D10650-40 Wakefield Thermal Solutions, D10650-40 Datasheet - Page 5

• Manufacturer Part Number: D10650-40
• Description: HEATSINK 100PQFP COMPOSITE
• Manufacturer: Wakefield Thermal Solutions

Specifications of D10650-40

• Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
• Attachment Method: Thermal Tape, Adhesive (Not Included)
• Outline: 16.51mm x 16.51mm
• Height: 0.4" (10.16mm)
• Power Dissipation @ Temperature Rise: 2W @ 40°C
• Thermal Resistance @ Forced Air Flow: 25°C/W @ 350 LFM
• Product: Heatsinks
• Mounting Style: Through Hole
• Heatsink Material: Plastic
• Fin Style: Pin
• Dimensions: 16.51 mm L x 10.16 mm W x 16.51 mm H
• Designed For: BGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Thermal Resistance @ Natural: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 345-1076; D1065040

HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs
Notes:
Notes:
L L
G
L
G G
I