Comparator ICs 1 CHAN CLASS D AMP 1X15W

TDA8931T

Manufacturer Part NumberTDA8931T
DescriptionComparator ICs 1 CHAN CLASS D AMP 1X15W
ManufacturerNXP Semiconductors
TDA8931T datasheet
 

Specifications of TDA8931T

Number Of Channels1 ChannelProductDigital Comparators
Response Time0.12 usOffset Voltage (max)10 mV
Input Bias Current (max)0.06 uASupply Voltage (max)35 V
Supply Voltage (min)12 VMaximum Power Dissipation2500 mW
Maximum Operating Temperature+ 85 CMounting StyleSMD/SMT
Package / CaseSOT-163Minimum Operating Temperature- 40 C
Lead Free Status / RoHS StatusLead free / RoHS CompliantOther namesTDA8931T/N1,112
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TDA8931
Power comparator 1
Rev. 01 — 14 January 2004
1. General description
The TDA8931 is a switching power stage for high efficiency class-D audio power amplifier
systems.
It contains a Single-Ended (SE) power stage, drive logic, protection control logic, a full
differential input comparator and a HVP charger to charge the SE capacitor. With this
amplifier a compact 1
built. The TDA8931 has a high efficiency so that a heat sink is not required up to
20 W (RMS). The system operates on an asymmetrical and a symmetrical supply voltage.
2. Features
High efficiency
Operating voltage asymmetrical from 12 V to 35 V
Operating voltage symmetrical from 6 V to 17.5 V
Thermally protected
No heat sink required
Charger for single-ended capacitor
No pop sound
3. Applications
Flat panel television sets
Flat panel monitors
Multimedia systems
Wireless speakers
Micro systems
4. Quick reference data
Table 1:
Symbol Parameter
General
V
P
I
q
I
stb
I
sleep
20 W
20 W closed loop self-oscillating digital amplifier system can be
Quick reference data
Conditions
operating supply
asymmetrical
voltage
symmetrical
quiescent current
Operating mode; V
standby current
Standby mode; V
sleep current
Sleep mode; V
Preliminary data sheet
Min
Typ
12
22
6
11
= 22 V
-
20
P
= 22 V
-
10
P
= 22 V
-
100
P
Max
Unit
35
V
17.5 V
30
mA
15
mA
200
A

TDA8931T Summary of contents

  • Page 1

    TDA8931 Power comparator 1 Rev. 01 — 14 January 2004 1. General description The TDA8931 is a switching power stage for high efficiency class-D audio power amplifier systems. It contains a Single-Ended (SE) power stage, drive logic, protection control logic, ...

  • Page 2

    ... Philips Semiconductors Table 1: Symbol Parameter SE channel Ordering information Table 2: Type number TDA8931T 9397 750 13847 Preliminary data sheet Quick reference data …continued Conditions efficiency maximum output power THD = THD = Ordering information Package Name Description SO20 plastic small outline package; 20 leads; body width 7.5 mm SOT163-1 Rev. 01 — ...

  • Page 3

    Philips Semiconductors 6. Block diagram POWERUP Fig 1. Block diagram 9397 750 13847 Preliminary data sheet TDA8931 5 V DDA 4 INP comparator 3 INN 2 V SSA 6 7 ENABLE 9 CGND ODP CONTROL OTP OCP 12 OVP OVP ...

  • Page 4

    Philips Semiconductors 7. Pinning information 7.1 Pinning Fig 2. Pin configuration 7.2 Pin description Table 3: Symbol V SSD V SSA INN INP V DDA POWERUP ENABLE DIAG CGND V SSD V SSD OVP HVP STABI V SSP OUT BOOT ...

  • Page 5

    Philips Semiconductors 8. Functional description 8.1 General The TDA8931 is a switching power stage for high efficiency class-D audio power amplifier systems. It contains a Single-Ended (SE) power stage, drive logic, protection control logic, a full differential input comparator and ...

  • Page 6

    Philips Semiconductors Pin HVPI will be on its final level of 0.5V into a plop-noise free start-up behavior. 8.5 Half supply voltage capacitor charger (pin HVP) When the device is in Standby mode, the SE capacitor C15 (see until it ...

  • Page 7

    ... Standby mode. 8.6.5 Supply voltage drop protection When the TDA8931T is switched off with the supply, it will be switched off before it reaches the voltage on pin HVP. This prevents switch-off pop noise. This function is not self recovering. The TDA8931T can be recovered by switching to Sleep mode or by removing the supply voltage ...

