S25FL032P0XMFI011 Spansion Inc., S25FL032P0XMFI011 Datasheet - Page 62

• Manufacturer Part Number: S25FL032P0XMFI011
• Description: IC 32M CMOS 3V 104MHZ SPI BUS INTERFACE
• Manufacturer: Spansion Inc.

Specifications of S25FL032P0XMFI011

• Cell Type: NOR
• Density: 32Mb
• Access Time (max): 8ns
• Interface Type: Serial (SPI)
• Boot Type: Bottom/Top
• Address Bus: 1b
• Operating Supply Voltage (typ): 3/3.3V
• Operating Temp Range: -40C to 85C
• Package Type: SOIC W
• Sync/async: Synchronous
• Operating Temperature Classification: Industrial
• Operating Supply Voltage (min): 2.7V
• Operating Supply Voltage (max): 3.6V
• Word Size: 8b
• Number Of Words: 4M
• Supply Current: 38mA
• Mounting: Surface Mount
• Pin Count: 8
• Lead Free Status / Rohs Status: Compliant

19.3
62
QUAD FLAT NO LEAD PACKAGES (UNE) - PLASTIC
SYMBOL
USON 8-contact (5 x 6 mm) No-Lead Package
ND
D2
E2
A1
e
N
L
b
D
E
A
K
0.55
0.35
3.90
3.30
0.45
0.00
MIN
0
DIMENSIONS
0.20 MIN.
1.27 BSC
5.00 BSC
6.00 BSC
NOM
0.60
0.40
4.00
3.40
0.50
0.02
---
8
4
MAX
0.65
0.45
4.10
3.50
0.55
0.05
12
NOTE
3
5
4
2
S25FL032P
NOTES:
5.
6.
7.
8.
9.
1. DIMENSIONING AND TOLERANCING CONFORMS TO
2. ALL DIMENSIONS ARE IN MILLIMETERS, 0 IS IN DEGREES.
3. N IS THE TOTAL NUMBER OF TERMINALS.
4. DIMENSION b APPLIES TO METALLIZED TERMINAL AND IS
D a t a
ASME Y14.5M-1994.
MEASURED BETWEEN 0.15 AND 0.30 mm FROM TERMINAL TIP.
IF THE TERMINAL HAS THE OPTIONAL RADIUS ON THE OTHER
END OF THE TERMINAL, THE DIMENSION b SHOULD NOT BE
MEASURED IN THAT RADIUS AREA.
ND REFERS TOT HE NUMBER OF TERMINALS ON D SIDE.
MAXIMUM PACKAGE WARPAGE IS 0.05 mm.
MAXIMUM ALLOWABLE BURRS IS 0.076 mm IN ALL DIRECTIONS.
PIN #1 ID ON TOP WILL BE LASER MARKED.
BILATERAL COPLANARITY ZONE APPLIES TO THE EXPOSED
HEAT SINK SLUG AS WELL AS THE TERMINALS.
S h e e t
S25FL032P_00_05 October 5, 2009
3448\ 16-038.28 \ 04.19.05