CS1311/NOPB National Semiconductor, CS1311/NOPB Datasheet - Page 19

• Manufacturer Part Number: CS1311/NOPB
• Manufacturer: National Semiconductor

Specifications of CS1311/NOPB

• Operating Temperature (max): 85C
• Operating Temperature (min): 0C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Lead Free Status / RoHS Status: Compliant

Revision 2.3
3.0
Figure 3-1 provides the mechanical package outline for the 292-Terminal TEPBGA (Thermally Enhanced Ball Grid Array)
package.
NOTES: UNLESS OTHERWISE SPECIFIED.
1)
2)
3)
4)
SOLDER BALL COMPOSITION: SN 63%, PB 37%.
DIMENSION IS MEASURED AT THE MAXIMUM SOLDER BALL DIAMETER, PARALLEL TO PRIMARY DATUM N.
THE MOLD SURFACE AREA MAY INCLUDE DIMPLE FOR A1 BALL CORNER IDENTIFICATION.
REFERENCE JEDEC REGISTRATION MS-034, VARIATION BAL-1.
Package Specifications
Figure 3-1. 292-Terminal TEPBGA (Body Size: 27x27x2.33 mm; Pitch: 1.27 mm)
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