CS1311/NOPB National Semiconductor, CS1311/NOPB Datasheet
CS1311/NOPB
Specifications of CS1311/NOPB
Related parts for CS1311/NOPB
CS1311/NOPB Summary of contents
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... Smart Card National Semiconductor is a registered trademark of National Semiconductor Corporation. Geode is a trademark of National Semiconductor Corporation. For a complete listing of National Semiconductor trademarks, please visit www.national.com/trademarks. © 2002 National Semiconductor Corporation coprocessor’s task of decoding media that can cause stut- tering of sound or interruptions in the video. ...
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Features General Features Physical — Process 0.25-micron CMOS — Packaged in a 292-terminal TEPBGA (Thermally Enhanced Plastic Ball Grid Array) Power supply: — CS1301: 2.5V Core; 3.3V I/O (5V tolerant) — CS1311: 2.2V Core; 3.3V I/O (5V tolerant) Consumption 1300 ...
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System Architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...
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... National CS1301/ CS1311 solution. National is providing the device as part of a complete solution and supporting these target solutions only. Refer to the document titled “CS1301/CS1311 Multi- Media Companion: System Architecture and Software Solution” for the National Semiconductor supported solu- tion. AMP LM4880 Codec ...
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... PCI_INTD# ACCESS.bus IIC-SDA Interface IIC-SCL *Video In and Audio In are supported by third party software solutions, not by the National Semiconductor solution. Revision 2.3 nected; all pins that drive a clock should drive a series resistor. Table 2-1 shows the types of I/O circuits used by the CS1301/CS1311 devices. Note that the # symbol in a sig- nal name indicates that the active or asserted state occurs when the signal low voltage level ...
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A PAD23 PIDSEL PAD24 PAD27 PAD28 PAD31 PCIID# PCIIB# B PAD20 PAD19 PCBE3# PAD26 PGT# PAD30 PRQ# PCIIC# C PAD18 PAD21 PAD22 PAD25 PAD16 PCBE#2 PAD17 PIRD# ...
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Table 2-2. Ball Assignment Sorted by Ball Number Ball No. Signal Name Type A1 PCI_AD23 I/O A2 PCI_IDSEL I A3 PCI_AD24 I/O A4 PCI_AD27 I/O A5 PCI_AD28 I/O A6 PCI_AD31 I/O A7 PCI_INTD# I/OD A8 PCI_INTB# I/O/OD A9 SSI_IO1 I ...
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Table 2-2. Ball No. Signal Name Type L9 V GND SS L10 V GND SS L11 V GND SS L12 V GND SS L13 V GND SS L17 V PWR CC L18 V PWR CC L19 V GND SSQ L20 ...
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Table 2-3. Ball Assignment Sorted Alphabetically by Signal Name Signal Name Ball No. Signal Name AI_OSCLK B15 MM_DQ11 AI_SCK A16 MM_DQ12 AI_SD C15 MM_DQ13 AI_WS B16 MM_DQ14 AO_OSCLK B14 MM_DQ15 AO_SCK A14 MM_DQ16 AO_SD1 B13 MM_DQ17 AO_SD2 A13 MM_DQ18 AO_SD3 ...
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SIGNAL DESCRIPTIONS 2.2.1 System Interface Signals Ball Signal Name No. TRI_CLKIN L20 TRI_USERIRQ G20 TRI_TIMER_CLK H19 TRI_RESET# G19 VREF_PCI F2 VREF_PERIPH C18 2.2.2 Memory Interface Signals Ball Signal Name No. MM_CLK0 Y10 MM_CLK1 W10 www.national.com Type Description I Main ...
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Memory Interface Signals (Continued) Ball Signal Name No. MM_A[13:00] See Table 2-3 "Ball Assign- ment Sorted Alphabeti- cally by Signal Name" on page 9 MM_DQ[31:00] See Table 2-3 "Ball Assign- ment Sorted Alphabeti- cally by Signal Name" on page ...
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PCI Interface Signals (Continued) Ball Signal Name No. PCI_AD[31:00] See Table 2-3 "Ball Assign- ment Sorted Alphabeti- cally by Signal Name" on page 9 PCI_C/BE0# M3 PCI_C/BE1# J3 PCI_C/BE2# D2 PCI_C/BE3# B3 PCI_PAR H1 PCI_FRAME# E2 PCI_IRDY# E1 PCI_TRDY# ...
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Video In Interface Signals Ball Signal Name No. VI_CLK C20 VI_DVALID A17 VI_DATA[07:00] B18, C17, A19, A20, B19, B20, C19, D18 VI_DATA[09:08] B17, A18 Note: Video In and Audio In are supported by third party software solutions, not by ...
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Video Out Interface Signals (Continued) Ball Signal Name No. VO_IO2 H20 VO_DATA[07:00] K20, K12, M20, M19, M18, N20, N19, P20 2.2.6 Audio In Interface Signals Ball Signal Name No. AI_OSCLK B15 AI_SCK A16 AI_SD C15 AI_WS B16 Note: The ...
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Audio Out Interface Signals Ball Signal Name No. AO_OSCLK B14 AO_SCK A14 AO_SD1 B13 AO_SD2 A13 AO_SD3 C12 AO_SD4 B12 AO_WS A15 Note: The AO module always acts as sender, but can be master or slave for D/A timing. ...
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JTAG Interface Signals Ball Signal Name No. JTAG_TDI F20 JTAG_TDO F18 JTAG_TCK F19 JTAG_TMS E20 2.2.11 Test and Measurement Interface Signals Ball Signal Name No. BOOT_CLK T20 TESTMODE P19 SCANCPU D20 2.2.12 Synchronous Serial Interface (SSI) Ball Signal Name ...
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Power, Ground, and No Connections (Continued) Ball Signal Name No. V L19 SSQ V See Table DD 2-3 "Ball Assign- ment Sorted Alphabeti- cally by Signal Name" on page 9 V See Table CC 2-3 "Ball Assign- ment Sorted ...
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REFERENCE VOLTAGES Outputs always drive to a level determined by the 3.3V I/O voltage, with the exception of Open Drain mode outputs. VREF_PCI Determined Mode PCI_AD00 PCI_AD27 TRI_USERIRQ PCI_AD01 PCI_AD28 TRI_TIMER_CLK PCI_AD02 PCI_AD29 JTAG_TDI PCI_AD03 PCI_AD30 JTAG_TDO PCI_AD04 PCI_AD31 ...
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Package Specifications Figure 3-1 provides the mechanical package outline for the 292-Terminal TEPBGA (Thermally Enhanced Ball Grid Array) package. NOTES: UNLESS OTHERWISE SPECIFIED. 1) SOLDER BALL COMPOSITION: SN 63%, PB 37%. 2) DIMENSION IS MEASURED AT THE MAXIMUM SOLDER ...
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Appendix A Support Documentation A.1 ORDERING INFORMATION Order Number (NSID) Part Marking CS1301 CS1301 CS1311 CS1311 Note: Due to licensing agreements, the CS1301/CS1311 can only be purchased by those customers using a Geode processor-based design. A.2 PRODUCT BRIEF REVISION HISTORY ...
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