 3.25 0.60 (3x) 0.50 (3x) 0.60 (4x) 4 2.70 1 0.90 1.00 2.50 Dimensions in mm 4.45 1.20 (3× 1.00 3.40 Dimensions in mm Rev. 09 — 13 January 2010 ...
Page 16
... NXP Semiconductors Fig 25. Reflow soldering footprint SOT363 (SC-88) 4.5 Fig 26. Wave soldering footprint SOT363 (SC-88) BAS70_1PS7XSB70_SER_9 Product data sheet BAS70 series; 1PS7xSB70 series 2.35 0.50 solder paste (4×) solder lands solder resist occupied area Dimensions in mm 1.3 1.3 2.45 5.3 Rev. 09 — 13 January 2010 General-purpose Schottky diodes 2 ...
Page 17
... NXP Semiconductors 2 1.7 Fig 27. Reflow soldering footprint SOT666 BAS70_1PS7XSB70_SER_9 Product data sheet BAS70 series; 1PS7xSB70 series 2.75 2.45 2.1 1.6 0.538 0.55 1.075 (2×) 1.7 0.45 (4×) 0.5 (4×) Reflow soldering is the only recommended soldering method. Rev. 09 — 13 January 2010 General-purpose Schottky diodes ...
Page 18
... BAS70 series; 1PS7xSB70 series Data sheet status Product data sheet • This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content. Product data sheet Product data sheet ...
Page 19
... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
Page 20
... NXP Semiconductors 14. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 2 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 4 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 5 Limiting values Thermal characteristics . . . . . . . . . . . . . . . . . . 6 7 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 6 8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8 9 Packing information . . . . . . . . . . . . . . . . . . . . 10 10 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 11 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 18 12 Legal information ...