X00602MA 1AA2 STMicroelectronics, X00602MA 1AA2 Datasheet - Page 4

• Manufacturer Part Number: X00602MA 1AA2
• Description: SCR 0.8A 200UA 600V TO-92
• Manufacturer: STMicroelectronics

Specifications of X00602MA 1AA2

• Scr Type: Sensitive Gate
• Voltage - Off State: 600V
• Voltage - Gate Trigger (vgt) (max): 800mV
• Voltage - On State (vtm) (max): 1.35V
• Current - On State (it (av)) (max): 500mA
• Current - On State (it (rms)) (max): 800mA
• Current - Gate Trigger (igt) (max): 200µA
• Current - Hold (ih) (max): 5mA
• Current - Off State (max): 1µA
• Current - Non Rep. Surge 50, 60hz (itsm): 9A, 10A
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Through Hole
• Package / Case: TO-92-3 (Standard Body), TO-226
• Current - On State (it (rms) (max): 800mA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 497-7696; X00602MA 1AA2

Characteristics
4/9
Figure 5.
Figure 7.
Figure 9.
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
1.00
0.10
0.01
1.E-03
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
0
I
T(AV)
Z
-40 -30 -20 -10
I
th(j-a)
GT H L
S
CU
= 180°
SOT-223
,I ,I [T ] /
(A)
= 0.5 cm
/R
1.E-02
D.C.
th(j-a)
Average and DC on-state current
versus ambient temperature (epoxy
PCB FR4, copper
thickness = 35 µm, S
(SOT-223)
Relative variation of thermal
impedance junction to ambient
versus pulse duration (PCB FR4,
copper thickness = 35 µm, S
cm
2
Relative variation of gate trigger
current, holding current and
latching current versus junction
temperature (typical values)
25
j
I
0
GT H L
2
) (SOT-223)
,I ,I [T =25°C]
10
1.E-01
20
50
30
j
T
T (°C)
amb
1.E+00
40
t (s)
j
p
50
(°C)
60
75
1.E+01
I
70
GT
I
H
& I
80
L
CU
90 100 110 120 130
= 5 cm
1.E+02
100
S
CU
SOT-223
= 0.5 cm
CU
1.E+03
2
2
= 0.5
)
125
Figure 6.
Figure 8.
Figure 10. Relative variation of holding
1.00
0.10
0.01
130
120
110
100
90
80
70
60
50
40
30
20
10
0
1.E-03
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
0.0
1.E-02
R
Z
th(j-a)
th(j-a)
I [R
H
S
0.5
CU
GK
TO-92
= 0.5 cm
(°C/W)
/R
1.E-02
] / I [
th(j-a)
Relative variation of thermal
impedance junction to ambient
versus pulse duration (PCB FR4,
copper thickness = 35 µm, S
cm
Thermal resistance junction to
ambient versus copper surface
under tab (PCB FR4, copper
thickness = 35 µm) (SOT-223)
current versus gate-cathode
resistance (typical values)
1.0
2
H
1.E-01
R
2
GK
) (TO-92)
1.5
1.E-01
=1k ]
2.0
R
S(cm²)
1.E+00
GK
1.E+00
t (s)
p
2.5
(k )
3.0
1.E+01
1.E+01
3.5
1.E+02
4.0
CU
4.5
1.E+02
1.E+03
= 0.5
X006
5.0