PCA9600DP-T NXP Semiconductors, PCA9600DP-T Datasheet - Page 24

PCA9600DP-T

Manufacturer Part Number
PCA9600DP-T
Description
Manufacturer
NXP Semiconductors
Datasheet

Specifications of PCA9600DP-T

Operating Temperature (max)
85C
Operating Temperature (min)
-40C
Package Type
TSSOP
Pin Count
8
Mounting
Surface Mount
Lead Free Status / RoHS Status
Compliant
NXP Semiconductors
Fig 27. Package outline SOT505-1 (TSSOP8)
PCA9600_4
Product data sheet
TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
UNIT
mm
VERSION
OUTLINE
SOT505-1
max.
1.1
A
0.15
0.05
A 1
1
0.95
0.80
8
A 2
y
pin 1 index
IEC
e
Z
0.25
A 3
D
0.45
0.25
b p
b p
5
4
0.28
0.15
JEDEC
c
0
w
REFERENCES
Rev. 04 — 11 November 2009
M
D
3.1
2.9
(1)
E
3.1
2.9
(2)
c
JEITA
scale
0.65
2.5
A 2
e
A 1
H E
5.1
4.7
0.94
L
5 mm
H E
E
detail X
0.7
0.4
L p
L
0.1
v
L p
PROJECTION
EUROPEAN
Dual bidirectional bus buffer
0.1
A
w
(A 3 )
0.1
X
y
v
A
M
PCA9600
0.70
0.35
Z
© NXP B.V. 2009. All rights reserved.
A
(1)
ISSUE DATE
99-04-09
03-02-18
6
0
SOT505-1
24 of 30

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