PMEG1020EJ,115 NXP Semiconductors, PMEG1020EJ,115 Datasheet
PMEG1020EJ,115
Specifications of PMEG1020EJ,115
934058255115
PMEG1020EJ T/R
PMEG1020EJ T/R
Related parts for PMEG1020EJ,115
PMEG1020EJ,115 Summary of contents
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PMEG1020EH; PMEG1020EJ ultra low V Rev. 04 — 15 January 2010 1. Product profile 1.1 General description Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifiers with an integrated guard ring for stress protection, encapsulated in ...
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... NXP Semiconductors 2. Pinning information Table 3. Pin 1 2 [1] The marking bar indicates the cathode. 3. Ordering information Table 4. Type number PMEG1020EH PMEG1020EJ 4. Marking Table 5. Type number PMEG1020EH PMEG1020EJ 5. Limiting values Table 6. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol FRM ...
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... NXP Semiconductors Table 6. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol T amb T stg [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode ...
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... NXP Semiconductors (mA (1) (3) ( 100 200 = 85 °C (1) T amb = 25 °C (2) T amb = −40 °C (3) T amb Fig 1. Forward current as a function of forward voltage; typical values = 25 ° MHz T amb Fig 3. Diode capacitance as a function of reverse voltage; typical values PMEG1020EH_EJ_4 Product data sheet PMEG1020EH; PMEG1020EJ ...
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... NXP Semiconductors 8. Package outline 1.7 1.5 1 3.6 2.7 3.4 2.5 2 0.70 0.55 Dimensions in mm Fig 4. Package outline SOD123F 9. Packing information Table 9. The indicated -xxx are the last three digits of the 12NC ordering code. Type number PMEG1020EH PMEG1020EJ [1] For further information and the availability of packing methods, see ...
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... NXP Semiconductors 10. Soldering 2.1 Reflow soldering is the only recommended soldering method. Dimensions in mm Fig 6. Reflow soldering footprint SOD123F Reflow soldering is the only recommended soldering method. Dimensions in mm Fig 7. Reflow soldering footprint SOD323F (SC-90) PMEG1020EH_EJ_4 Product data sheet PMEG1020EH; PMEG1020EJ ultra low V 4 ...
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... Revision history Table 10. Revision history Document ID Release date PMEG1020EH_EJ_4 20100115 • Modifications: This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content. PMEG1020EH_EJ_3 20050414 PMEG1020EJ_2 20041001 PMEG1020EH_1 20050203 ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 14. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics . . . . . . . . . . . . . . . . . . 3 7 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 5 9 Packing information . . . . . . . . . . . . . . . . . . . . . 5 10 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 11 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 7 12 Legal information ...