BF720,115 NXP Semiconductors, BF720,115 Datasheet

TRANS NPN 300V 50MA SOT223

BF720,115

Manufacturer Part Number
BF720,115
Description
TRANS NPN 300V 50MA SOT223
Manufacturer
NXP Semiconductors
Series
-r
Datasheet

Specifications of BF720,115

Package / Case
SOT-223 (3 leads + Tab), SC-73, TO-261
Transistor Type
NPN
Current - Collector (ic) (max)
100mA
Voltage - Collector Emitter Breakdown (max)
300V
Vce Saturation (max) @ Ib, Ic
600mV @ 5mA, 30mA
Dc Current Gain (hfe) (min) @ Ic, Vce
50 @ 25mA, 20V
Power - Max
1.2W
Frequency - Transition
60MHz
Mounting Type
Surface Mount
Dc Collector/base Gain Hfe Min
50 at 25 mA at 20 V
Minimum Operating Temperature
- 65 C
Configuration
Single Dual Collector
Transistor Polarity
NPN
Mounting Style
SMD/SMT
Collector- Emitter Voltage Vceo Max
300 V
Emitter- Base Voltage Vebo
5 V
Maximum Dc Collector Current
0.1 A
Power Dissipation
1200 mW
Maximum Operating Frequency
60 MHz
Maximum Operating Temperature
+ 150 C
Current - Collector Cutoff (max)
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Current - Collector Cutoff (max)
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
933917360115
BF720 T/R
BF720 T/R
Product data sheet
Supersedes data of 1996 Dec 05
dbook, halfpage
DATA SHEET
BF720; BF722
NPN high-voltage transistors
DISCRETE SEMICONDUCTORS
M3D087
1999 Apr 21

Related parts for BF720,115

BF720,115 Summary of contents

Page 1

DATA SHEET dbook, halfpage BF720; BF722 NPN high-voltage transistors Product data sheet Supersedes data of 1996 Dec 05 DISCRETE SEMICONDUCTORS M3D087 1999 Apr 21 ...

Page 2

... NXP Semiconductors NPN high-voltage transistors FEATURES • Low feedback capacitance. APPLICATIONS • Class-B video output stages of colour television receivers • General purpose high voltage circuits. DESCRIPTION NPN transistors in a SOT223 plastic package. PNP complement: BF723. PINNING PIN DESCRIPTION 1 base 2, 4 collector ...

Page 3

... NXP Semiconductors NPN high-voltage transistors THERMAL CHARACTERISTICS SYMBOL R thermal resistance from junction to ambient th j-a R thermal resistance from junction to soldering point th j-s Note 1. Device mounted on printed-circuit board, single sided copper, tinplated, mounting pad for collector 1 cm For other mounting conditions, see “Thermal considerations for SOT223 in the General Part of associated Handbook” ...

Page 4

... NXP Semiconductors NPN high-voltage transistors PACKAGE OUTLINE Plastic surface mounted package; collector pad for good heat transfer; 4 leads DIMENSIONS (mm are the original dimensions) UNIT 1.8 0.10 0.80 3.1 mm 1.5 0.01 0.60 2.9 OUTLINE VERSION IEC SOT223 1999 Apr scale 0.32 6.7 3 ...

Page 5

... NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. ...

Page 6

... NXP Semiconductors Customer notification This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content, except for package outline drawings which were updated to the latest version. Contact information For additional information please visit: http://www ...

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