MT9JSF12872PY-1G1D1 Micron Technology Inc, MT9JSF12872PY-1G1D1 Datasheet

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MT9JSF12872PY-1G1D1

Manufacturer Part Number
MT9JSF12872PY-1G1D1
Description
Manufacturer
Micron Technology Inc
Datasheet

Specifications of MT9JSF12872PY-1G1D1

Main Category
DRAM Module
Sub-category
DDR3 SDRAM
Module Type
240RDIMM
Device Core Size
72b
Organization
128Mx72
Total Density
1GByte
Chip Density
1Gb
Maximum Clock Rate
1.066GHz
Operating Supply Voltage (typ)
1.5V
Operating Current
1.98A
Number Of Elements
9
Operating Supply Voltage (max)
1.575V
Operating Supply Voltage (min)
1.425V
Operating Temp Range
0C to 70C
Operating Temperature Classification
Commercial
Pin Count
240
Mounting
Socket
Lead Free Status / RoHS Status
Compliant
DDR3 SDRAM RDIMM
MT9JSF12872PY – 1GB
Features
• DDR3 functionality and operations supported as
• 240-pin, registered dual in-line memory module
• Fast data transfer rates: PC3-10600, PC3-8500, or
• 1GB (128 Meg x 72)
• V
• V
• Supports ECC error detection and correction
• Nominal and dynamic on-die termination (ODT) for
• Single rank
• On-board I
• 8 internal device banks
• Fixed burst chop (BC) of 4 and burst length (BL) of 8
• Gold edge contacts
• Lead-free
• Fly-by topology
• Terminated control, command, and address bus
Table 1: Key Timing Parameters
PDF: 09005aef829eedac
Rev. B 06/09
Speed
Grade
defined in the component data sheet
(RDIMM)
PC3-6400
data, strobe, and mask signals
serial presence-detect (SPD) EEPROM
via the mode register set (MRS)
-1G6
-1G4
-1G1
-1G0
-80C
-80B
DD
DDSPD
= 1.5V ±0.075V
= +3.0V to +3.6V
Nomenclature
PC3-12800
PC3-10600
2
Industry
PC3-8500
PC3-8500
PC3-6400
PC3-6400
C temperature sensor with integrated
Products and specifications discussed herein are subject to change by Micron without notice.
CL = 11 CL = 10
1600
1333
1333
CL = 9
1333
1333
1GB (x72, ECC, SR) 240-Pin DDR3 SDRAM RDIMM
Data Rate (MT/s)
CL = 8
1066
1066
1066
1066
1
Figure 1: 240-Pin RDIMM (MO-269 R/C A)
Module height: 30.0mm (1.18in)
Options
• Operating temperature
• Package
• Frequency/CAS latency
Notes:
– Commercial (0°C ≤ T
– Industrial (–40°C ≤ T
– 240-pin DIMM (lead-free)
– 1.25ns @ CL = 11 (DDR3-1600)
– 1.5ns @ CL = 9 (DDR3-1333)
– 1.87ns @ CL = 7 (DDR3-1066)
– 1.87ns @ CL = 8 (DDR3-1066)
– 2.5ns @ CL = 5 (DDR3-800)
– 2.5ns @ CL = 6 (DDR3-800)
CL = 7
1066
1066
1066
Micron Technology, Inc. reserves the right to change products or specifications without notice.
1. Contact Micron for industrial temperature
2. Not recommended for new designs.
CL = 6
module offerings.
800
800
800
800
800
800
CL = 5
667
667
667
667
800
667
1
A
A
≤ +85°C)
≤ +70°C)
©2007 Micron Technology, Inc. All rights reserved.
13.125
13.125
13.125
t
(ns)
12.5
RCD
15
15
2
2
2
13.125
13.125
13.125
(ns)
12.5
t
15
15
RP
Features
Marking
48.125
49.125
50.625
(ns)
52.5
52.5
None
t
-1G6
-1G4
-1G1
-1G0
-80C
-80B
50
RC
Y
I

Related parts for MT9JSF12872PY-1G1D1

MT9JSF12872PY-1G1D1 Summary of contents

Page 1

... DDR3 SDRAM RDIMM MT9JSF12872PY – 1GB Features • DDR3 functionality and operations supported as defined in the component data sheet • 240-pin, registered dual in-line memory module (RDIMM) • Fast data transfer rates: PC3-10600, PC3-8500, or PC3-6400 • 1GB (128 Meg x 72) • 1.5V ±0.075V DD • ...

Page 2

... The data sheet for the base device can be found on Micron’s Web site. Notes: 2. All part numbers end with a two-place code (not shown) that designates component and PCB revisions. Consult factory for current revision codes. Example: MT9JSF12872PY-1G4D1. PDF: 09005aef829eedac Rev. B 06/09 ...

Page 3

Pin Assignments and Descriptions Table 4: Pin Assignments 240-Pin DDR3 RDIMM Front Pin Symbol Pin Symbol Pin Symbol Pin Symbol DQ25 61 REFDQ DQ0 33 DQS3 DQ1 ...

Page 4

Table 5: Pin Descriptions Symbol Type Description A[15:0] Input Address inputs: Provide the row address for ACTIVATE commands, and the column ad- dress and auto precharge bit (A10) for READ/WRITE commands, to select one location out of the memory array ...

