PMEG2005EJ,115 NXP Semiconductors, PMEG2005EJ,115 Datasheet - Page 10

• Manufacturer Part Number: PMEG2005EJ,115
• Description: SCHOTTKY RECT 20V 0.5A SOT323F
• Manufacturer: NXP Semiconductors

Specifications of PMEG2005EJ,115

• Package / Case: SC-90, SOD-323F
• Voltage - Forward (vf) (max) @ If: 390mV @ 500mA
• Voltage - Dc Reverse (vr) (max): 20V
• Current - Average Rectified (io): 500mA (DC)
• Current - Reverse Leakage @ Vr: 200µA @ 20V
• Diode Type: Schottky
• Speed: Fast Recovery =< 500ns, > 200mA (Io)
• Capacitance @ Vr, F: 80pF @ 1V, 1MHz
• Mounting Type: Surface Mount
• Product: Schottky Diodes
• Peak Reverse Voltage: 20 V
• Forward Continuous Current: 0.5 A
• Max Surge Current: 10 A
• Configuration: Single
• Forward Voltage Drop: 0.33 V
• Maximum Reverse Leakage Current: 200 uA
• Maximum Power Dissipation: 360 mW
• Operating Temperature Range: + 150 C
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Reverse Recovery Time (trr): -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-4110-2; 934059001115; PMEG2005EJ T/R; PMEG2005EJ T/R

NXP Semiconductors
10. Soldering
PMEGXX05EH_EJ_SER_2
Product data sheet
Fig 12. Reflow soldering footprint SOD123F
Fig 13. Reflow soldering footprint SOD323F (SC-90)
2.1
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Reflow soldering is the only recommended soldering method.
Dimensions in mm
1.65
1.6
0.95
(2×)
1.1
Rev. 02 — 13 January 2010
0.50
(2×)
4.4
2.9
1.6
4
3.05
2.80
2.10
1.60
0.5 A very low V
PMEGxx05EH/EJ series
0.50
msa433
1.1 1.2
0.60
F
MEGA Schottky barrier rectifiers
solder lands
solder resist
occupied area
solder paste
© NXP B.V. 2010. All rights reserved.
solder lands
solder resist
solder paste
occupied area
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