Z0103NN,135 NXP Semiconductors, Z0103NN,135 Datasheet
Z0103NN,135
Specifications of Z0103NN,135
934057055135
Z0103NN /T3
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Z0103NN,135 Summary of contents
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Z0103NN 4Q Triac Rev. 05 — 21 March 2011 1. Product profile 1.1 General description Planar passivated very sensitive gate four quadrant triac in a SOT223 (SC-73) surface-mountable plastic package intended for applications requiring direct interfacing to logic level ICs ...
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... NXP Semiconductors Table 1. Symbol Static characteristics Pinning information Table 2. Pinning information Pin Symbol Description 1 T1 main terminal main terminal gate 4 T2 main terminal 2 3. Ordering information Table 3. Ordering information Type number Package Name Z0103NN SOT223 Z0103NN Product data sheet Quick reference data … ...
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... NXP Semiconductors 4. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter V repetitive peak off-state voltage DRM I RMS on-state current T(RMS) I non-repetitive peak on-state TSM current I2t for fusing dI /dt rate of rise of on-state current T I peak gate current ...
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... NXP Semiconductors 2.0 conduction form P tot angle factor (W) (degrees 2.8 90 2.2 120 1.9 1.2 180 1.57 0.8 0.4 0.0 0 0.2 Fig 3. Total power dissipation as a function of RMS on-state current; maximum values 10 I TSM ( Fig 4. Non-repetitive peak on-state current as a function of the number of sinusoidal current cycles; maximum ...
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... NXP Semiconductors ( (1) ( Fig 5. Non-repetitive peak on-state current as a function of pulse width; maximum values Z0103NN Product data sheet - All information provided in this document is subject to legal disclaimers. Rev. 05 — 21 March 2011 Z0103NN 4Q Triac 003a a d319 I TSM j(init °C max - (s) p © NXP B.V. 2011. All rights reserved. ...
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... NXP Semiconductors 5. Thermal characteristics Table 5. Thermal characteristics Symbol Parameter R thermal resistance from junction th(j-sp) to solder point R thermal resistance from junction th(j-a) to ambient 3.8 min 1.5 min 1.5 min (3×) 1.5 min 4.6 All dimensions are in mm Fig 6. Minimum footprint SOT223 Z0103NN ...
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... NXP Semiconductors Fig 8. Transient thermal impedance from junction to solder point as a junction of pulse width Z0103NN Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 05 — 21 March 2011 Z0103NN 4Q Triac © NXP B.V. 2011. All rights reserved ...
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... NXP Semiconductors 6. Characteristics Table 6. Characteristics Symbol Parameter Static characteristics I gate trigger current GT I latching current L I holding current H V on-state voltage T V gate trigger voltage GT I off-state current D Dynamic characteristics dV /dt rate of rise of off-state D voltage dV /dt rate of change of com commutating voltage ...
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... NXP Semiconductors GT(25°C) 3 (1) (2) ( (1) T2- G+ (2) T2- G- (3) T2+ G- (4) T2+ G+ Fig 9. Normalized gate trigger current as a function of junction temperature H(25° - Fig 11. Normalized holding current as a function of junction temperature Z0103NN Product data sheet 003aaa205 L(25° 100 150 -50 T (°C) j Fig 10 ...
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... NXP Semiconductors 1 GT(25°C) 1.2 0.8 0 Fig 13. Normalized gate trigger voltage as a function of junction temperature Z0103NN Product data sheet 003aaa209 1.6 A 1.2 0.8 0.4 0 100 150 T (°C) j Fig 14. Normalized critical rate of rise of off-state voltage as a function of junction temperature; typical values All information provided in this document is subject to legal disclaimers. Rev. 05 — ...
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... NXP Semiconductors 7. Package outline Plastic surface-mounted package with increased heatsink; 4 leads DIMENSIONS (mm are the original dimensions) UNIT 1.8 0.10 0.80 3.1 mm 1.5 0.01 0.60 2.9 OUTLINE VERSION IEC SOT223 Fig 15. Package outline SOT223 (SOT223) Z0103NN Product data sheet scale 0.32 6.7 3 ...
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... NXP Semiconductors 8. Revision history Table 7. Revision history Document ID Release date Z0103NN v.5 20110321 • Modifications: Various changes to content. Z0103NN v.4 20100906 Z0103NN Product data sheet Data sheet status Change notice Product data sheet - Product data sheet - All information provided in this document is subject to legal disclaimers. ...
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... Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ ...
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... NXP Semiconductors 11. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . .1 1.1 General description . . . . . . . . . . . . . . . . . . . . . .1 1.2 Features and benefits . . . . . . . . . . . . . . . . . . . . .1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . .1 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . .2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . .2 4 Limiting values Thermal characteristics . . . . . . . . . . . . . . . . . . .6 6 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . .8 7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 11 8 Revision history . . . . . . . . . . . . . . . . . . . . . . . . .12 9 Legal information .13 9.1 Data sheet status ...