M36L0T7050B0ZAQF STMicroelectronics, M36L0T7050B0ZAQF Datasheet
M36L0T7050B0ZAQF
Specifications of M36L0T7050B0ZAQF
Related parts for M36L0T7050B0ZAQF
M36L0T7050B0ZAQF Summary of contents
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Bank, Multi-Level, Burst) Flash Memory FEATURES SUMMARY MULTI-CHIP PACKAGE – 1 die of 128Mbit (8Mx16, Multiple Bank, Multi-level, Burst) Flash Memory – 1 die of 32Mbit (2Mx16) Pseudo SRAM SUPPLY VOLTAGE – 1 DDF ...
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M36L0T7050T0, M36L0T7050B0 TABLE OF CONTENTS FEATURES SUMMARY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...
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Table 4. Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...
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M36L0T7050T0, M36L0T7050B0 SUMMARY DESCRIPTION The M36L0T7050T0 and M36L0T7050B0 com- bine two memory devices in a Multi-Chip Package: a 128-Mbit, Multiple Bank Flash memory, the M30L0T7000T0 or M30L0T7000B0, and a 32-Mbit PseudoSRAM, the M69AW048B. Recommended operating conditions do not allow more ...
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Figure 3. TFBGA Connections (Top view through package ...
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M36L0T7050T0, M36L0T7050B0 SIGNAL DESCRIPTIONS See Figure 2., Logic Diagram Names, for a brief overview of the signals connect this device. Address Inputs (A0-A22). Addresses are common inputs for the Flash Memory and the PSRAM components. The other lines ...
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I/O data bus. Write Enable (W ). The Write Enable trols the Bus Write operation of the memory. Upper Byte Enable (UB ). The Upper Byte En- P ...
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M36L0T7050T0, M36L0T7050B0 FUNCTIONAL DESCRIPTION The PSRAM and Flash memory components have separate power supplies but share the same grounds. They are distinguished by three Chip En- able inputs: E for the Flash memory and for the PSRAM. ...
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Table 2. Main Operating Modes Operation Flash Read Flash Write Flash Address Latch Flash Output ...
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... PAR 8Mb PAR 16Mb PAR 10/18 M30L0T7000(T/B)0 datasheet which is available from your local STMicroelectronics distributor. see the device, see the M69AW048B datasheet which is available from the internet site http://www.st.com Ta- or from your local STMicroelectronics distributor. Power-Down Configuration Data DQ8-DQ2 ...
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... Note: 1. Compliant with the JEDEC Std J-STD-020B (for small body, Sn- assembly), the ST ECOPACK and the European directive on Restrictions on Hazardous Substances (RoHS) 2002/95/EU. plied. Exposure to Absolute Maximum Rating con- ditions for extended periods may affect device reliability. Refer also to the STMicroelectronics SURE Program and other relevant quality docu- ments. Parameter ...
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M36L0T7050T0, M36L0T7050B0 DC AND AC PARAMETERS This section summarizes the operating measure- ment conditions, and the DC and AC characteris- tics of the device. The parameters in the DC and AC characteristics Tables that follow, are derived from tests performed ...
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Table 7. Flash DC Characteristics - Currents Symbol Parameter I Input Leakage Current LI I Output Leakage Current LO Supply Current Asynchronous Read (f=6MHz) Supply Current Synchronous Read (f=40MHz) I DD1 Supply Current Synchronous Read (f=50MHz) Supply Current I DD2 ...
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M36L0T7050T0, M36L0T7050B0 Table 8. Flash Memory DC Characteristics - Voltages Symbol Parameter V Input Low Voltage IL V Input High Voltage IH V Output Low Voltage OL V Output High Voltage Program Voltage-Logic PP1 PPF V V ...
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PACKAGE MECHANICAL Figure 7. Stacked TFBGA88 8x10mm - 8x10 active ball array, 0.8mm pitch, Bottom View Outline BALL "A1" FE FE1 Note: Drawing is not to scale. Table 10. Stacked TFBGA88 8x10mm - 8x10 active ball ...
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M36L0T7050T0, M36L0T7050B0 PART NUMBERING Table 11. Ordering Information Scheme Example: Device Type M36 = Multi-Chip Package (Flash + RAM) Flash 1 Architecture L = Multilevel, Multiple Bank, Burst mode Flash 2 Architecture Die Operating Voltage T = ...
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REVISION HISTORY Table 12. Document Revision History Date Version 29-Jul-2003 0.1 First Issue Document status promoted from Target Specification to full Datasheet. TFBGA88 package specifications updated, package fully compliant with the ST 10-Dec-2004 1.0 ECOPACK specification. Flash memory and PSRAM ...
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... No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics ...