PMEG2010AEJ,115 NXP Semiconductors, PMEG2010AEJ,115 Datasheet
PMEG2010AEJ,115
Specifications of PMEG2010AEJ,115
934059006115
PMEG2010AEJ T/R
PMEG2010AEJ T/R
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PMEG2010AEJ,115 Summary of contents
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PMEG2010AEJ very low V SOD323F package Rev. 03 — 15 January 2010 1. Product profile 1.1 General description Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated ...
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... NXP Semiconductors 2. Pinning information Table 2. Pin 1 2 [1] The marking bar indicates the cathode. 3. Ordering information Table 3. Type number PMEG2010AEJ 4. Marking Table 4. Type number PMEG2010AEJ 5. Limiting values Table 5. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter V reverse voltage ...
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... NXP Semiconductors 6. Thermal characteristics Table 6. Symbol R th(j-a) R th(j-sp) [1] For Schottky barrier diodes thermal runaway has to be considered some applications the reverse power losses P power losses P [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm [4] Solder point of cathode tab ...
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... NXP Semiconductors (mA ( (2) 10 (3) 1 (4) (5) −1 10 − 0.1 0.2 0.3 0.4 = 150 °C (1) T amb = 125 °C (2) T amb = 85 °C (3) T amb = 25 °C (4) T amb = −40 °C (5) T amb Fig 1. Forward current as a function of forward voltage; typical values = 25 ° MHz T amb Fig 3. Diode capacitance as a function of reverse voltage ...
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... NXP Semiconductors 8. Package outline Fig 4. Package outline SOD323F (SC-90) 9. Packing information Table 8. The indicated -xxx are the last three digits of the 12NC ordering code. Type number PMEG2010AEJ [1] For further information and the availability of packing methods, see 10. Soldering Reflow soldering is the only recommended soldering method. ...
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... NXP Semiconductors 11. Mounting Dimensions in mm PCB thickness 1.6 mm Fig 6. FR4 PCB, standard footprint SOD323F (SC-90) PMEG2010AEJ_3 Product data sheet very low V 43.4 0.6 0.6 0.6 40 0.6 0.5 006aaa487 Rev. 03 — 15 January 2010 PMEG2010AEJ MEGA Schottky barrier rectifier F 43 0.6 0.5 0.6 Dimensions in mm PCB thickness ...
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... Table 9. Revision history Document ID Release date PMEG2010AEJ_3 20100115 • Modifications: This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content. PMEG2010AEJ_2 20051014 PMEG2010AEJ_1 20050302 PMEG2010AEJ_3 Product data sheet ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 15. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics . . . . . . . . . . . . . . . . . . 3 7 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 5 9 Packing information . . . . . . . . . . . . . . . . . . . . . 5 10 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 11 Mounting Revision history ...