MT29F2G16ABAEAWP-IT:E Micron Technology Inc, MT29F2G16ABAEAWP-IT:E Datasheet - Page 13

• Manufacturer Part Number: MT29F2G16ABAEAWP-IT:E
• Description: MICMT29F2G16ABAEAWP-IT:E 2G SLC NAND FLA
• Manufacturer: Micron Technology Inc

Specifications of MT29F2G16ABAEAWP-IT:E

• Lead Free Status / RoHS Status: Supplier Unconfirmed

Figure 6: 63-Ball VFBGA (10.5mm x 13mm)
PDF: 09005aef83b83f42
m69a_2gb_nand.pdf – Rev. H 09/10 EN
Solder ball material:
SAC305 (96.5% Sn,
3% Ag, 0.5% Cu).
Dimensions apply to
solder balls post-
reflow on Ø0.4 SMD
ball pads.
63X Ø0.45
Seating
plane
0.12 A
8.8 CTR
0.8 TYP
A
Note:
10
1. All dimensions are in millimeters.
9
8
7
10.5 ±0.1
7.2 CTR
0.8 TYP
6
5
4
3
2
1
13
A
B
C
D
E
F
G
H
J
K
L
M
0.65 ±0.05
13 ±0.1
Ball A1 ID
Bottom side saw fiducials may or
may not be covered with soldermask.
Micron Technology, Inc. reserves the right to change products or specifications without notice.
2Gb: x8, x16 NAND Flash Memory
0.25 MIN
1.0 MAX
Ball A1 ID
Package Dimensions
© 2009 Micron Technology, Inc. All rights reserved.