TFA9800J NXP Semiconductors, TFA9800J Datasheet - Page 14

• Manufacturer Part Number: TFA9800J
• Description: Audio Amplifiers 2X6W AUDIO AMPLIFIER
• Manufacturer: NXP Semiconductors

Specifications of TFA9800J

• Product: Class-AB
• Output Power: 7 W
• Available Set Gain: 20 dB
• Thd Plus Noise: 0.1 %
• Operating Supply Voltage: 15 V
• Maximum Power Dissipation: 25000 mW
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• Audio Load Resistance: 4 Ohms
• Input Signal Type: Differential
• Minimum Operating Temperature: - 40 C
• Output Signal Type: Single
• Supply Type: Single
• Supply Voltage (max): 18 V
• Supply Voltage (min): 6 V
• Output Type: 2-Channel Stereo
• Package / Case: DBSP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: TFA9800J/N1,112

Philips Semiconductors
14. Soldering
TFA9800J_1
Preliminary data sheet
14.1 Introduction to soldering through-hole mount packages
14.2 Soldering by dipping or by solder wave
14.3 Manual soldering
14.4 Package related soldering information
This text gives a brief insight to wave, dip and manual soldering. A more in-depth account
of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages
(document order number 9398 652 90011).
Wave soldering is the preferred method for mounting of through-hole mount IC packages
on a printed-circuit board.
Driven by legislation and environmental forces the worldwide use of lead-free solder
pastes is increasing. Typical dwell time of the leads in the wave ranges from
3 seconds to 4 seconds at 250 C or 265 C, depending on solder material applied, SnPb
or Pb-free respectively.
The total contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the plastic
body must not exceed the specified maximum storage temperature (T
printed-circuit board has been pre-heated, forced cooling may be necessary immediately
after soldering to keep the temperature within the permissible limit.
Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the
seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is
less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is
between 300 C and 400 C, contact may be up to 5 seconds.
Table 9:
[1]
[2]
Package
CPGA, HCPGA
DBS, DIP, HDIP, RDBS, SDIP, SIL
PMFP
For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit
board.
For PMFP packages hot bar soldering or manual soldering is suitable.
[2]
Suitability of through-hole mount IC packages for dipping and wave soldering
methods
Rev. 01 — 17 March 2006
Soldering method
Dipping
-
suitable
-
2
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
7 W stereo power amplifier
Wave
suitable
suitable
not suitable
TFA9800J
stg(max)
[1]
). If the
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