K4S280832E-TC75 Samsung Semiconductor, K4S280832E-TC75 Datasheet - Page 3

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K4S280832E-TC75

Manufacturer Part Number
K4S280832E-TC75
Description
Manufacturer
Samsung Semiconductor
Type
SDRAMr
Datasheet

Specifications of K4S280832E-TC75

Organization
16Mx8
Density
128Mb
Address Bus
14b
Access Time (max)
6/5.4ns
Maximum Clock Rate
133MHz
Operating Supply Voltage (typ)
3.3V
Package Type
TSOP-II
Operating Temp Range
0C to 70C
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
Supply Current
110mA
Pin Count
54
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / RoHS Status
Not Compliant

Available stocks

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Part Number
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Quantity
Price
Part Number:
K4S280832E-TC75
Manufacturer:
SAMSUNG
Quantity:
5 300
Part Number:
K4S280832E-TC75
Manufacturer:
SAMSUNG
Quantity:
5 300
Part Number:
K4S280832E-TC75
Manufacturer:
SAMSUNG
Quantity:
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Part Number:
K4S280832E-TC75
Manufacturer:
SAMSUNG
Quantity:
50
SDRAM 128Mb E-die (x4, x8, x16)
8M x 4Bit x 4 Banks / 4M x 8Bit x 4 Banks / 2M x 16Bit x 4 Banks SDRAM
FEATURES
• JEDEC standard 3.3V power supply
• LVTTL compatible with multiplexed address
• Four banks operation
• MRS cycle with address key programs
• All inputs are sampled at the positive going edge of the system clock.
• Burst read single-bit write operation
• DQM (x4,x8) & L(U)DQM (x16) for masking
• Auto & self refresh
• 64ms refresh period (4K Cycle)
GENERAL DESCRIPTION
8,388,608 words by 4 bits / 4 x 4,194,304 words by 8 bits / 4 x 2,097,152 words by 16 bits, fabricated with SAMSUNG′s high perfor-
mance CMOS technology. Synchronous design allows precise cycle control with the use of system clock I/O transactions are possible
on every clock cycle. Range of operating frequencies, programmable burst length and programmable latencies allow the same device to
be useful for a variety of high bandwidth, high performance memory system applications.
Ordering Information
The K4S280432E / K4S280832E / K4S281632E is 134,217,728 bits synchronous high data rate Dynamic RAM organized as 4 x
-. CAS latency (2 & 3)
-. Burst length (1, 2, 4, 8 & Full page)
-. Burst type (Sequential & Interleave)
K4S281632E-TC(L)60/75
K4S280432E-TC(L)75
K4S280832E-TC(L)75
Part No.
Organization
32Mx4
16Mx8
8Mx16
Row & Column address configuration
Orgainization
32M x 4
16M x 8
8M x 16
Row Address
A0~A11
A0~A11
A0~A11
Max Freq.
133MHz
133MHz
166MHz
Column Address
A0-A9, A11
A0-A9
A0-A8
Interface
Rev. 1.4 February. 2004
LVTTL
LVTTL
LVTTL
CMOS SDRAM
54pin TSOP
54pin TSOP
54pin TSOP
Package

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