PMEG4005EH,115 NXP Semiconductors, PMEG4005EH,115 Datasheet
PMEG4005EH,115
Specifications of PMEG4005EH,115
934059025115
PMEG4005EH T/R
PMEG4005EH T/R
Related parts for PMEG4005EH,115
PMEG4005EH,115 Summary of contents
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PMEGxx05EH/EJ series 0.5 A very low V Rev. 02 — 13 January 2010 1. Product profile 1.1 General description Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection encapsulated in small SMD ...
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... NXP Semiconductors 1.4 Quick reference data Table 2. Symbol [1] Pulse test Pinning information Table 3. Pin 1 2 [1] The marking bar indicates the cathode. 3. Ordering information Table 4. Type number PMEG2005EH PMEG3005EH PMEG4005EH PMEG2005EJ PMEG3005EJ PMEG4005EJ PMEGXX05EH_EJ_SER_2 Product data sheet PMEGxx05EH/EJ series 0.5 A very low V ...
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... NXP Semiconductors 4. Marking Table 5. Type number PMEG2005EH PMEG3005EH PMEG4005EH PMEG2005EJ PMEG3005EJ PMEG4005EJ 5. Limiting values Table 6. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter FRM I FSM P tot amb T stg [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint ...
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... NXP Semiconductors 6. Thermal characteristics Table 7. Symbol R th(j-a) R th(j-sp) [1] Schottky barrier diodes thermal run-away has to be considered some applications the reverse power losses P losses P [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm ...
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... NXP Semiconductors 7. Characteristics Table amb Symbol [1] Pulse test: t [2] Schottky barrier rectifier thermal run-away has to be considered some applications the reverse power losses P losses P PMEGXX05EH_EJ_SER_2 Product data sheet PMEGxx05EH/EJ series 0.5 A very low V Characteristics ° C unless otherwise specified. Parameter Conditions forward voltage ...
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... NXP Semiconductors (mA (1) (2) (3) ( −1 10 − 0.1 0.2 = 150 °C (1) T amb = 125 °C (2) T amb = 85 °C (3) T amb = 25 °C (4) T amb = −40 °C (5) T amb Fig 1. PMEG2005EH, PMEG2005EJ: Forward current as a function of forward voltage; typical values = 25 ° MHz T amb Fig 3. ...
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... NXP Semiconductors (mA (1) (2) (3) ( −1 10 − 0.1 0.2 = 150 °C (1) T amb = 125 °C (2) T amb = 85 °C (3) T amb = 25 °C (4) T amb = −40 °C (5) T amb Fig 4. PMEG3005EH, PMEG3005EJ: Forward current as a function of forward voltage; typical values = 25 ° MHz T amb Fig 6. ...
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... NXP Semiconductors (mA (1) (2) (3) ( −1 10 − 0.1 0.2 0.3 = 150 °C (1) T amb = 125 °C (2) T amb = 85 °C (3) T amb = 25 °C (4) T amb = −40 °C (5) T amb Fig 7. PMEG4005EH, PMEG4005EJ: Forward current as a function of forward voltage; typical values = 25 ° MHz T amb Fig 9. PMEG4005EH, PMEG4005EJ: Diode capacitance as a function of reverse voltage ...
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... NXP Semiconductors 8. Package outline 1.7 1.5 1 3.6 2.7 3.4 2.5 2 0.70 0.55 Dimensions in mm Fig 10. Package outline SOD123F 9. Packing information Table 9. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code. Type number Package PMEG2005EH SOD123F PMEG3005EH ...
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... NXP Semiconductors 10. Soldering Fig 12. Reflow soldering footprint SOD123F Fig 13. Reflow soldering footprint SOD323F (SC-90) PMEGXX05EH_EJ_SER_2 Product data sheet 0.5 A very low V 4.4 4 2.9 1.6 2.1 1.6 1.1 (2×) Reflow soldering is the only recommended soldering method. Dimensions in mm 3.05 2.80 2.10 1.60 1 ...
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... PMEGxx05EH/EJ series 0.5 A very low V Data sheet status Product data sheet This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content. Product data sheet Rev. 02 — 13 January 2010 ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 14. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 2 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 5 Limiting values Thermal characteristics . . . . . . . . . . . . . . . . . . 4 7 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 5 8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9 9 Packing information . . . . . . . . . . . . . . . . . . . . . 9 10 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 11 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 11 12 Legal information ...