  • Page 8

    Philips Semiconductors 9. Internal circuitry Table 6: Pin 1, 10, 11 9397 750 13847 Preliminary data sheet Internal circuitry Symbol Equivalent circuit V SSD V SSA INN, INP V DDA POWERUP Rev. 01 — ...

  • Page 9

    Philips Semiconductors Table 6: Pin 9397 750 13847 Preliminary data sheet Internal circuitry …continued Symbol Equivalent circuit ENABLE DIAG CGND OVP HVP STABI Rev. 01 — 14 January 2004 TDA8931 Power comparator 1 7 ...

  • Page 10

    Philips Semiconductors Table 6: Pin 9397 750 13847 Preliminary data sheet Internal circuitry …continued Symbol Equivalent circuit V SSP OUT V DDP BOOT HVPI Rev. 01 — 14 January 2004 TDA8931 Power comparator 1 V ...

  • Page 11

    Philips Semiconductors 10. Limiting values Table 7: In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol ENABLE V OVP ORM P d(max stg T amb 11. Thermal characteristics Table ...

  • Page 12

    Philips Semiconductors Table 9: Characteristics …continued 290 kHz; unless otherwise specified. P amb carrier Symbol Parameter Power-up input: pin POWERUP V LOW-level input voltage IL V HIGH-level input voltage IH ...

  • Page 13

    Philips Semiconductors 13. Dynamic characteristics Table 10: Characteristics unless otherwise specified. P amb L Symbol Parameter Amplifier; SE channel P maximum output power o(max) THD total harmonic distortion ...

  • Page 14

    Philips Semiconductors Fig 4. Timing diagram PWM output 9397 750 13847 Preliminary data sheet input V i(dif) V i(cm) t r(LH output V). ...

  • Page 15

    R11 (1) C4 470 k 2 ( INN 47 k C11 R6 INP 2.2 k 220 nF IN POWERUP ...

  • Page 16

    Philips Semiconductors Table 11: Item C10 C11 C12 C13 C14 C15 C16 C17 R10 R11 R12 R13 L1 U1 9397 750 13847 ...

  • Page 17

    Philips Semiconductors 14.1 Output power estimation The output power, just before clipping, can be estimated using the following equation Where: P o(1 load impedance L R DSon R = series resistance output coil coil ...

  • Page 18

    ... Thermal behavior (printed-circuit board considerations) The SO20 package of the TDA8931T has special thermal corner leads, significantly increasing the power capability (reducing R should be attached to a copper area (V The typical thermal resistance R convection) when soldered on a double sided FR4 PCB with 35 m copper layer and ...

  • Page 19

    ... Thermal layout including vias The bottom side of the double-sided PCB is used to place the SMD components including the TDA8931T and the majority of the signal tracks. The topside is used to place the leaded components. The remaining area on both top and bottom layer are filled with ground plane for a proper cooling. In this way it is possible to have a cooling area available of about: • ...

  • Page 20

    ... 150 C is taken into account. j Fig 9. Derating curves for power dissipation as a function of maximum ambient Example: TDA8931T mono amplifier, with substituting 2.47 W results in a junction temperature T d For this example the estimated maximum junction temperature at a high ambient temperature for a mono amplifi ...

  • Page 21

    Philips Semiconductors 14.5 Measured performance figures of mono amplifier with TDA8931 Table 13 Symbol Parameter THD n(o) S/N B SVRR f c [1] Operates down to UVP ...

  • Page 22

    Philips Semiconductors 14.6 Curves measured in typical application 2 10 THD N (%) kHz 10 100 kHz ...

  • Page 23

    Philips Semiconductors ( ( THD = ( THD = 0 ( THD = ...

  • Page 24

    Philips Semiconductors 100 n (%) ( ( Conditions kHz. ...

  • Page 25

    Philips Semiconductors 16. Package outline SO20: plastic small outline package; 20 leads; body width 7 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT ...

  • Page 26

    Philips Semiconductors 17. Soldering 17.1 Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages ...

  • Page 27

    Philips Semiconductors – smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. • For packages with leads on four sides, ...

  • Page 28

    Philips Semiconductors [4] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, ...

  • Page 29

    Philips Semiconductors 18. Revision history Table 15: Revision history Document ID Release date TDA8931_1 20050114 9397 750 13847 Preliminary data sheet Data sheet status Change notice Preliminary data sheet - Rev. 01 — 14 January 2004 TDA8931 Power comparator 1 ...

  • Page 30

    Philips Semiconductors 19. Data sheet status [1] Level Data sheet status Product status I Objective data Development II Preliminary data Qualification III Product data Production [1] Please consult the most recently issued data sheet before initiating or completing a design. ...

  • Page 31

    Philips Semiconductors 23. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . ...