TRANSISTOR PNP 45V 100MA SOT-23

2PB709ARL,235

Manufacturer Part Number2PB709ARL,235
DescriptionTRANSISTOR PNP 45V 100MA SOT-23
ManufacturerNXP Semiconductors
2PB709ARL,235 datasheet
 


Specifications of 2PB709ARL,235

Transistor TypePNPCurrent - Collector (ic) (max)100mA
Voltage - Collector Emitter Breakdown (max)45VVce Saturation (max) @ Ib, Ic500mV @ 10mA, 100mA
Dc Current Gain (hfe) (min) @ Ic, Vce210 @ 2mA, 10VPower - Max250mW
Frequency - Transition70MHzMounting TypeSurface Mount
Package / CaseSOT-23-3, TO-236-3, Micro3™, SSD3, SST3Lead Free Status / RoHS StatusLead free / RoHS Compliant
Current - Collector Cutoff (max)-Other names2PB709ARL /T3
2PB709ARL /T3
934062297235
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2PB709ARL; 2PB709ASL
45 V, 100 mA PNP general-purpose transistors
Rev. 01 — 12 November 2008
1. Product profile
1.1 General description
PNP general-purpose transistors in a small SOT23 (TO-236AB) Surface-Mounted
Device (SMD) plastic package.
Table 1.
Type number
2PB709ARL
2PB709ASL
2PB709ARL/DG
2PB709ASL/DG
[1]
/DG: halogen-free
1.2 Features
I
General-purpose transistors
I
Two current gain selections
I
AEC-Q101 qualified
I
Small SMD plastic package
1.3 Applications
I
General-purpose switching and amplification
1.4 Quick reference data
Table 2.
Symbol
V
CEO
I
C
h
FE
Product overview
[1]
Package
NXP
SOT23
SOT23
Quick reference data
Parameter
Conditions
collector-emitter voltage
open base
collector current
DC current gain
V
CE
I
C
h
group R
FE
h
group S
FE
Product data sheet
NPN complement
JEDEC
TO-236AB
2PD601ARL
2PD601ASL
TO-236AB
2PD601ARL/DG
2PD601ASL/DG
Min
Typ
-
-
-
-
= 10 V;
= 2 mA
210
-
290
-
Max
Unit
45
V
100
mA
340
460

2PB709ARL,235 Summary of contents

  • Page 1

    V, 100 mA PNP general-purpose transistors Rev. 01 — 12 November 2008 1. Product profile 1.1 General description PNP general-purpose transistors in a small SOT23 (TO-236AB) Surface-Mounted Device (SMD) plastic package. Table 1. Type number 2PB709ARL 2PB709ASL ...

  • Page 2

    ... NXP Semiconductors 2. Pinning information Table 3. Pin Ordering information Table 4. Type number 2PB709ARL 2PB709ASL 2PB709ARL/DG 2PB709ASL/DG [1] /DG: halogen-free 4. Marking Table 5. Type number 2PB709ARL 2PB709ASL 2PB709ARL/DG 2PB709ASL/DG [ made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China 2PB709AXL_1 Product data sheet 2PB709ARL; 2PB709ASL ...

  • Page 3

    ... NXP Semiconductors 5. Limiting values Table 6. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol V CBO V CEO V EBO tot amb T stg [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. 6. Thermal characteristics Table 7. Symbol R th(j-a) [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. ...

  • Page 4

    ... NXP Semiconductors Table unless otherwise specified. amb Symbol [1] Pulse test Test information 8.1 Quality information This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q101 - Stress test qualification for discrete semiconductors , and is suitable for use in automotive applications. ...

  • Page 5

    ... NXP Semiconductors 10. Packing information Table 9. The indicated -xxx are the last three digits of the 12NC ordering code. Type number 2PB709ARL 2PB709ASL 2PB709ARL/DG 2PB709ASL/DG [1] For further information and the availability of packing methods, see [2] /DG: halogen-free 11. Soldering 3 1.7 Fig 2. 2PB709AXL_1 Product data sheet 2PB709ARL ...

  • Page 6

    ... NXP Semiconductors 4.6 2.6 Fig 3. 2PB709AXL_1 Product data sheet 2PB709ARL; 2PB709ASL 45 V, 100 mA PNP general-purpose transistors 2 1.4 2.8 4.5 Wave soldering footprint SOT23 (TO-236AB) Rev. 01 — 12 November 2008 solder lands solder resist occupied area Dimensions in mm preferred transport direction during soldering sot023_fw © ...

  • Page 7

    ... NXP Semiconductors 12. Revision history Table 10. Revision history Document ID Release date 2PB709AXL_1 20081112 2PB709AXL_1 Product data sheet 2PB709ARL; 2PB709ASL 45 V, 100 mA PNP general-purpose transistors Data sheet status Change notice Product data sheet - Rev. 01 — 12 November 2008 Supersedes - © NXP B.V. 2008. All rights reserved. ...

  • Page 8

    ... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...

  • Page 9

    ... NXP Semiconductors 15. Contents 1 Product profi 1.1 General description 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 8 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 4 8.1 Quality information . . . . . . . . . . . . . . . . . . . . . . 4 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 4 10 Packing information Soldering ...