BLD6G21L-50,112 NXP Semiconductors, BLD6G21L-50,112 Datasheet

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BLD6G21L-50,112

Manufacturer Part Number
BLD6G21L-50,112
Description
TRANSISTOR DOHERTY W-CDMA SOT113
Manufacturer
NXP Semiconductors
Datasheet

Specifications of BLD6G21L-50,112

Transistor Type
LDMOS
Frequency
2.017GHz
Gain
13.5dB
Voltage - Rated
65V
Current Rating
10.2A
Current - Test
170mA
Voltage - Test
28V
Power - Output
8W
Package / Case
SOT1130A
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Noise Figure
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
934063508112

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
BLD6G21L-50,112
Manufacturer:
HITTITE
Quantity:
1 400
1. Product profile
CAUTION
1.1 General description
1.2 Features and benefits
The BLD6G21L-50 and BLD6G21LS-50 incorporate a fully integrated Doherty solution
using NXP’s state of the art GEN6 LDMOS technology. This device is perfectly suited for
TD-SCDMA base station applications at frequencies from 2010 MHz to 2025 MHz. The
main and peak device, input splitter and output combiner are integrated in a single
package. This package consists of one gate and drain lead and two extra leads of which
one is used for biasing the peak amplifier and the other is not connected. It only requires
the proper input/output match and bias setting as with a normal class-AB transistor.
Table 1.
RF performance at T
[1]
[2]
Mode of operation
TD-SCDMA
BLD6G21L-50; BLD6G21LS-50
TD-SCDMA 2010 MHz to 2025 MHz fully integrated Doherty
transistor
Rev. 2 — 17 August 2010
Typical TD-SCDMA performance at frequencies from 2010 MHz to 2025 MHz:
Fully optimized integrated Doherty concept:
100 % peak power tested for guaranteed output power capability
Test signal: 6-carrier TD-SCDMA; PAR = 10.8 dB at 0.01 % probability on CCDF.
I
Dq
This device is sensitive to ElectroStatic Discharge (ESD). Therefore care should be taken
during transport and handling.
= 170 mA (main); V
Average output power = 8 W
Power gain = 14.5 dB
Efficiency = 43 %
integrated asymmetrical power splitter at input
integrated power combiner
peak biasing down to 0 V
low junction temperature
high efficiency
Typical performance
[1][2]
h
= 25
GS(amp)peak
°
f
(MHz)
2010 to 2025
C.
= 0 V.
V
(V)
28
DS
P
(W)
8
L(AV)
G
(dB)
14.5
p
η
(%)
43
D
Product data sheet
ACPR
(dBc)
−24
P
(W)
53
L(3dB)

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BLD6G21L-50,112 Summary of contents

Page 1

... Rev. 2 — 17 August 2010 1. Product profile 1.1 General description The BLD6G21L-50 and BLD6G21LS-50 incorporate a fully integrated Doherty solution using NXP’s state of the art GEN6 LDMOS technology. This device is perfectly suited for TD-SCDMA base station applications at frequencies from 2010 MHz to 2025 MHz. The main and peak device, input splitter and output combiner are integrated in a single package ...

Page 2

... BLD6G21LS-50 (SOT1130B [1] Connected to flange. 3. Ordering information Table 3. Type number BLD6G21L-50 BLD6G21LS-50 - BLD6G21L-50_BLD6G21LS-50 Product data sheet BLD6G21L-50; BLD6G21LS-50 TD-SCDMA 2010 MHz to 2025 MHz fully integrated Doherty transistor Pinning Description drain gate + bias main source n.c. bias peak drain gate + bias main source n ...

Page 3

... Product data sheet BLD6G21L-50; BLD6G21LS-50 TD-SCDMA 2010 MHz to 2025 MHz fully integrated Doherty transistor 2 RF-input/bias main 90 5 bias peak Block diagram of BLD6G21L-50 and BLD6G21LS-50 Limiting values Parameter drain-source voltage main amplifier gate-source voltage peak amplifier gate-source voltage drain current storage temperature ...

Page 4

... Mode of operation: Pulsed CW; V GS(amp)peak Symbol P L(3dB) 8.1 Ruggedness in Doherty operation The BLD6G21L-50 and BLD6G21LS-50 are capable of withstanding a load mismatch corresponding to VSWR = through all phases under the following conditions 8.2 Impedance information Table 9. Measured Load Pull data; typical values unless otherwise specified. ...

