XC2C32A-6CPG56C Xilinx Inc, XC2C32A-6CPG56C Datasheet - Page 10

• Manufacturer Part Number: XC2C32A-6CPG56C
• Description: CPLD CoolRunner™-II Family 750 Gates 32 Macro Cells 200MHz 0.18um (CMOS) Technology 1.8V 56-Pin CSBGA
• Manufacturer: Xilinx Inc
• Series: CoolRunner IIr

Specifications of XC2C32A-6CPG56C

• Package: 56CSBGA
• Family Name: CoolRunner™-II
• Device System Gates: 750
• Number Of Macro Cells: 32
• Maximum Propagation Delay Time: 6 ns
• Number Of User I/os: 33
• Number Of Logic Blocks/elements: 2
• Typical Operating Supply Voltage: 1.8 V
• Maximum Operating Frequency: 200 MHz
• Number Of Product Terms Per Macro: 40
• Operating Temperature: 0 to 70 °C
• Programmable Type: In System Programmable
• Delay Time Tpd(1) Max: 5.5ns
• Voltage Supply - Internal: 1.7 V ~ 1.9 V
• Number Of Logic Elements/blocks: 2
• Number Of Macrocells: 32
• Number Of Gates: 750
• Number Of I /o: 33
• Mounting Type: Surface Mount
• Package / Case: 56-CSBGA
• Features: Programmable
• Voltage: 1.8V
• Memory Type: CMOS
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Number Of Logic Elements/cells: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 122-1403

XC2C32A CoolRunner-II CPLD
Ordering Information
Device Part Marking
Note: Due to the small size of chip scale and quad flat no lead packages, the complete ordering part number cannot be
included on the package marking. Part marking on chip scale and quad flat no lead packages by line are:
•
•
•
10
Notes:
1.
XC2C32A-4QFG32C
XC2C32A-6QFG32C
XC2C32A-4VQ44C
XC2C32A-6VQ44C
XC2C32A-4CP56C
XC2C32A-6CP56C
XC2C32A-4VQG44C
XC2C32A-6VQG44C
XC2C32A-4CPG56C
XC2C32A-6CPG56C
XC2C32A-6QFG32I
XC2C32A-6VQ44I
XC2C32A-6CP56I
XC2C32A-6VQG44I
XC2C32A-6CPG56I
Line 1 = X (Xilinx logo) then truncated part number
Line 2 = Not related to device part number
Line 3 = Not related to device part number
C = Commercial (TA = 0°C to +70°C); I = Industrial (TA = –40°C to +85°C)
Part Number
Standard Example: XC2C128
Device
Speed Grade
Package Type
Number of Pins
Temperature Range
Spacing
Pin/Ball
Operating Range
0.5mm
0.5mm
0.8mm
0.8mm
0.5mm
0.5mm
0.8mm
0.8mm
0.5mm
0.5mm
0.5mm
0.8mm
0.5mm
0.8mm
0.5mm
Device Type
Package
(°C/Watt)
Speed
35.5
35.5
47.7
47.7
66.0
66.0
47.7
47.7
66.0
66.0
35.5
47.7
66.0
47.7
66.0
θ
JA
Figure 5: Sample Package with Part Marking
-4 TQ
(°C/Watt)
Part marking for non-chip scale package
24.0
24.0
14.9
14.9
14.9
14.9
24.0
14.9
14.9
θ
8.2
8.2
8.2
8.2
8.2
8.2
JC
144
XC2Cxxx
TQ144
7C
www.xilinx.com
C
Very Thin Quad Flat Pack; Pb-free
Very Thin Quad Flat Pack; Pb-free
Very Thin Quad Flat Pack; Pb-free
Chip Scale Package; Pb-free
Chip Scale Package; Pb-free
Chip Scale Package; Pb-free
Quad Flat No Lead; Pb-free
Quad Flat No Lead; Pb-free
Quad Flat No Lead; Pb-free
Very Thin Quad Flat Pack
Very Thin Quad Flat Pack
Very Thin Quad Flat Pack
Pb- Free Example: XC2C128
Device
Speed Grade
Package Type
Pb -Free
Number of Pins
Temperature Range
Chip Scale Package
Chip Scale Package
Chip Scale Package
•
Package Type
Line 4 = Package code, speed, operating temperature,
three digits not related to device part number. Package
codes: C3 = CP56, C4 = CPG56, Q1 = QFG32.
R
This line not
related to device
part number
Package Body
10mm x 10mm
10mm x 10mm
10mm x 10mm
10mm x 10mm
10mm x 10mm
10mm x 10mm
Dimensions
5mm x 5mm
5mm x 5mm
6mm x 6mm
6mm x 6mm
6mm x 6mm
6mm x 6mm
5mm x 5mm
6mm x 6mm
6mm x 6mm
DS310_05_102108
-4
DS310 (v2.1) November 6, 2008
TQ
Product Specification
G
I/O
33
33
33
33
33
33
21
21
33
33
33
33
21
33
33
144 C
Comm. (C)
Ind. (I)
C
C
C
C
C
C
C
C
C
C
I
I
I
I
I
(1)
R