PMEG3015EJ,115 NXP Semiconductors, PMEG3015EJ,115 Datasheet
PMEG3015EJ,115
Specifications of PMEG3015EJ,115
934059004115
PMEG3015EJ T/R
PMEG3015EJ T/R
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PMEG3015EJ,115 Summary of contents
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PMEG3015EH; PMEG3015EJ 30 V, 1.5 A ultra low V Rev. 03 — 13 January 2010 1. Product profile 1.1 General description Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifiers with an integrated guard ring for stress protection, encapsulated in ...
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... NXP Semiconductors 2. Pinning information Table 3. Pin 1 2 [1] The marking bar indicates the cathode. 3. Ordering information Table 4. Type number PMEG3015EH PMEG3015EJ 4. Marking Table 5. Type number PMEG3015EH PMEG3015EJ 5. Limiting values Table 6. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter ...
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... NXP Semiconductors Table 6. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter T amb T stg [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1cm 6 ...
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... NXP Semiconductors (mA (1) (2) (3) ( − 0.1 0.2 0.3 = 150 °C (1) T amb = 125 °C (2) T amb = 85 °C (3) T amb = 25 °C (4) T amb = −40 °C (5) T amb Fig 1. Forward current as a function of forward voltage; typical values = 25 ° MHz T amb Fig 3. Diode capacitance as a function of reverse voltage; typical values ...
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... NXP Semiconductors 8. Package outline 1.7 1.5 1 3.6 2.7 3.4 2.5 2 0.70 0.55 Dimensions in mm Fig 4. Package outline SOD123F 9. Packing information Table 9. The indicated -xxx are the last three digits of the 12NC ordering code. Type number PMEG3015EH PMEG3015EJ [1] For further information and the availability of packing methods, see ...
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... NXP Semiconductors 10. Soldering Fig 6. Fig 7. PMEG3015EH_EJ_3 Product data sheet PMEG3015EH; PMEG3015EJ 30 V, 1.5 A ultra low V 4.4 4 2.9 1.6 2.1 1.6 1.1 (2×) Reflow soldering is the only recommended soldering method. Dimensions in mm Reflow soldering footprint SOD123F 3.05 2.80 2.10 1.60 1.65 0.95 0.50 (2× ...
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... Table 10. Revision history Document ID Release date PMEG3015EH_EJ_3 20100113 • Modifications: This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content. PMEG3015EH_EJ_2 20050408 PMEG3015EJ_1 20050303 PMEG3015EH_EJ_3 Product data sheet PMEG3015EH ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 14. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics . . . . . . . . . . . . . . . . . . 3 7 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 5 9 Packing information . . . . . . . . . . . . . . . . . . . . . 5 10 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 11 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 7 12 Legal information ...