M25PE80-VMN6P NUMONYX, M25PE80-VMN6P Datasheet - Page 43

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M25PE80-VMN6P

Manufacturer Part Number
M25PE80-VMN6P
Description
Flash Mem Serial-SPI 3.3V 8M-Bit 1M x 8 8ns 8-Pin SOIC N Tray
Manufacturer
NUMONYX
Datasheet

Specifications of M25PE80-VMN6P

Package
8SOIC N
Cell Type
NOR
Density
8 Mb
Architecture
Sectored
Block Organization
Symmetrical
Typical Operating Supply Voltage
3.3 V
Sector Size
256Byte x 4096
Timing Type
Synchronous
Operating Temperature
-40 to 85 °C
Interface Type
Serial-SPI
Lead Free Status / RoHS Status
Compliant
M25PE80
6.15
Bulk erase (BE)
The bulk erase (BE) instruction sets all bits to ‘1’ (FFh). Before it can be accepted, a write
enable (WREN) instruction must previously have been executed. After the write enable
(WREN) instruction has been decoded, the device sets the write enable latch (WEL).
The bulk erase (BE) instruction is entered by driving Chip Select (S) Low, followed by the
instruction code on serial data input (D). Chip Select (S) must be driven Low for the entire
duration of the sequence.
The instruction sequence is shown in
Chip Select (S) must be driven High after the eighth bit of the instruction code has been
latched in, otherwise the bulk erase instruction is not executed. As soon as Chip Select (S)
is driven High, the self-timed bulk erase cycle (whose duration is t
bulk erase cycle is in progress, the status register may be read to check the value of the
write in progress (WIP) bit. The write in progress (WIP) bit is 1 during the self-timed bulk
erase cycle, and is 0 when it is completed. At some unspecified time before the cycle is
completed, the write enable latch (WEL) bit is reset.
Any bulk erase (BE) instruction, while an erase, program or write cycle is in progress, is
rejected without having any effects on the cycle that is in progress. A bulk erase (BE)
instruction is ignored if at least one sector or subsector is write-protected (Hardware or
software protection).
If Reset (Reset) is driven Low while a bulk erase (BE) cycle is in progress, the bulk erase
cycle is interrupted and data may not be erased correctly (see
a Reset Low
t
For the value of t
AC
Figure 21. Bulk erase (BE) instruction sequence
RHSL
parameters.
is then required before the device can be re-selected by driving Chip Select (S) Low.
pulse). On Reset going Low, the device enters the reset mode and a time of
RHSL
S
C
D
see
Table 26: Timings after a Reset Low pulse
0
Figure
1
2
Instruction
21.
3
4
5
6
7
Table 15: Device status after
AI03752D
BE
) is initiated. While the
in
Section 11: DC and
Instructions
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