TDA1517ATWDH-T NXP Semiconductors, TDA1517ATWDH-T Datasheet - Page 16

• Manufacturer Part Number: TDA1517ATWDH-T
• Description: Audio Amplifiers W BTL/2X4 W SE AMP
• Manufacturer: NXP Semiconductors

Specifications of TDA1517ATWDH-T

• Product: Class-AB
• Output Power: 8 W
• Available Set Gain: 26 dB
• Thd Plus Noise: 0.03 %
• Operating Supply Voltage: 12 V
• Maximum Power Dissipation: 5000 mW
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Audio Load Resistance: 8 Ohms
• Input Signal Type: Differential
• Minimum Operating Temperature: - 40 C
• Output Signal Type: Differential, Single
• Supply Type: Single
• Supply Voltage (max): 18 V
• Supply Voltage (min): 6 V
• Output Type: 1-Channel Mono or 2-Channel Stereo
• Package / Case: SOT-527
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: TDA1517ATW/N1,118

NXP Semiconductors
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
2001 Apr 17
BGA, HBGA, LFBGA, SQFP, TFBGA
HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN, SMS
PLCC
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
8 W BTL or 2 × 4 W SE power amplifier
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
The package footprint must incorporate solder thieves downstream and at the side corners.
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
(3)
, SO, SOJ
PACKAGE
16
not suitable
suitable
not recommended
not recommended
not suitable
WAVE
(2)
SOLDERING METHOD
(3)(4)
(5)
TDA1517ATW
suitable
suitable
suitable
suitable
suitable
Product specification
REFLOW
(1)