290-1AB Wakefield Thermal Solutions, 290-1AB Datasheet

HEATSINK TO-220 VERT/HORZ BLK

290-1AB

Manufacturer Part Number
290-1AB
Description
HEATSINK TO-220 VERT/HORZ BLK
Manufacturer
Wakefield Thermal Solutions
Series
290r
Datasheets
1.274-2AB.pdf (20 pages)
2.274-1AB.pdf (23 pages)

Specifications of 290-1AB

Thermal Resistance
7 C / W
Height
0.500" (12.70mm)
Color
Black
Package Cooled
TO-218, TO-202, TO-220
Attachment Method
Bolt On and PC Pin
Outline
30.00mm x 25.40mm
Power Dissipation @ Temperature Rise
2W @ 44°C
Thermal Resistance @ Forced Air Flow
35.0°C/W @ 400 LFM
Thermal Resistance @ Natural
22°C/W
Product
Heatsinks
Mounting Style
SMD/SMT
Heatsink Material
Aluminum
Fin Style
Vertical
Dimensions
25.4 mm L x 12.7 mm W x 29.97 mm H
Designed For
TO-218, TO-202, TO-220
Packages Cooled
TO-202 / TO-218 / TO-220
Width
30mm
Heat Sink Material
Aluminum
Length
25.4mm
Mounting Type
Screw
Package / Case
TO-218/TO-202/TO-220
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
345-1020

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Company:
Bonase Electronics (HK) Co., Limited Bonase Electronics (HK) Co., Limited
Part Number:
290-1AB
Manufacturer:
WAK
Quantity:
380
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
Standard
P/N
217-36CT6
217-36CTT6
217-36CTR6
Material: Copper, Tin, Lead Plated
All other products, please contact factory for price, delivery, and minimums.
Board Level
Heat Sinks
MECHANICAL DIMENSIONS
217-36CT6
Height Above
.390 (9.9)
.390 (9.9)
.390 (9.9)
PC Board
in. (mm)
.600 (15.2) x .740 (18.8)
.600 (15.2) x .740 (18.8)
.600 (15.2) x .740 (18.8)
Dimensions
Footprint
in. (mm)
217 HEAT SINK WITH
DDPAK DEVICE
REEL DETAILS
SECTION A-A
KEY:
217 SERIES
Compatible with surface mount technology (SMT) automated production techniques for ease of assembly and a
variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area,
increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'
component thermal specifications.
FEATURES AND BENEFITS:
• No interface material is needed
• Copper with tin-lead plating for improved solderability and assembly
• Both the component and the heat sink are installed on the PC-board utilizing
• EIA standards and ESD protection are specified
• Can be used with water soluble or no clean SMT solder creams or other pastes
NOTES
3. 250 Pieces per Reel.
217-36CTR6
1. Material to be “ESD”
2. Approximately 6 Meters per Reel
standard SMT assembly equipment for ”Tape & Reel” and “Tube” formats
í
Tape & Reel
Package
Device only, NC
Format
Tube
Bulk
30
Surface Mount Heat Sinks
v
Device + HS, NC
Package
Quantity
250
20
1
125°C LEAD, 40°C AMBIENT
TAPE DETAILS
THERMAL PERFORMANCE
6 LAYER BOARD, D' PAK
Device + HS, 100 lfm
Device Power Dissipation. W
55°C @ 1W
55°C @ 1W
Convection
55°C @ 1W
Natural
Thermal Performance at Typical Load
„
Device + HS, 200 lfm
Dimensions: in.
D
2
PAK, TO-220, SOT-223, SOL-20
16.0°C/W @ 200 LFM
16.0°C/W @ 200 LFM
16.0°C/W @ 200 LFM
Convection)
Forced
Device + HS, 300 lfm
Normally stocked

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290-1AB Summary of contents

Page 1

Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Height Above Footprint Standard PC Board Dimensions P/N in. (mm) in. (mm) 217-36CT6 .390 (9.9) .600 (15.2) x .740 (18.8) 217-36CTT6 .390 (9.9) .600 (15.2) x .740 (18.8) 217-36CTR6 .390 ...

Page 2

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 217 SERIES Surface Mount Heat Sinks MECHANICAL DIMENSIONS 217 SERIES TUBE DETAILS TUBE: 16.25 Inches Long, Min. ESDMaterial with Nail Stops 20 Pieces per Tube 217-36CTT6 REF: JEDEC TO-263 (DD PAK) REF: JEDEC MO-169 ...

Page 3

Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 233 AND 236 SERIES Height Above Standard PC Board P/N in. (mm) 233-60AB .600 (15.2) 233-60AB-01 .600 (15.2) 233-60AB-05 .500 (12.7) 233-60AB-10 .725 (18.4) PATENT PENDING 236-150AB 1.500 (38.1) 236-150AB-01 ...

Page 4

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 235 SERIES Compact, Stress-Free Labor-Saving Locking-Tab Heat Sinks Height Above Standard PC Board P/N in. (mm) 235-85AB .850 (21.6) 235-85AB-01 .850 (21.6) 235-85AB-05 .500 (12.7) 235-85AB-10 .975 (24.8) PATENT 5381041 Material: Aluminum, Black Anodized ...