Page 5

... NXP Semiconductors Fig 2. 8.3 Performance curves Performance curves are measured in a BLD6G21L-50 application circuit. 8.3.1 CW pulsed (dB) 15 (6) (5) (4) 13 (3) (2) ( 170 mA (main 2017.5 MHz; δ ( GS(amp)peak ( 0.2 V GS(amp)peak ( 0.4 V GS(amp)peak ( 0.5 V GS(amp)peak ( 0.6 V GS(amp)peak ( 0.8 V GS(amp)peak Fig 3. Power gain as a function of load power; ...

Page 6

... MHz ( 2018 MHz ( 2025 MHz Fig 5. Power gain as a function of load power; typical values ( 2010 MHz ( 2018 MHz ( 2025 MHz Fig 7. BLD6G21L-50_BLD6G21LS-50 Product data sheet BLD6G21L-50; BLD6G21LS-50 TD-SCDMA 2010 MHz to 2025 MHz fully integrated Doherty transistor 001aam430 (%) (1) (2) ( (dBm °C; ...

Page 7

... V GS(amp)peak ( 0.5 V GS(amp)peak ( 0.6 V GS(amp)peak ( 0.8 V GS(amp)peak Fig 8. Power gain as a function of average load power; typical values BLD6G21L-50_BLD6G21LS-50 Product data sheet BLD6G21L-50; BLD6G21LS-50 TD-SCDMA 2010 MHz to 2025 MHz fully integrated Doherty transistor 001aam433 (6) (5) (4) (3) (2) ( (dBm) L(AV °C; case Fig 9. ...

Page 8

... V; 6-carrier TD-SCDMA; PAR = 10.8 dB GS(amp)peak at 0.01 % probability on CCDF. ( 2010 MHz ( 2018 MHz ( 2025 MHz Fig 11. Power gain as a function of average load power; typical values BLD6G21L-50_BLD6G21LS-50 Product data sheet BLD6G21L-50; BLD6G21LS-50 TD-SCDMA 2010 MHz to 2025 MHz fully integrated Doherty transistor (dB) 15 14.5 ...

Page 9

... C7, C8 C9, C10 C11, C13, C14, C16 C17 C19, C20 C21 L1 [1] American Technical Ceramics type 100B or capacitor of same quality. BLD6G21L-50_BLD6G21LS-50 Product data sheet BLD6G21L-50; BLD6G21LS-50 TD-SCDMA 2010 MHz to 2025 MHz fully integrated Doherty transistor V GS(amp)main INPUT C19 C21 C20 C4 R2 The striplines are on a double copper-clad gold plated Rogers 4350B Printed-Circuit Board (PCB) with ε ...

Page 10

... Note 1. millimeter dimensions are derived from the original inch dimensions. 2. dimension is measured 0.030 inch (0.76 mm) from the body. Outline version IEC SOT1130A Fig 14. Package outline SOT1130A BLD6G21L-50_BLD6G21LS-50 Product data sheet BLD6G21L-50; BLD6G21LS-50 TD-SCDMA 2010 MHz to 2025 MHz fully integrated Doherty transistor ...

Page 11

... Note 1. millimeter dimensions are derived from the original inch dimensions. 2. dimension is measured 0.030 inch (0.76 mm) from the body. Outline version IEC SOT1130B Fig 15. Package outline SOT1130B BLD6G21L-50_BLD6G21LS-50 Product data sheet BLD6G21L-50; BLD6G21LS-50 TD-SCDMA 2010 MHz to 2025 MHz fully integrated Doherty transistor ...

Page 12

... Table 12. Revision history Document ID BLD6G21L-50_BLD6G21LS-50 v.2 Modifications: BLD6G21L-50_BLD6G21LS-50 v.1 BLD6G21L-50_BLD6G21LS-50 Product data sheet BLD6G21L-50; BLD6G21LS-50 TD-SCDMA 2010 MHz to 2025 MHz fully integrated Doherty transistor Abbreviations Description Complementary Cumulative Distribution Function Continuous Wave Laterally Diffused Metal-Oxide Semiconductor Peak-to-Average power Ratio Radio Frequency ...

Page 13

... BLD6G21L-50_BLD6G21LS-50 Product data sheet BLD6G21L-50; BLD6G21LS-50 TD-SCDMA 2010 MHz to 2025 MHz fully integrated Doherty transistor [3] Definition This document contains data from the objective specification for product development. ...

Page 14

... For sales office addresses, please send an email to: BLD6G21L-50_BLD6G21LS-50 Product data sheet BLD6G21L-50; BLD6G21LS-50 TD-SCDMA 2010 MHz to 2025 MHz fully integrated Doherty transistor NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ ...

Page 15

... Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2010. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com All rights reserved. Date of release: 17 August 2010 Document identifier: BLD6G21L-50_BLD6G21LS-50 ...

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