Page 5

... Termination voltage: Used for control, command, and address (V TT – connect: These pins are not connected on the module. – function: Connected within the module, but provides no functionality. PDF: 09005aef829eedac Rev. B 06/09 1GB (x72, ECC, SR) 240-Pin DDR3 SDRAM RDIMM Pin Assignments and Descriptions and ...

Page 6

Functional Block Diagram Figure 2: Functional Block Diagram RS0# DQS0 DQS0# DM0/DQS9 DQS9# DM/ TDQS# CS# DQS DQS# TDQS DQ0 DQ DQ1 DQ DQ2 DQ U12 DQ3 DQ DQ4 DQ DQ5 DQ DQ6 DQ DQ7 DQS1 ...

Page 7

... DRAM core and eight corresponding n-bit-wide, one-half-clock-cycle data trans- fers at the I/O pins. DDR3 modules use two sets of differential signals: DQS, DQS# to capture data and CK and CK# to capture commands, addresses, and control signals. Differential clocks and data strobes ensure exceptional noise immunity for these signals and provide precise crossing points to capture input signals ...

Page 8

... TSE2002av, Serial Presence Detect with Temperature Sensor.” Serial Presence-Detect EEPROM Operation DDR3 SDRAM modules incorporate serial presence-detect. The SPD data is stored in a 256-byte EEPROM. The first 128 bytes are programmed by Micron to comply with JE- DEC standard JC-45 “Appendix X: Serial Presence Detect (SPD) for DDR3 SDRAM Modules.” ...

Page 9

... Electrical Specifications Stresses greater than those listed may cause permanent damage to the module. This is a stress rating only, and functional operation of the module at these or any other condi- tions outside those indicated in each device’s data sheet is not implied. Exposure to absolute maximum rating conditions for extended periods may adversely affect reliability. ...

Page 10

... Component specifications are available on Micron’s Web site. Module speed grades cor- relate with component speed grades, as shown below. Table 8: Module and Component Speed Grades DDR3 components may exceed the listed module speed grades; module may not be available in all listed speed grades Module Speed Grade -1G6 ...

Page 11

I Specifications DD Table 9: DDR3 I Specifications and Conditions – 1GB DD Values are for the MT41J128M8 DDR3 SDRAM only and are computed from values specified in the 1Gb (128 Meg x 8) component data sheet Parameter Operating current ...

Page 12

... RESET#, MIRROR 0.65 × V RESET#, MIRROR CK, CK#, FBIN, FBIN# 0.5 × V CK, CK# Err_Out# Err_Out# tion of the DDR3 SDRAM RDIMMs. These are meant subset of the parameters for the specific device used on the module. 12 Min Nom Max 1.425 1.5 1.575 - 20mV 0.5 × V 0.51 × ...

Page 13

... Temperature Sensor with Serial Presence-Detect EEPROM The temperature sensor continuously monitors the module’s temperature and can be read back at any time over the I Table 11: Temperature Sensor with Serial Presence-Detect EEPROM Operating Conditions Parameter/Condition Supply voltage Supply current 3.3V DD Input high voltage: Logic 1; SCL, SDA Input low voltage: Logic 0 ...

Page 14

The interrupt mode enables software to reset EVENT# after a critical temperature thresh- old has been detected. Threshold points are set in the configuration register by the user. This mode triggers the critical temperature limit and both the MIN and ...

Page 15

Figure 3: EVENT# Pin Functionality Critical Alarm window (MAX) Alarm window (MIN) EVENT# interrupt mode EVENT# comparator mode EVENT# critical temperature only mode Table 13: Temperature Sensor Registers Name Pointer register Capability register Configuration register Alarm temperature upper boundary register ...

Page 16

Table 14: Pointer Register Bits 0– Table 15: Pointer Register Bits 0–2 Descriptions Capability Register The capability register indicates the features and functionality supported by the temper- ature sensor. ...

Page 17

Table 17: Capability Register Bit Description (Continued) Bit Description 4:3 Temperature resolution 00: 0.5°C LSB 01: 0.25°C LSB 10: 0.125°C LSB 11: 0.0625°C LSB 15:5 0: Must be set to zero Configuration Register Table 18: Configuration Register (Address: 0x01) 15 ...

Page 18

Table 19: Configuration Register Bit Descriptions (Continued) Bit Description 6 Alarm window lock bit 0: Alarm trips are not locked and can be changed 1: Alarm trips are locked and cannot be changed 7 Critical trip lock bit 0: Critical ...

Page 19

Figure 4: Hysteresis Applied to Temperature Around Trip Points Below window bit Above window bit 1. T Notes Hyst is the value set in the hysteresis bits of the configuration register. Table 20: Hysteresis Applied to Alarm ...

Page 20

Temperature Trip Point Registers The upper and lower temperature boundary registers are used to set the maximum and minimum values of the alarm window. LSB for these registers is 0.25°C. All RFU bits in the register will always report zero. ...

Page 21

Table 24: Temperature Register (Address: 0x05 Above Above Below MSB critical alarm alarm trip window window Table 25: Temperature Register Bit Descriptions Bit Description 13 Below alarm window 0: Temperature is equal to or above the lower ...

Page 22

... BACK VIEW U10 U11 5.0 (0.197) TYP 71.0 (2.79) 47.0 (1.85) TYP times occur. 22 Micron Technology, Inc. reserves the right to change products or specifications without notice. Module Dimensions U6 23.3 (0.92) TYP 17.3 (0.68) TYP 9.5 (0.374) TYP TYP Pin 120 3.1 (0.122) 2X TYP U12 3 ...

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