PBSS3540E,115 NXP Semiconductors, PBSS3540E,115 Datasheet
PBSS3540E,115
Specifications of PBSS3540E,115
PBSS3540E T/R
PBSS3540E T/R
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PBSS3540E,115 Summary of contents
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PBSS3540E 40 V, 500 mA PNP low V Rev. 02 — 11 December 2009 1. Product profile 1.1 General description PNP low V plastic package. NPN complement: PBSS2540E. 1.2 Features Low collector-emitter saturation voltage V High collector current capability: I ...
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... NXP Semiconductors 2. Pinning information Table 2. Pin Ordering information Table 3. Type number PBSS3540E 4. Marking Table 4. Type number PBSS3540E PBSS3540E_2 Product data sheet 40 V, 500 mA PNP low V Pinning Description base emitter collector Ordering information Package Name Description SC-75 plastic surface mounted package; 3 leads ...
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... NXP Semiconductors 5. Limiting values Table 5. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol V CBO V CEO V EBO tot amb T stg [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm ...
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... NXP Semiconductors 6. Thermal characteristics Table 6. Symbol R th(j-a) [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector duty cycle = 1 Z th(j-a) 0.75 (K/W) 0.5 0. 0.2 0.1 0.05 0. ...
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... NXP Semiconductors 7. Characteristics Table 7. Characteristics ° unless otherwise specified. amb Symbol Parameter I collector-base cut-off CBO current I emitter-base cut-off EBO current h DC current gain FE V collector-emitter CEsat saturation voltage R collector-emitter CEsat saturation resistance V base-emitter BEsat saturation voltage V base-emitter turn-on BEon voltage f transition frequency ...
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... NXP Semiconductors 600 ( 400 (2) (3) 200 0 −1 −10 −1 −10 = − 100 °C (1) T amb = 25 °C (2) T amb = −55 °C (3) T amb Fig 3. DC current gain as a function of collector current; typical values −1 V CEsat (V) −1 −10 (1) (2) (3) −2 −10 −1 −10 − ...
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... NXP Semiconductors −1.1 V BEsat (V) −0.9 (1) (2) −0.7 (3) −0.5 −0.3 −0.1 −1 −10 −1 − −55 °C (1) T amb = 25 °C (2) T amb = 100 °C (3) T amb Fig 7. Base-emitter saturation voltage as a function of collector current; typical values −1 (mA) = − −27 C (A) −24 −21 − ...
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... NXP Semiconductors 8. Package outline Fig 11. Package outline SOT416 (SC-75) 9. Packing information Table 8. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code. Type number Package Description PBSS3540E SOT416 4 mm pitch tape and reel [1] For further information and the availability of packing methods, see 10 ...
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... Document ID Release date PBSS3540E_2 20091211 • Modifications: This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content. • Figure 4 “Base-emitter voltage as a function of collector current; typical • ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 14. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics . . . . . . . . . . . . . . . . . . 4 7 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 5 8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8 9 Packing information . . . . . . . . . . . . . . . . . . . . . 8 10 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 11 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 9 12 Legal information ...