PMEG2010ET,215 NXP Semiconductors, PMEG2010ET,215 Datasheet
PMEG2010ET,215
Specifications of PMEG2010ET,215
934061048215
PMEG2010ET T/R
Related parts for PMEG2010ET,215
PMEG2010ET,215 Summary of contents
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PMEG2010EH; PMEG2010EJ; PMEG2010ET 1 A very low V Rev. 04 — 20 March 2007 1. Product profile 1.1 General description Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifiers with an integrated guard ring for stress protection, encapsulated in small ...
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... NXP Semiconductors 2. Pinning information Table 3. Pin SOD123F; SOD323F 1 2 SOT23 [1] The marking bar indicates the cathode. 3. Ordering information Table 4. Type number PMEG2010EH PMEG2010EJ PMEG2010ET 4. Marking Table 5. Type number PMEG2010EH PMEG2010EJ PMEG2010ET [ made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China ...
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... NXP Semiconductors 5. Limiting values Table 6. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol FRM I FSM P tot amb T stg [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm ...
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... NXP Semiconductors 6. Thermal characteristics Table 7. Symbol R th(j-a) R th(j-sp) [1] For Schottky barrier diodes thermal runaway has to be considered some applications the reverse power losses P [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm [4] Soldering point of cathode tab ...
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... NXP Semiconductors (mA (1) (2) (3) ( 0.1 0.2 ( 150 C amb ( 125 C amb ( amb ( amb ( amb Fig 1. Forward current as a function of forward voltage; typical values MHz amb Fig 3. Diode capacitance as a function of reverse voltage; typical values PMEG2010EH_EJ_ET_4 Product data sheet 1 A very low V 006aaa247 ...
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... NXP Semiconductors 8. Test information Fig 4. Duty cycle definition 9. Package outline 1.7 1.5 1 3.6 2.7 3.4 2.5 2 0.70 0.55 Dimensions in mm Fig 5. Package outline SOD123F Fig 7. Package outline SOT23 (TO-236AB) PMEG2010EH_EJ_ET_4 Product data sheet 1 A very low 1.2 1.0 0.55 0.35 0.25 ...
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... NXP Semiconductors 10. Packing information Table 9. The indicated -xxx are the last three digits of the 12NC ordering code. Type number PMEG2010EH PMEG2010EJ PMEG2010ET [1] For further information and the availability of packing methods, see 11. Soldering Fig 8. Reflow soldering footprint SOD123F Fig 9. Reflow soldering footprint SOD323F (SC-90) ...
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... NXP Semiconductors Fig 10. Reflow soldering footprint SOT23 (TO-236AB) 4.60 Fig 11. Wave soldering footprint SOT23 (TO-236AB) PMEG2010EH_EJ_ET_4 Product data sheet 1 A very low V 2.90 2.50 0.85 2 3.00 1.30 0.85 3 0.50 (3x) 0.60 (3x) 1.00 3.30 3.40 1.20 (2x 4.00 1.20 3 2.80 4.50 Rev. 04 — 20 March 2007 PMEG2010EH/EJ/ET MEGA Schottky barrier rectifi ...
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... Data sheet status Product data sheet The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. Legal texts have been adapted to the new company name where appropriate. Type numbers PMEG2010EH and PMEG2010EJ separated from data sheet ...
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... For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail ...
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... NXP Semiconductors 15. Contents 1 Product profi 1.1 General description 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 8 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 6 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6 10 Packing information Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 12 Revision history ...