Page 5

Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 273 SERIES Low-Cost, Low-Height Wavesolderable Heat Sinks Height Above Standard PC Board P/N in. (mm) 273-AB .375 (9.5) 273-AB-01 .375 (9.5) 273-AB-02 .375 (9.5) Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS ...

Page 6

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 242 SERIES Low-Height, Low-Profile Twisted Fin Heat Sinks Height Above Standard PC Board P/N in. (mm) 242-125AB-22 1.285 (32.6) Material: Aluminum, Black Anodized 242-125AB-22 MECHANICAL DIMENSIONS 232 AND 238 SERIES Height Above Standard PC ...

Page 7

Board Level Heat Sinks BOARD LEVEL HEAT SINKS FOR TO-220, TO-218 AND M 244 SERIES Low Height, Slim Profile Wavesolderable Folded Fin Heat Sinks Height Above Standard PC Board P/N in. (mm) 244-145AB 1.450 (36.8) 244-145AB-50 1.650 (41.9) Material: Aluminum, ...

Page 8

BOARD LEVEL HEAT SINKS FOR TO-220, TO-218 AND M 247 SERIES Medium Height, Deep Profile Wavesolderable Folded Fin Heat Sinks Height Above Standard PC Board P/N in. (mm) 247-195AB 1.950 (49.5) 247-195AB-50 1.950 (49.5) Order SpeedClip™ 285SC or 330SC separately. ...

Page 9

Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 288 SERIES Compact Wave-Solderable Low-Cost Heat Sinks Standard P/N 288-1AB Mounting tabs are pre-tinned to ensure excellent wave-solder bond and good electrical connections for vertical mounting of TO-220 and TO-202 ...

Page 10

... Standard P/N 289-AB 0.500 (12.7) 289-AP 0.500 (12.7) 290-1AB 0.500 (12.7) 290-2AB 0.500 (12.7) Material: Aluminum, Black Anodized Low in cost and compact in overall dimensions, one 289 Series heat sink can accommodate one semiconductor; the 289 Series is available with a black anodized finish (289-AB) or with ...

Page 11

Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 250 SERIES High-Performance Slim Profile Heat Sinks With Integral Clips Height Above Standard PC Board P/N in. (mm) 250-122AB 1.220 (31.0) 250-122AB-09 1.220 (31.0) 250-122AB-25 1.380 (35.1) Material: Aluminum, Black ...

Page 12

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 286 SERIES Aluminum and Copper Low-Cost Wave-Solderable Heat Sinks Height Above Standard PC Board P/N in. (mm) 286-AB 1.190 (30.2) 286-CBT 1.190 (30.2) 286-CT 1.190 (30.2) Efficient heat removal at low cost can be ...

Page 13

... 0.557 (14.1) x 0.370 (9.4) hex. x 0.290 (7.4) 0.557 (14.1) x 0.370 (9.4) hex. x 0.290 (7.4) 0.0042 (1.91) 0.445 (11.3) x 0.370 (9.4) hex. x 0.290 (7.4) 0.607 (15.4) x 0.370 (9.4) hex. x 0.290 (7.4) 0.0039 (1.77) 0.607 (15.4) x 0.370 (9.4) hex. x 0.290 (7.4) 0.0043 (1.95) ...

Page 14

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 200 SERIES High-Efficiency Heat Sinks for Small Metal Can Power Semiconductors Single-Level Star 201, 202,204,205, 211 Series Available Semiconductor Heat Sink Standard P/N Case Diameter Inside Dia. & Finish Min/Max Types in. (mm) in. ...

Page 15

Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 634 SERIES Slim Profile Unidirectional Fin Vertical Mount Heat Sink Standard P/N Plain Pin 634-10ABP 634-15ABP 634-20ABP Material: Aluminum, Black Anodized. These slim profile unidirectional fin heat sinks offer users ...

Page 16

...

Page 17

Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 626 AND 627 SERIES Standard Standard P/N 626-10ABP 627-10ABP 626-15ABP 627-15ABP 626-20ABP 627-20ABP 626-25ABP 627-25ABP Wave-solderable pins. Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS Dimensions: in. (mm) 657 SERIES High-Performance Heat ...

Page 18

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 657 SERIES High-Performance Notched Heat Sinks for Vertical Board Mounting Standard P/N 657-10ABPN 657-15ABPN 657-20ABPN 657-25ABPN Wave-solderable pins. Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS Dimensions: in. (mm) 657 SERIES High-Performance Heat Sinks with SpeedClips™ ...

Page 19

Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 690 SERIES HIghest Efficiency/Lowest Unit Cost Heat Sinks Height Above Standard P/N 690-3B 1.310 (33.3) 690-66B 1.310 (33.3) 690-220B 1.310 (33.3) Material: Aluminum, Black Anodized These low-cost heat sinks provide ...

Page 20

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 601 AND 603 SERIES Standard Dimensions P/N 601E 2.000 (50.8) x 1.250 (31.8) 601F 2.000 (50.8) x 1.250 (31.8) 601K 2.000 (50.8) x 1.250 (31.8) 603K 2.000 (50.8) x 2.000 (50.8) Material: Aluminum Alloy, ...

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